Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.

Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: A power system applied to a handheld device including a battery, a first connecting port, a second connecting port, a first detector, a second detector, a power delivery controller, a control unit, and a switching element is provided. The first connecting port is electrically connected to the battery through a first charging path. The second connecting port is electrically connected to the battery through a second charging path. The first detector is electrically connected to the first connecting port to generate a first detection signal. The second detector is electrically connected to the second connecting port to generate a second detection signal. The control unit controls the switching element according to the first detection signal and the second detection signal to selectively electrically connect the power delivery controller to the first connecting port or the second connecting port and controls conduction statuses of the charging paths.

Abstract: A sensing element includes a plurality of sensing pixel areas arranged in matrix, wherein each of the plurality of sensing pixel areas includes a first pixel, a second pixel, a first shielding layer, a second shielding layer and at least one micro lens. The second pixel is adjacent to the first pixel in a predetermined direction. The first shielding layer is disposed on the first pixel and has a first opening, wherein an aperture of the first opening increases along the predetermined direction from a center of the first pixel. The second shielding layer is disposed on the second pixel and has a second opening, wherein a shape of the second opening is mirror symmetrical with that of the first opening in the predetermined direction. The at least one micro lens is disposed on the first shielding layer and the second shielding layer.

Abstract: The disclosure provides an electromagnetic shielding substrate including a first substrate and an auxiliary layer. The auxiliary layer is disposed on the first substrate and directly contacts the first substrate. The auxiliary layer includes a first sublayer and a second sublayer. The second sublayer is connected between the first sublayer and the first substrate. The chemical ingredient of the first sublayer is MxOy, and the chemical ingredient of the second sublayer is MxOz, and M is selected from one of Nb, Mo, Ta, Te, Ti, Tl, Y, Yb, Zr, and Zn, where x and y are positive integers, and y?1<z<y. A display panel using the above electromagnetic shielding substrate is also provided.

Abstract: A flexible touch panel includes a flexible touch substrate, an overcoat layer, a device layer, and a waterproof layer. The overcoat layer is disposed over and directly contacting the flexible touch substrate. An adhesive force of the overcoat layer obtained according to an ASTM D3359 cross-cut test is greater than 4B. The device layer is disposed over the overcoat layer. The waterproof layer is interposed between the overcoat layer and the device layer.

Abstract: A sensing element includes a plurality of sensing pixel areas arranged in matrix, wherein each of the plurality of sensing pixel areas includes a first pixel, a second pixel, a first shielding layer, a second shielding layer and at least one micro lens. The second pixel is adjacent to the first pixel in a predetermined direction. The first shielding layer is disposed on the first pixel and has a first opening, wherein an aperture of the first opening increases along the predetermined direction from a center of the first pixel. The second shielding layer is disposed on the second pixel and has a second opening, wherein a shape of the second opening is mirror symmetrical with that of the first opening in the predetermined direction. The at least one micro lens is disposed on the first shielding layer and the second shielding layer.

Abstract: The invention provides a flexible panel and a method of fabricating the same. The flexible panel includes a flexible substrate, an overcoat layer and a device layer. The overcoat layer is disposed over and directly contacting the flexible substrate. The device layer is disposed over the overcoat layer. In the invention, the flexible substrate can be directly formed on the carrier, such that an additional layer that helps release between the carrier and the flexible substrate may not be needed, and the flexible substrate can be separated from the carrier by the overcoat layer thereon, thereby reducing the production costs and ensure the quality of the flexible panel.

Abstract: A power module adapted to a computer system is provided in the disclosure. The power module includes three batteries, a first voltage output terminal, a second voltage output terminal, a third voltage output terminal, and a charging/discharging control unit. The charging/discharging control unit determines a quantity of serially connected batteries based on a load signal of the computer system, to supply a first voltage to the first voltage output terminal, a second voltage to the second voltage output terminal, or a third voltage to the third voltage output terminal. The first voltage, the second voltage, and the third voltage correspond to different quantities of batteries. The disclosure further provides a power supply method.

Abstract: A touch display device includes a display panel, a conductive layer, an optical matching layer and a buffer layer. The display panel comprises a first substrate, a second substrate and a display medium layer. The first substrate comprises a first surface and a second surface, the second substrate is disposed opposite to the first substrate, and the display medium layer is disposed between the second surface of the first substrate and the second substrate. The conductive layer is disposed on the first surface of the first substrate, and comprises a plurality of sensing electrodes. The optical matching layer is disposed between the conductive layer and the first surface of the first substrate. The buffer layer with a thickness greater than or equal to 50 ? and less than or equal to 3000 ? is disposed between the optical matching layer and the first surface of the first substrate.

Abstract: A touch display device including a substrate, a touch structure, a plurality of light emitting elements and a reflection layer is provided by the present invention. The substrate includes a first surface and a second surface opposite to the first surface. The touch structure includes a plurality of first touch electrodes disposed on the first surface of the substrate. The light emitting elements are disposed on the second surface of the substrate, and one of the light emitting elements includes a light emitting surface and a bottom surface opposite to the light emitting surface. The reflection layer is disposed on the second surface of the substrate. The light emitting elements are disposed between the reflection layer and the substrate, and the light emitting surface of one of the light emitting elements is disposed between the bottom surface and the reflection layer.

Abstract: A touch display device including a substrate, a touch structure, a plurality of light emitting elements and a reflection layer is provided by the present invention. The substrate includes a first surface and a second surface opposite to the first surface. The touch structure includes a plurality of first touch electrodes disposed on the first surface of the substrate. The light emitting elements are disposed on the second surface of the substrate, and one of the light emitting elements includes a light emitting surface and a bottom surface opposite to the light emitting surface. The reflection layer is disposed on the second surface of the substrate. The light emitting elements are disposed between the reflection layer and the substrate, and the light emitting surface of one of the light emitting elements is disposed between the bottom surface and the reflection layer.

Abstract: A charging device connected to a power source for charging a plurality of electronic devices is provided. Each of the electronic devices has a predetermined charging power. The charging device comprises a power input end, a plurality of power output ends, a plurality of charging units, and a controller. The power input end is connected to the power source. The power output ends are utilized to connect the electronic devices. The charging units are electrically connected to the power output ends respectively. The controller is electrically connected to the power input end, the power output ends and the charging units for accessing an output power of the power source via the power input and each of the predetermined charging powers via the power output ends, and controlling the charging units according to the output power and the predetermined charging powers.

Abstract: An accessory device, and an electronic system and an operation method thereof are provided. The accessory device includes a functional module, a first connection interface, a second connection interface, a switch module, and a microcontroller. The first connection interface is configured to be coupled to an external first electronic device. The second connection interface is configured to be coupled to an external second electronic device. The switch module is disposed between the first connection interface and the second connection interface, and between the first connection interface and the functional module. The microcontroller controls the switch module, so that at least one of the first electronic device, the second electronic device, and the functional module supplies power to at least another one of the first electronic device, the second electronic device, and the functional module.

Abstract: The disclosure provides a touch-sensing panel, which includes a substrate, a first mesh pattern, an insulating layer, and a second mesh pattern. The substrate has an active area and a peripheral area. The first mesh pattern is located in the active area. The insulating layer is disposed on the first mesh pattern. The second mesh pattern is located in the active area. At least a part of the second mesh pattern is disposed on the insulating layer. Each of the first mesh pattern and the second mesh pattern includes a plurality of mesh lines. A reflectivity of a surface of one of the first mesh pattern and the second pattern is smaller than a reflectivity of a surface of the other of the first mesh pattern and the second mesh pattern, and a width of each of the mesh lines of the one of the first mesh pattern and the second mesh pattern is smaller than a width of each of the mesh lines of the other of the first mesh pattern and the second mesh pattern.

Abstract: A flash memory device includes a substrate, a semiconductor quantum well layer, a semiconductor spacer, a semiconductor channel layer, a gate structure, and source/drain regions. The semiconductor quantum well layer is formed of a first semiconductor material and is disposed over the substrate. The semiconductor spacer is formed of a second semiconductor material and is disposed over the first semiconductor channel layer. The semiconductor channel layer is formed of the first semiconductor material and is disposed over the semiconductor spacer. Thea gate structure is over the second semiconductor channel layer. The source/drain regions are over the substrate and are on opposite sides of the gate structure.

Abstract: A solder paste includes a first solder alloy powder in an amount ranging from 30% to 95% by weight. The first solder alloy powder includes a first solder alloy with a solidus temperature of 200° C. to 260° C. The first solder alloy includes an Sn—Cu alloy or an Sn—Cu—Ag alloy. The solder paste further includes a second solder alloy powder in an amount ranging from 5% to 70% by weight, and a solder flux. The second solder alloy powder includes a second solder alloy with a solidus temperature below 250° C. The solder paste has a variable melting point. In multiple reflow soldering, a remelting of the solder paste is inhibited under different temperature conditions so that no functional failure occurs during assembly and/or packaging of PCBs or electronic devices due to melting of solder.

Abstract: A pixel array substrate including a substrate, a plurality of pixel structures, and a flat layer is provided. The pixel structures are correspondingly disposed in pixel regions of the substrate. At least one of pixel structure includes an active element, a reflective electrode, and an auxiliary electrode. The reflective electrode is electrically connected to the active element. The auxiliary electrode is electrically connected to the reflective electrode and the active element. A vertical projection of the reflective electrode on the substrate overlaps a vertical projection of the auxiliary electrode on the substrate. An area of the vertical projection of the reflective electrode on the substrate is not greater than an area of the vertical projection of the auxiliary electrode on the substrate. The flat layer is disposed between the auxiliary electrode and the active element. A display device by using the pixel array substrate is also provided.

Abstract: An electronic system includes a first device and a second device is provided. The first device includes a power connector, a first connector, a first battery, and a charging controller. The second device includes a second connector and a second battery. The power connector is configured to receive an external voltage. The first battery is electrically connected to the power connector and the first connector. The charging controller is electrically connected to the power connector and the first battery. The second connector is utilized for connecting the first connector. The second battery is electrically connected to the second connector. When the first connector is connected to the second connector, the charging controller selectively connects the first battery and the second battery in a series via the first connector and the second connector according to the level of the first battery and the second battery.