Patents by Inventor Chiaki Yamagishi
Chiaki Yamagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8524111Abstract: The present invention provides a CMP abrasive slurry for polishing insulation film, that allow efficiently and high-speed polishing of insulation films such as SiO2 film and SiOC film in the CMP method of flattening an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or a wiring-insulating film layer, a polishing method by using the abrasive slurry, and a semiconductor electronic part polished by the polishing method. A CMP abrasive slurry for polishing insulation film containing cerium oxide particles, a dispersant, a water-soluble polymer having amino groups on the side chains and water, a polishing method by using the CMP abrasive slurry, and a semiconductor electronic part polished by the polishing method.Type: GrantFiled: January 31, 2007Date of Patent: September 3, 2013Assignee: Hitachi Chemical Company, Ltd.Inventors: Masato Fukasawa, Kazuhiro Enomoto, Chiaki Yamagishi, Naoyuki Koyama
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Patent number: 8168541Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefore easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.Type: GrantFiled: October 12, 2010Date of Patent: May 1, 2012Assignee: Hitachi Chemical Co., Ltd.Inventors: Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi, Kazuhiro Enomoto, Kouji Haga, Yasushi Kurata
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Publication number: 20110028073Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.Type: ApplicationFiled: October 12, 2010Publication date: February 3, 2011Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi, Kazuhiro Enomoto, Kouji Haga, Yasushi Kurata
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Patent number: 7837800Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.Type: GrantFiled: April 29, 2008Date of Patent: November 23, 2010Assignee: Hitachi Chemical Co., Ltd.Inventors: Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi, Kazuhiro Enomoto, Kouji Haga, Yasushi Kurata
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Patent number: 7838482Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.Type: GrantFiled: January 30, 2004Date of Patent: November 23, 2010Assignee: Hitachi Chemical Co. Ltd.Inventors: Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi, Kazuhiro Enomoto, Kouji Haga, Yasushi Kurata
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Publication number: 20100015806Abstract: The invention relates to a CMP polishing slurry containing cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer includes a polymer obtained by polymerizing a monomer including at least one of a carboxylic acid having an unsaturated double bond and a salt thereof, using a reducing inorganic acid salt and oxygen as a redox polymerization initiator; an additive liquid for CMP polishing slurry; and substrate-polishing processes using the same. This makes it possible to polish a silicon oxide film effectively in a CMP technique for planarizing an interlayer dielectric, a BPSG film or a shallow trench isolating insulated film.Type: ApplicationFiled: September 13, 2007Publication date: January 21, 2010Inventors: Masato Fukasawa, Chiaki Yamagishi, Tadahiro Kimura, Toshiaki Akutsu
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Publication number: 20090047786Abstract: The present invention provides a CMP abrasive slurry for polishing insulation film, that allow efficiently and high-speed polishing of insulation films such as SiO2 film and SiOC film in the CMP method of flattening an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or a wiring-insulating film layer, a polishing method by using the abrasive slurry, and a semiconductor electronic part polished by the polishing method. A CMP abrasive slurry for polishing insulation film containing cerium oxide particles, a dispersant, a water-soluble polymer having amino groups on the side chains and water, a polishing method by using the CMP abrasive slurry, and a semiconductor electronic part polished by the polishing method.Type: ApplicationFiled: January 31, 2007Publication date: February 19, 2009Inventors: Masato Fukasawa, Kazuhiro Enomoto, Chiaki Yamagishi, Naoyuki Koyama
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Publication number: 20080214093Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.Type: ApplicationFiled: April 29, 2008Publication date: September 4, 2008Applicant: Hitachi Chemical Co., Ltd.Inventors: Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi, Kazuhiro Enomoto, Kouji Haga, Yasushi Kurata
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Publication number: 20060148667Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.Type: ApplicationFiled: January 30, 2004Publication date: July 6, 2006Applicant: Hitachi Chemical Co., Ltd.Inventors: Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi, Kazuhiro Enomoto, Kouji Haga, Yasushi Kurata
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Patent number: 5837804Abstract: Polyimides satisfying the requirements (a), (b) and (c) among the requirements described below, polyimides satisfying the requirements (b), (c) and (d), and polyimides satisfying the requirements (a), (b), (c) and (d) are excellent in transparency, isotropy and resistance to cracking (no crack is formed in the formation of a multilayer film, so that the multilayer formation is easy, namely, the polyimides are good in processability) and can give optical parts excellent in optical characteristics:(a) the difference between the refractive index in TE mode and that in TM mode is 0.02 or less,(b) the glass transition temperature (Tg) is 250.degree. C or higher,(c) the optical transmission loss at a wavelength of 0.7 to 1.6 .mu.m is 1 dB/cm or less, and(d) the fluorine content is 22.6% by weight or less.Type: GrantFiled: July 24, 1996Date of Patent: November 17, 1998Assignee: Hitachi Chemical Company, Ltd.Inventors: Chiaki Yamagishi, Nori Sasaki, Shigeo Nara, Hidetaka Sato, Shigeru Hayashida, Masato Taya
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Patent number: 5073466Abstract: An electrophotographic member comprising a support, a photoconductive layer formed thereon, and a surface layer formed thereon, said surface layer including or attaching a lubricating agent having a perfluoropolyoxyalkyl or perfluoropolyoxyalkylene group to form an organic surface protective lubricating layer, and a fixing group to be fixed to the surface layer, is excellent in moisture resistance, wear resistance and cleaning properties and thus useful in an electrophotographic apparatus with a long life and high reliability.Type: GrantFiled: August 16, 1989Date of Patent: December 17, 1991Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.Inventors: Fuminori Ishikawa, Kunihiro Tamahashi, Shigeharu Onuma, Masatoshi Wakagi, Masanobu Hanazono, Mitsuyoshi Shoji, Takayuki Nakakawaji, Yutaka Ito, Shigeki Komatsuzaki, Yasuo Shimamura, Chiaki Yamagishi