Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An umbrella frame is composed of a shaft, a movable seat, and a locating tube. The movable seat is movably fitted over the shaft and provided at the lower end thereof with a retaining slot engageable and disengageable with a retaining hook located at the lower segment of the shaft. The movable seat is fastened at the top end thereof with one end of a plurality of strut ribs. The locating tube is fastened at the top end thereof with a plurality of ribs which are supported by the strut ribs. The locating tube is further provided in the midsegment thereof with a opening, two lugs, and a pulley mounted pivotally between the two lugs. A cord extends through the pulley such that one end of the cord is fastened with the movable seat, and that another end of the cord is fastened with the bottom end of the shaft.