Abstract: A vehicle control method applied to a smart car key includes receiving a connection request sent by a mobile terminal, establishing a communication connection with the mobile terminal in response to the connection request, receiving identity information and authorization request information sent by the mobile terminal, determining whether the identity information is correct, and in response that the identity information is correct, sending pairing information to the mobile terminal in response to the authorization request information and sending the identity information to a vehicle to be controlled. The mobile terminal controls the vehicle through the pairing information and the identity information to perform at least one operation.

Abstract: Semiconductor device structures having gate structures with tunable threshold voltages are provided. Various geometries of device structure can be varied to tune the threshold voltages. In some examples, distances from tops of fins to tops of gate structures can be varied to tune threshold voltages. In some examples, distances from outermost sidewalls of gate structures to respective nearest sidewalls of nearest fins to the respective outermost sidewalls (which respective gate structure overlies the nearest fin) can be varied to tune threshold voltages.

Abstract: A method for detecting failure of vehicle is provided. The method obtains noise data of the vehicle from microphone units. The microphone units are arranged on different positions of the vehicle. The method detects sets of coordinate data of noise sound sources which is determined according to the noise data. The sets of coordinate data of the noise sound sources are relative sets of coordinate data. The method detects a noise type of each noise sound source according to the noise data. The method matches the sets of coordinate data and a modeled image of the vehicle, to determine an absolute coordinate data of each noise sound source in the vehicle. The method determines failure parts of the vehicle according to the noise type of each noise sound source and the absolute coordinate data. A related electronic device and a related non-transitory storage medium are provided.

Abstract: A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.

Abstract: A wireless control system of e-bike includes a control module, a display, a power control module, and an execution module. The control module detects operation signals from a rider of the e-bike. The display transmits the operation signals and displays information of the e-bike, and information to and concerning the rider, and the operation signals. The power control module receives the operation signals and adjusts an auxiliary power according to the operation signals. The execution module adjusts a speed of the e-bike and a status of lights of the e-bike. An e-bike having the wireless control system is also provided.

Abstract: A center information display system includes a center information display; a capturing device configured to obtain information on an occupant inside a vehicle; a rotating structure configured to adjust a view angle of the center information display; and a control device in communication with the capturing device, being configured to determine whether there is an occupant in a driver seat or a passenger seat, and control the rotating structure to rotate the center information display to a predetermined view angle.

Abstract: A method for predicting and compensating frictions of a feed system includes following steps: constantly obtaining current signals and angle-position signals of a motor by a motor driver of a feed system after being activated; calculating frictions of the motor upon each rotating position according to the obtained current signals and angle-position signals and generating multiple records of friction data; creating a friction model according to the multiple records of friction data and the angle-position signals each respectively corresponding to each record of friction data with respect to each rotating position; importing current angle-position signal of the motor to the friction model for predicting a predicted friction; calculating a compensation current based on the predicted friction; and, controlling the motor driver to additionally provide the compensation current to the motor for conquering an upcoming friction of the feed system approximate to the predicted friction.

Abstract: An instrument panel including a potentially large display panel which can be recessed away from mis-operations includes mounting surface and air outlet assembly. The display panel is mounted on the mounting surface. The air outlet assembly includes air intake and outlet. The air intake can connect to an air conditioning system. The air outlet is disposed on the mounting surface, and contains the display terminal. A size of the display assembly is freely adjustable, and the structure of the instrument panel reduces a risk of mis-operating the display terminal while driving. Heat generated by the display terminal can be taken away by the air outlet for increasing a lifetime of the display terminal. A vehicle with the instrument panel is also provided.

Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.

Abstract: A method can present a new sequence of online courses within a specialization for a group of new learners while maintaining a previous sequence of online courses within the specialization for a group of previous learners. The method can include maintaining a base class, associating a first learner with the base class, receiving a request to update a previous sequence of courses, generating a child class, associating a second learner with the child class, responding to a request for a sequence associated with the first learner, and responding to a request for a sequence associated with the second learner.

Abstract: A vehicle control method applied to a smart car key includes receiving a connection request sent by a mobile terminal, establishing a communication connection with the mobile terminal in response to the connection request, receiving identity information and authorization request information sent by the mobile terminal, determining whether the identity information is correct, and in response that the identity information is correct, sending pairing information to the mobile terminal in response to the authorization request information and sending the identity information to a vehicle to be controlled. The mobile terminal controls the vehicle through the pairing information and the identity information to perform at least one operation.

Abstract: A method for predicting and compensating frictions of a feed system includes following steps: constantly obtaining current signals and angle-position signals of a motor by a motor driver of a feed system after being activated; calculating frictions of the motor upon each rotating position according to the obtained current signals and angle-position signals and generating multiple records of friction data; creating a friction model according to the multiple records of friction data and the angle-position signals each respectively corresponding to each record of friction data with respect to each rotating position; importing current angle-position signal of the motor to the friction model for predicting a predicted friction; calculating a compensation current based on the predicted friction; and, controlling the motor driver to additionally provide the compensation current to the motor for conquering an upcoming friction of the feed system approximate to the predicted friction.

Abstract: A center information display system includes a center information display; a capturing device configured to obtain information on an occupant inside a vehicle; a rotating structure configured to adjust a view angle of the center information display; and a control device in communication with the capturing device, being configured to determine whether there is an occupant in a driver seat or a passenger seat, and control the rotating structure to rotate the center information display to a predetermined view angle.

Abstract: A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.

Abstract: A packaging device including a first semiconductor device, a thermal dissipating component, an encapsulation layer, a via, and a pad. The first semiconductor device includes a substrate, an active region, and an electrode. The active region is disposed between the substrate and the electrode. The substrate has a first surface opposite to the active region, and the electrode has a second surface opposite to the active region. The thermal dissipating component is disposed on the first surface of the substrate. The encapsulation layer encloses the second surface of the electrode and a part of the thermal dissipating component, such that another part of the thermal dissipating component is exposed by the encapsulation layer. The pad is disposed on the encapsulation layer. The via is disposed in the encapsulation layer and connects the pad to the electrode.

Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.

Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.

Abstract: A packaging device including a first semiconductor device, a thermal dissipating component, an encapsulation layer, a via, and a pad. The first semiconductor device includes a substrate, an active region, and an electrode. The active region is disposed between the substrate and the electrode. The substrate has a first surface opposite to the active region, and the electrode has a second surface opposite to the active region. The thermal dissipating component is disposed on the first surface of the substrate. The encapsulation layer encloses the second surface of the electrode and a part of the thermal dissipating component, such that another part of the thermal dissipating component is exposed by the encapsulation layer. The pad is disposed on the encapsulation layer. The via is disposed in the encapsulation layer and connects the pad to the electrode.

Abstract: A packaging device including a first semiconductor device, a thermal dissipating component, an encapsulation layer, a via, and a pad. The first semiconductor device includes a substrate, an active region, and an electrode. The active region is disposed between the substrate and the electrode. The substrate has a first surface opposite to the active region, and the electrode has a second surface opposite to the active region. The thermal dissipating component is disposed on the first surface of the substrate. The encapsulation layer encloses the second surface of the electrode and a part of the thermal dissipating component, such that another part of the thermal dissipating component is exposed by the encapsulation layer. The pad is disposed on the encapsulation layer. The via is disposed in the encapsulation layer and connects the pad to the electrode.

Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.