Abstract: An optical system is provided, including a first module configured to hold a first optical member. The first module includes a first movable portion, a first fixed portion, and a first driving assembly. The first movable portion is configured to connect the first optical member, and is movable relative to the fixed portion. The first driving assembly is configured to drive the first movable portion to move relative to the fixed portion.

Abstract: An optical system that includes a first module is provided. The first module includes a first movable portion, a first fixed portion, and a first driving assembly. The first movable portion is configured to connect the first optical member, and is movable relative to the first fixed portion. The first driving assembly is configured to drive the first movable portion to move relative to the first fixed portion.

Abstract: Provided are a package structure and a method of forming the same. The method includes: forming an interconnect structure on a substrate; performing a laser grooving process to form a first opening in the interconnect structure and form a debris layer on a sidewall of the first opening in a same step; forming a protective layer to fill in the first opening and cover the debris layer and the interconnect structure; patterning the protective layer to form a second opening, wherein the second opening is spaced from the debris layer by the protective layer; performing a planarization process on the protective layer to expose a topmost contact pad of the interconnect structure; and performing a mechanical dicing process through the second opening to form a third opening in the substrate and cut the substrate into a plurality of semiconductor dies.

Abstract: A display device includes: a substrate having display and non-display areas; a first conductive layer including first and second sub-conductive lines; a second conductive layer including third and fourth sub-conductive lines, wherein, in the display area, the first sub-conductive line and the third sub-conductive lines cross from a top view; and a third conductive layer including third conductive lines and corresponding to the non-display area; wherein, corresponding to the non-display area, a portion of a projection of the one of the third conductive lines is overlapped with a portion of a projection of the second sub-conductive line on the substrate, and another portion of the projection of the one of the third conductive lines is overlapped with a portion of a projection of the fourth sub-conductive line on the substrate.

Abstract: Die structures and methods of forming the same are described. In an embodiment, a device includes: a lower integrated circuit die; a first upper integrated circuit die face-to-face bonded to the lower integrated circuit die, the first upper integrated circuit die including a first semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first upper integrated circuit die, a top surface of the gap-fill dielectric being substantially coplanar with a top surface of the first semiconductor substrate and with a top surface of the first through-substrate via; and an interconnect structure including a first dielectric layer and first conductive vias, the first dielectric layer disposed on the top surface of the gap-fill dielectric and the top surface of the first semiconductor substrate, the first conductive vias extending through the first dielectric layer to contact the top surface of the first through-substrate via.

Abstract: In an embodiment, a device includes: a first integrated circuit die comprising a semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first integrated circuit die, a surface of the gap-fill dielectric being substantially coplanar with an inactive surface of the semiconductor substrate and with a surface of the first through-substrate via; a dielectric layer on the surface of the gap-fill dielectric and the inactive surface of the semiconductor substrate; a first bond pad extending through the dielectric layer to contact the surface of the first through-substrate via, a width of the first bond pad being less than a width of the first through-substrate via; and a second integrated circuit die comprising a die connector bonded to the first bond pad.

Abstract: A buckle device capable of displaying a locked state includes a main body unit, a latch unit, a fastening unit, an electromagnetic unit, and a control unit. The main body unit includes a main body and the latch unit includes a detachable tongue element. The fastening unit includes a bolt body interfering with the tongue element. The electromagnetic unit includes an electromagnetic module and an electromagnetic rod. The electromagnetic module controls the electromagnetic rod to interfere with the bolt body. The control unit includes a control module, a display module and a magnetic rod detection module for detecting the position of the electromagnetic rod. The control unit receives detection information of the magnetic bolt detection module and controls the display module to display a current state according to the position of the at least one electromagnetic rod.

Abstract: A buckle device capable of displaying a locked state includes a main body unit, a latch unit, a fastening unit, an electromagnetic unit, and a control unit. The main body unit includes a main body and the latch unit includes a detachable tongue element. The fastening unit includes a bolt body interfering with the tongue element. The electromagnetic unit includes an electromagnetic module and an electromagnetic rod. The electromagnetic module controls the electromagnetic rod to interfere with the bolt body. The control unit includes a control module, a display module and a magnetic rod detection module for detecting the position of the electromagnetic rod. The control unit receives detection information of the magnetic bolt detection module and controls the display module to display a current state according to the position of the at least one electromagnetic rod.

Abstract: The present invention relates to an efficient process of synthesizing some known Ertapenem compounds and to provide new intermediate compounds of Meropenem and Doripenem. The process and the intermediate can substantially increase the effective yield and reduce the impurity generation. The present invention further provides a novel and effective process for recovering and purifying ertapenem compounds by utilizing a low cost, materials with chemical stability as a carrier for isolating ertapenem compounds from extracts.

Abstract: A method for automatic consecutive installing operating systems is disclosed. The method includes establishing a transmission link between a server device and a device under test (DUT), downloading a preinstallation environment module from the server device via the transmission link, utilizing the preinstallation environment module to perform a boot process, obtaining an installation file from the server device and installing a first operating system on the DUT according to the installation file, modifying the installation file to indicate that a second operating system is a next installation operating system, and utilizing the preinstallation environment module to perform a boot process again and installing the second operating system on the DUT according to the modified installation file.

Abstract: The present invention relates to preparing carbapenem intermediates that are useful to produce Ertapenem, Meropenem and Doripenem; and provides an effective process for recovering ertapenem compounds.