Abstract: The present invention discloses a system and method for nondestructively measuring the refractive index and the central thickness of a lens. The system comprises a radius measurement module arranged for measuring the curvature radius of the first surface of the lens; a focus measurement module arranged for measuring the best focus distance of the first surface of the lens; and a calculation module arranged for performing the first or the second calculation process according to the lensmaker's formula. Wherein, when the central thickness is given, the calculation module performs the first calculation process according to the curvature radius, the best focus distance and the central thickness to calculate the refractive index. On the contrary, when the refractive index is given, the calculation module performs the second calculation process according to the curvature radius, the best focus distance and the refractive index to calculate the central thickness.

Abstract: The present invention discloses a system and method for nondestructively measuring the refractive index and the central thickness of a lens. The system comprises a radius measurement module arranged for measuring the curvature radius of the first surface of the lens; a focus measurement module arranged for measuring the best focus distance of the first surface of the lens; and a calculation module arranged for performing the first or the second calculation process according to the lensmaker's formula. Wherein, when the central thickness is given, the calculation module performs the first calculation process according to the curvature radius, the best focus distance and the central thickness to calculate the refractive index. On the contrary, when the refractive index is given, the calculation module performs the second calculation process according to the curvature radius, the best focus distance and the refractive index to calculate the central thickness.

Abstract: A method for manufacturing a printed circuit board includes applying a layer of an ink material onto the substrate, the ink material includes a number of conductive particles contained in a solution, and the substrate is then heated to remove the solution and to sinter or retain the conductive particles on the substrate and to form a conductive metal line on the substrate of the printed circuit board. One or more additional layers of the ink material are applied onto the conductive metal line of the substrate with an electroplating process, or by repeating applying the ink material onto the conductive metal line and heating and retaining the conductive particles on the conductive metal line of the substrate.