Patents by Inventor Chia-Wei Chu
Chia-Wei Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12009294Abstract: In some embodiments, the present disclosure relates to an integrated circuit device. A transistor structure includes a gate electrode separated from a substrate by a gate dielectric and a pair of source/drain regions disposed within the substrate on opposite sides of the gate electrode. A lower conductive plug is disposed through a lower inter-layer dielectric (ILD) layer and contacting a first source/drain region. A capping layer is disposed directly on the lower conductive plug. An upper inter-layer dielectric (ILD) layer is disposed over the capping layer and the lower ILD layer. An upper conductive plug is disposed through the upper ILD layer and directly on the capping layer.Type: GrantFiled: July 28, 2022Date of Patent: June 11, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Wei Chang, Sung-Li Wang, Yi-Ying Liu, Chia-Hung Chu, Fang-Wei Lee
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Patent number: 12002709Abstract: The present disclosure provides an interconnect structure, including a first metal line, a second metal line spaced away from the first metal line, a conductive contact over the first metal line, including a first portion, a second portion over the first portion, wherein a bottom width of the second portion is greater than a top width of the first portion, wherein a shortest distance between the second portion and the second metal line is in a range from 50 Angstrom to 200 Angstrom, and a third portion over the second portion, wherein a bottom width of the third portion is greater than a top width of the second portion, the entire first portion and the entire second portion are under a coverage of a vertical projection area of the third portion, a first layer, and a second layer over the first layer.Type: GrantFiled: August 27, 2021Date of Patent: June 4, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Hsiang-Wei Liu, Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang
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Publication number: 20240161969Abstract: A planar magnetic component is arranged on a circuit board of a resonant converter, and the resonant converter includes a primary-side circuit and a secondary-side circuit. The planar magnetic component includes an inductor trace, an inductor iron core, and a current transformer trace. The inductor trace is arranged on the primary-side circuit and formed one layer board of the circuit board to serve as a resonant inductor coupled to the primary-side circuit. The inductor iron core includes a core pillar, and the core pillar penetrates a through hole of the circuit board, and the inductor trace surrounds the through hole. The current transformer trace is formed on the circuit board to serve as a current transformer coil coupled to the resonant inductor. The current transformer trace surrounds the through hole to form a common-core structure that shares the inductor iron core.Type: ApplicationFiled: November 13, 2023Publication date: May 16, 2024Inventors: Yi-Hsun CHIU, Yi-Sheng CHANG, Chien-An LAI, Chia-Wei CHU
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Publication number: 20240162833Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.Type: ApplicationFiled: November 13, 2023Publication date: May 16, 2024Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
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Patent number: 11972974Abstract: An IC structure includes a transistor, a source/drain contact, a metal oxide layer, a non-metal oxide layer, a barrier structure, and a via. The transistor includes a gate structure and source/drain regions on opposite sides of the gate structure. The source/drain contact is over one of the source/drain regions. The metal oxide layer is over the source/drain contact. The non-metal oxide layer is over the metal oxide layer. The barrier structure is over the source/drain contact. The barrier structure forms a first interface with the metal oxide layer and a second interface with the non-metal oxide layer, and the second interface is laterally offset from the first interface. The via extends through the non-metal oxide layer to the barrier structure.Type: GrantFiled: January 13, 2022Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Sung-Li Wang, Shuen-Shin Liang, Yu-Yun Peng, Fang-Wei Lee, Chia-Hung Chu, Mrunal Abhijith Khaderbad, Keng-Chu Lin
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Publication number: 20240125771Abstract: The present invention relates to a reaction platform, which comprises: a machine body with a bottom plate for placing non-porous substrates; and a coater module configured on the top of the machine body and capable of maintaining a preset of a predetermined height for moving along the surface of non-porous substrate, wherein the coater module has one or more slits, and a target liquid can be directly injected or sucking in from the outside of the coater module through the slit, and spreading the target liquid onto a surface of the non-porous substrate while moving along the non-porous substrate; wherein the surface of the non-porous substrate has a target to be coated. The reaction platform of the present invention can not only save time, labor and cost, but also have accurate and reproducible experimental results, showing better results than traditional methods.Type: ApplicationFiled: July 25, 2023Publication date: April 18, 2024Inventors: An-Bang Wang, Shih-Yu Chen, Tung-Hung Su, Chia-Chi Chu, Chia-Chien Yen, Yu-Wei Chiang
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Patent number: 11947886Abstract: A development system and a method of an offline software-in-the-loop simulation are disclosed. A common firmware architecture generates a chip control program. The common firmware architecture has an application layer and a hardware abstraction layer. The application layer has a configuration header file and a product program. A processing program required by a peripheral module is added to the hardware abstraction layer during compiling. The chip control program is provided to a controller chip or a circuit simulation software to be executed to control the product-related circuit through controlling the peripheral module.Type: GrantFiled: June 28, 2022Date of Patent: April 2, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yu-Jen Lin, Chang-Chung Lin, Chia-Wei Chu, Terng-Wei Tsai, Feng-Hsuan Tung
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Publication number: 20240096998Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
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Publication number: 20240088650Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Li-Wei Chu, Tao Yi Hung, Chia-Hui Chen, Wun-Jie Lin, Jam-Wem Lee
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Publication number: 20230009172Abstract: A development system and a method of an offline software-in-the-loop simulation are disclosed. A common firmware architecture generates a chip control program. The common firmware architecture has an application layer and a hardware abstraction layer. The application layer has a configuration header file and a product program. A processing program required by a peripheral module is added to the hardware abstraction layer during compiling. The chip control program is provided to a controller chip or a circuit simulation software to be executed to control the product-related circuit through controlling the peripheral module.Type: ApplicationFiled: June 28, 2022Publication date: January 12, 2023Inventors: Yu-Jen LIN, Chang-Chung LIN, Chia-Wei CHU, Terng-Wei TSAI, Feng-Hsuan TUNG
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Publication number: 20050059720Abstract: The present invention relates to pharmaceutical compositions, which contain a HMG-CoA reductase inhibitor selected from the group consisting of pravastatin, simvastatin, lovastatin, pitavastatin and ZD-4522 and an angiotensin II receptor antagonist and optionally further contain a calcium channel blocker. The compositions are for prevention or treatment of cardiac failure.Type: ApplicationFiled: October 29, 2004Publication date: March 17, 2005Applicant: SANKYO COMPANY, LIMITEDInventors: Tsung Lee, Bai-Ching Lee, Shen-Fang Su, Chia-Ling Hsiao, Chia-Wei Chu
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Publication number: 20030181500Abstract: The present invention relates to pharmaceutical compositions, which contain a HMG-CoA reductase inhibitor selected from the group consisting of pravastatin, simvastatin, lovastatin, pitavastatin and ZD-4522 and an angiotensin II receptor antagonist and optionally further contain a calcium channel blocker. The compositions are for prevention or treatment of cardiac failure.Type: ApplicationFiled: February 26, 2003Publication date: September 25, 2003Applicant: SANKYO COMPANY, LIMITEDInventors: Tsung Ming Lee, Bai-Ching Lee, Shen-Fang Su, Chia-Ling Hsiao, Chia-Wei Chu