Abstract: A data programming method includes setting a plurality of first type physical erasing units as a current writing area and recording a current writing data amount. The method also includes calculating a data amount threshold according to the first type physical erasing units. The method still includes receiving data. The method further includes: if the current writing data amount is less than the data amount threshold, programming the data to at least one of the first type physical erasing units using a first programming mode; and if the current writing data amount is not less than the data amount threshold, setting a plurality of second type physical erasing units as the current writing area and programming the data to at least one physical erasing unit of the second type physical erasing units using a second programming mode.

Abstract: A method of designing a circuit layout includes calculating a typical value representing performance characteristics for the circuit layout based on a graphic database system (GDS) file. The method further includes calculating an adjustment value based on the GDS file and at least one of a CAP corner vector or a RES corner vector, wherein the CAP corner vector is based on an eigenvector of a parasitic capacitance of the circuit layout, and the RES corner vector is based on an eigenvector of a parasitic resistance of the circuit layout. The method further includes calculating a corner value based on the typical value and the adjustment value. The method further includes modifying the GDS file if performance characteristics of the corner value fail to satisfy performance requirements of the circuit layout.

Abstract: A method of designing a circuit layout includes calculating a typical value representing performance characteristics for the circuit layout based on a graphic database system (GDS) file. The method further includes calculating an adjustment value based on the GDS file and at least one of a CAP corner vector or a RES corner vector, wherein the CAP corner vector is based on an eigenvector of a parasitic capacitance of the circuit layout, and the RES corner vector is based on an eigenvector of a parasitic resistance of the circuit layout. The method further includes calculating a corner value based on the typical value and the adjustment value. The method further includes modifying the GDS file if performance characteristics of the corner value fail to satisfy performance requirements of the circuit layout.

Abstract: A driving head-changeable tool is provided. An outer sleeve defines a central axis and has an end peripheral edge which has corner portions and blocking flanges therebetween and a circumferential sliding slot. An inner sleeve is rotatably sleeved by the outer sleeve and has opposite first and second connecting ends. An inner wall of the first connecting end has axial concaves. A limitation mechanism is mounted to the inner sleeve and extends into and movable relative to the sliding slot. When the limitation mechanism is located in a lock position, the outer and inner sleeves are unrotatable relative to each other and each concave overlaps axially with one of the blocking flanges; when the limitation mechanism is located in a release position, the outer and inner sleeves are rotatable relative to each other and each concave corresponds to one of the corner portions.

Abstract: A method includes generating a plurality of multiple patterning decompositions associated with a layout of an integrated circuit. Each of the plurality of multiple patterning decompositions includes a first pattern associated with a first mask, a second pattern associated with a second mask, the first mask and the second mask being two masks of a multiple patterning mask set, a width value associated with at least one of the first pattern or the second pattern, and a first spacing value between the first pattern and the second pattern. A file is generated comprising a plurality of dielectric constant values associated with the plurality of multiple patterning decompositions that are based on the width values and the first spacing values.

Abstract: A driving head-changeable tool is provided, including a tool set and a driving head. The tool set includes a connecting sleeve, an outer sleeve and at least one limitation member. The connecting sleeve has a receiving slot and a driving end. A plurality of protruding ribs extending axially and a plurality of recesses disposed between the protruding ribs are disposed on an inner wall of the receiving slot. The recesses are provided for a polygonal ball head to insert therein. A recessed portion and a protruding portion are disposed on the inner wall. The outer sleeve is slidable between a first position and a second position. When the outer sleeve is at the first position, the limitation member can restrict the polygonal ball head. When the outer sleeve is at the second position, the polygonal ball head is withdrawable from the receiving slot.

Abstract: The present invention provides a luminance enhancement film which is superior in dimensional stability, thermal stability, and anti-deformation ability. Thus, it can meet the current requirement for thinning LCD apparatuses. With regard to the luminance enhancement film, a prism row structure is formed on a surface of a substrate, and a reinforced layer is formed on the other surface of the substrate. The glass transition temperature of the reinforced layer is in the range from 80° C. to 250° C., and the thickness of that is in the range from 3 ?m to 50 ?m.

Abstract: A driving head-changeable tool is provided, comprising an outer sleeve and an inner sleeve. The outer sleeve has an end peripheral edge and a non-circular circumferential inner wall. The end peripheral edge is formed with corner portions and blocking flanges. The inner sleeve has a non-circular circumferential outer wall. The inner sleeve is rotatably sleeved by the outer sleeve and has a first connecting end along a central axis. An inner wall of the first connecting end is formed with concaves extending axially. The non-circular circumferential inner and outer walls are nonrotatably abutted against each other. As viewed in an axial direction, each concave overlaps with one the blocking flange. When a driving head is inserted in the inner sleeve and the outer sleeve and the inner sleeve come close to each other, the driving head is blocked by the blocking flanges.

Abstract: A driving head-changeable tool is provided, comprising an outer sleeve and an inner sleeve. The outer sleeve has an end peripheral edge and a non-circular circumferential inner wall. The end peripheral edge is formed with corner portions and blocking flanges. The inner sleeve has a non-circular circumferential outer wall. The inner sleeve is rotatably sleeved by the outer sleeve and has a first connecting end along a central axis. An inner wall of the first connecting end is formed with concaves extending axially. The non-circular circumferential inner and outer walls are nonrotatably abutted against each other. As viewed in an axial direction, each concave overlaps with one the blocking flange. When a driving head is inserted in the inner sleeve and the outer sleeve and the inner sleeve come close to each other, the driving head is blocked by the blocking flanges.

Abstract: A driving head-changeable tool is provided. An outer sleeve defines a central axis and has an end peripheral edge which has corner portions and blocking flanges therebetween and a circumferential sliding slot. An inner sleeve is rotatably sleeved by the outer sleeve and has opposite first and second connecting ends. An inner wall of the first connecting end has axial concaves. A limitation mechanism is mounted to the inner sleeve and extends into and movable relative to the sliding slot. As viewed in an axial direction, when the limitation mechanism is located in a lock position, the outer and inner sleeves are unrotatable relative to each other and each concave overlaps with one the blocking flange; when the limitation mechanism is located in a release position, the outer and inner sleeves are rotatable relative to each other and each concave corresponds to one the corner portion.

Abstract: A method and a system for adjusting display parameters are provided. In the method, at least one real display parameter of a display to be adjusted is measured. A target template in accordance with the at least one real display parameter is searched from a plurality of templates stored in a database and target parameter adjusting data recorded in the searched target template is obtained, in which each template in the database records the at least one reference display parameter of a tested display and the reference parameter adjusting data used to adjust the tested display. Finally, the display is set and adjusted according to the obtained target parameter adjusting data.

Abstract: A method and a system for adjusting display parameters are provided. In the method, at least one real display parameter of a display to be adjusted is measured. A target template in accordance with the at least one real display parameter is searched from a plurality of templates stored in a database and target parameter adjusting data recorded in the searched target template is obtained, in which each template in the database records the at least one reference display parameter of a tested display and the reference parameter adjusting data used to adjust the tested display. Finally, the display is set and adjusted according to the obtained target parameter adjusting data.

Abstract: The present invention provides a luminance enhancement film which is superior in dimensional stability, thermal stability, and anti-deformation ability. Thus, it can meet the current requirement for thinning LCD apparatuses. With regard to the luminance enhancement film, a prism row structure is formed on a surface of a substrate, and a reinforced layer is formed on the other surface of the substrate. The glass transition temperature of the reinforced layer is in the range from 80° C. to 250° C., and the thickness of that is in the range from 3 ?m to 50 ?m.

Abstract: An integrated circuit chip includes a first electronic device, a second electronic device, and a common electrode feature. The first electronic device includes a first feature. The first electronic device has a first footprint area in a given layer. The second electronic device includes a second feature. The second electronic device has a second footprint area in the given layer. The first and second electronic devices are electrically matched. The common electrode feature is common to the first and second electronic devices. The common electrode is at least partially located in the given layer. More than a majority of the first footprint area overlaps with the second footprint area. A first spacing between the first feature and the common electrode feature is about the same as a second spacing between the second feature and the common electrode feature.

Abstract: Devices, methods, and systems for the design, fabrication, modification, and implantation of dental prostheses. An implant is created that has a shape closely or precisely conforming to the natural shape of a modified or unmodified tooth socket. The implant is used to anchor any of a variety of dental restorations or other substitute devices to bone. Further, methods, systems, and apparatuses for taking radiographs at specific, standard, and/or reproducible angles. A first radiograph is taken, using an aiming apparatus, with the aiming direction forming a first angle with the normal to an image plane of an image receptor. At least one additional radiograph is taken, using the aiming apparatus, at a different aiming direction from the first direction. Radiographs taken with the multiple aiming angles are used to create a three-dimensional image of an object represented by the radiographs.

Abstract: A universal joint composed of a swivel member, a driven socket, and at least one mediator. The swivel member includes a swivel body and a first driving portion. The driven socket includes a concavity, a second driving portion, and an annular recess formed at the concavity. A retaining ring is mounted in the annular recess. The swivel body is received in the concavity. The swivel body includes at least one cavity formed on a surface thereof. The driven socket includes at least one recession, which can correspond to the at least one cavity when the swivel body is located in the concavity. The at least one mediator interacts with the recession and the cavity and is located between the swivel body and the driven socket. Therefore, the operation of the universal joint can be smooth.

Abstract: A semiconductor structure including a capacitor having increased capacitance and improved electrical performance is provided. The semiconductor structure includes a substrate and a MIM capacitor over the substrate. The MIM capacitor includes a bottom plate, an insulating layer over the bottom plate, and a top plate over the insulating layer. The semiconductor structure further includes a MOS device including a gate dielectric over the substrate and a metal-containing gate electrode free from polysilicon on the gate dielectric, wherein the metal-containing gate electrode is formed of a same material and has a same thickness as the bottom plate.

Abstract: A semiconductor structure including a capacitor having increased capacitance and improved electrical performance is provided. The semiconductor structure includes a substrate and a MIM capacitor over the substrate. The MIM capacitor includes a bottom plate, an insulating layer over the bottom plate, and a top plate over the insulating layer. The semiconductor structure further includes a MOS device including a gate dielectric over the substrate and a metal-containing gate electrode free from polysilicon on the gate dielectric, wherein the metal-containing gate electrode is formed of a same material and has a same thickness as the bottom plate.

Abstract: An integrated circuit structure combining air-gaps and metal-oxide-metal (MOM) capacitors is provided. The integrated circuit structure includes a semiconductor substrate; a first metallization layer over the semiconductor substrate; first metal features in the first metallization layer; a second metallization layer over the first metallization layer; second metal features in the second metallization layer, wherein the first and the second metal features are non-capacitor features; a MOM capacitor having an area in at least one of the first and the second metallization layers; and an air-gap in the first metallization layer and between the first metal features.