Patents by Inventor Chia-Wei Hong

Chia-Wei Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079364
    Abstract: Die structures and methods of forming the same are described. In an embodiment, a device includes: a lower integrated circuit die; a first upper integrated circuit die face-to-face bonded to the lower integrated circuit die, the first upper integrated circuit die including a first semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first upper integrated circuit die, a top surface of the gap-fill dielectric being substantially coplanar with a top surface of the first semiconductor substrate and with a top surface of the first through-substrate via; and an interconnect structure including a first dielectric layer and first conductive vias, the first dielectric layer disposed on the top surface of the gap-fill dielectric and the top surface of the first semiconductor substrate, the first conductive vias extending through the first dielectric layer to contact the top surface of the first through-substrate via.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 7, 2024
    Inventors: Chia-Hao Hsu, Jian-Wei Hong, Kuo-Chiang Ting, Sung-Feng Yeh
  • Publication number: 20240079391
    Abstract: In an embodiment, a device includes: a first integrated circuit die comprising a semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first integrated circuit die, a surface of the gap-fill dielectric being substantially coplanar with an inactive surface of the semiconductor substrate and with a surface of the first through-substrate via; a dielectric layer on the surface of the gap-fill dielectric and the inactive surface of the semiconductor substrate; a first bond pad extending through the dielectric layer to contact the surface of the first through-substrate via, a width of the first bond pad being less than a width of the first through-substrate via; and a second integrated circuit die comprising a die connector bonded to the first bond pad.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Inventors: Chia-Hao Hsu, Jian-Wei Hong, Kuo-Chiang Ting, Sung-Feng Yeh
  • Patent number: 9737607
    Abstract: A polymer and a pharmaceutical composition employing the same are disclosed. The polymer includes a first repeating unit, a second repeating unit, and a third repeating unit. In particular, the first repeating unit is the second repeating unit is wherein R1 is C1-6 alkyl group; and the third repeating unit is wherein X is and Y is a hydrophilic polymeric moiety.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: August 22, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-Hsiang Chen, Yu-Hua Chen, Chia-Chen Tsai, Tse-Min Teng, Ting-Yu Shih, Chia-Chun Wang, Chia-wei Hong, Jennline Sheu, Hui-Ling Cheng, Shu-Feng Chen, Hung-Jui Huang, Shu-Ling Wang
  • Publication number: 20160184437
    Abstract: A polymer and a pharmaceutical composition employing the same are disclosed. The polymer includes a first repeating unit, a second repeating unit, and a third repeating unit. In particular, the first repeating unit is the second repeating unit is wherein R1 is C1-6 alkyl group; and the third repeating unit is wherein X is and Y is a hydrophilic polymeric moiety.
    Type: Application
    Filed: December 24, 2015
    Publication date: June 30, 2016
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-Hsiang Chen, Yu-Hua Chen, Chia-Chen Tsai, Tse-Min Teng, Ting-Yu Shih, Chia-Chun Wang, Chia-wei Hong, Jennline Sheu, Hui-Ling Cheng, Shu-Feng Chen, Hung-Jui Huang, Shu-Ling Wang
  • Publication number: 20150321399
    Abstract: A component for manufacturing an apparel accessory or a fastening element is formed of a molten thermoplastic polymer and an additive distributed into the molten thermoplastic polymer. A method of manufacturing said apparel accessory or said fastening element made of said component includes a step of fixedly molding the component of the present invention to a base of an accessory. A molded product made of said component is well decorative and highly durable.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 12, 2015
    Inventors: Chia-Wei HONG, Chia-Hong LIAO
  • Patent number: 8968765
    Abstract: The present disclosure provides a brush polymer, including: a linear polymer main chain; and brush structural side chains, including: a hydrophobic molecular branch, and a hydrophilic molecular branch and/or an anti-biofilm/or an anti-microbial molecular branch, wherein the linear polymer main chain is conjugated to the side chains by covalent bonds formed between a hydroxyl group and a reactive functional group, wherein the reactive functional group includes: isocyanate, carboxyl, or epoxy. The present disclosure also provides a medical application of the brush polymer.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: March 3, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Jui-Hsiang Chen, Jean-Dean Yang, Yu-Hua Chen, Ting-Yu Shih, Chia-wei Hong, Chao-Chen Tien
  • Publication number: 20130149542
    Abstract: The present disclosure provides a brush polymer, including: a linear polymer main chain; and brush structural side chains, including: a hydrophobic molecular branch, and a hydrophilic molecular branch and/or an anti-biofilm/or an anti-microbial molecular branch, wherein the linear polymer main chain is conjugated to the side chains by covalent bonds formed between a hydroxyl group and a reactive functional group, wherein the reactive functional group includes: isocyanate, carboxyl, or epoxy. The present disclosure also provides a medical application of the brush polymer.
    Type: Application
    Filed: August 27, 2012
    Publication date: June 13, 2013
    Inventors: Jui-Hsiang CHEN, Jean-Dean Yang, Yu-Hua Chen, Ting-Yu Shih, Chia-Wei Hong, Chao-Chen Tien