Patents by Inventor Chia-Yi Wu

Chia-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10869523
    Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: December 22, 2020
    Assignee: NIKE, Inc.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Yu-Chen Lin
  • Publication number: 20190168475
    Abstract: A sole assembly may be formed by a method that includes positioning a plurality of preforms having different colors together to form a sole assembly preform and placing the sole assembly preform in a recess in a first portion of a mold assembly. The sole assembly preform is subjected to heat for a predetermined amount of time such that the plurality of preforms bond to one another to form a sole assembly.
    Type: Application
    Filed: January 29, 2019
    Publication date: June 6, 2019
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Yu-Chen Lin
  • Patent number: 10226906
    Abstract: A method of forming a sole assembly includes positioning a plurality of preforms having different colors together to form a sole assembly preform and placing the sole assembly preform in a recess in a first portion of a mold assembly. The sole assembly preform is subjected to heat for a predetermined amount of time such that the plurality of preforms bond to one another to form a sole assembly.
    Type: Grant
    Filed: April 14, 2014
    Date of Patent: March 12, 2019
    Assignee: NIKE, Inc.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Yu-Chen Lin
  • Publication number: 20190029362
    Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.
    Type: Application
    Filed: October 4, 2018
    Publication date: January 31, 2019
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Yu-Chen Lin
  • Patent number: 10172415
    Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.
    Type: Grant
    Filed: April 14, 2014
    Date of Patent: January 8, 2019
    Assignee: NIKE, INC.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Yu-Chen Lin
  • Patent number: 10026620
    Abstract: The present invention relates to the growth of a native oxide layer on a surface of a silicon substrate. Deep ultraviolet (UV) light is irradiated to thereby effectively improve the quality of the native oxide layer. By improving the quality, the difficulty of the surface treatment of a cross-section sample for scanning capacitance microscopy (SCM) is improved. The life cycle and reliability of the sample are also improved with enhanced reproducibility for the measurement of SCM. Thus, the present invention provides an improved method and an apparatus using the same to prepare a cross-sectional sample for SCM. The feasibility and the concrete method for enhancing oxide layer quality on a silicon substrate surface by UV light irradiation under a humidity-controlled environment are established. The optimum parameters of irradiation time for n-type and p-type samples are made.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: July 17, 2018
    Assignee: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Mao-Nan Chang, Tsung-Yu Chan, Chia-Yi Wu, Chun-Ting Lin, Ming-Hua Shiao
  • Publication number: 20180147803
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Application
    Filed: January 29, 2018
    Publication date: May 31, 2018
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Gjermund Haugbro
  • Patent number: 9950447
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: April 24, 2018
    Assignee: NIKE, Inc.
    Inventors: Thienchai Chaisumrej, Tee L. Wan, Gjermund Haugbro, Chia-Yi Wu
  • Patent number: 9919454
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: March 20, 2018
    Assignee: NIKE, Inc.
    Inventors: Thienchai Chaisumrej, Tee L. Wan, Gjermund Haugbro, Chia-Yi Wu
  • Patent number: 9884463
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: February 6, 2018
    Assignee: NIKE, Inc.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Gjermund Haugbro, Chia-Yi Wu
  • Patent number: 9731464
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 15, 2017
    Assignee: NIKE, Inc.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Gjermund Haugbro
  • Publication number: 20160107405
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Application
    Filed: December 22, 2015
    Publication date: April 21, 2016
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Gjermund Haugbro, Chia-Yi Wu
  • Patent number: 9265301
    Abstract: A mold used to form a midsole for an article of footwear and a method of manufacturing are disclosed. The mold includes a first portion and a second portion cooperating to define a midsole recess, the first portion including a major recess and plurality of wall segments extending throughout the major recess and cooperating to define a plurality of minor recesses. A fillet is provided at each intersection of adjacent wall segments. The mold may have a draft angle of less than or equal to approximately 2.5 degrees.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: February 23, 2016
    Assignee: NIKE, Inc.
    Inventors: Tee L. Wan, Chia-Yi Wu, Thienchai Chaisumrej
  • Publication number: 20150328854
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Application
    Filed: July 29, 2015
    Publication date: November 19, 2015
    Inventors: Thienchai Chaisumrej, Tee L. Wan, Gjermund Haugbro, Chia-Yi Wu
  • Publication number: 20150305438
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Application
    Filed: July 6, 2015
    Publication date: October 29, 2015
    Inventors: Thienchai Chaisumrej, Tee L. Wan, Gjermund Haugbro, Chia-Yi Wu
  • Publication number: 20150289586
    Abstract: An article of footwear includes an upper and a sole assembly positioned beneath the upper. The sole assembly has a vertically extending channel formed in its bottom surface inward of a periphery of the sole assembly, the channel including opposed sidewalls and an end surface. The sole assembly includes a first portion having a first color; and a second portion having a second color that is different than the first color. An interface between the first portion and the second portion is positioned at a central portion of one of the sidewalls of the channel. A method of forming such an article of footwear is also disclosed.
    Type: Application
    Filed: April 14, 2014
    Publication date: October 15, 2015
    Applicant: NIKE, Inc.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Yu-Chen Lin
  • Publication number: 20150290892
    Abstract: A method of forming a sole assembly includes positioning a plurality of preforms having different colors together to form a sole assembly preform and placing the sole assembly preform in a recess in a first portion of a mold assembly. The sole assembly preform is subjected to heat for a predetermined amount of time such that the plurality of preforms bond to one another to form a sole assembly.
    Type: Application
    Filed: April 14, 2014
    Publication date: October 15, 2015
    Applicant: NIKE, Inc.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Yu-Chen Lin
  • Patent number: 9096028
    Abstract: A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: August 4, 2015
    Assignee: NIKE, Inc.
    Inventors: Tee L. Wan, Thienchai Chaisumrej, Chia-Yi Wu, Gjermund Haugbro
  • Patent number: 8953050
    Abstract: An interaction system is provided. The interaction system has a first mobile device, configured to capture images of a scene, and a server, configured to recognize a first electronic device from the images captured by the first mobile device, so that the first electronic device and the first mobile device interact with each other.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: February 10, 2015
    Assignee: Quanta Computer Inc.
    Inventors: Ting-Han Huang, Kang-Wen Lin, Yu-Chen Huang, Chia-Yi Wu, Juin-Yi Huang, Shin-Hau Huang, Po-Chih Tsai, Ching-Fan Chu
  • Patent number: 8935385
    Abstract: A system of multimodality-appended rich media comments is provided. The system includes a server and an electronic device. The electronic device includes a network access module, at least one sensor and a processing unit. The network access module communicates with the server. The at least one sensor senses a user's behavior in a recording mode to obtain a sensing data. The processing unit performs an application to provide a source medium, wherein a rich media comment function of the application can be activated to provide multiple interactive objects for selection and then trigger the recording mode. The application uploads the sensing data to the server after the recording mode finishes. The server analyzes the sensing data and accordingly modifies the selected interactive object, combines the source medium with the modified interactive object into a rendered medium, and then delivers the rendered medium to the application.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: January 13, 2015
    Assignee: Quanta Computer Inc.
    Inventors: Chia-Yuan Chang, Ting-Han Huang, Kang-Wen Lin, Juin-Yi Huang, Chia-Yi Wu, Yu-Chen Huang, Ching-Fan Chu