Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.

Abstract: A spin-orbit torque device is disclosed, which includes: a magnetic layer; and a non-magnetic layer adjacent to the magnetic layer and comprising a spin-Hall material, wherein the spin-Hall material comprises NixCu1-x alloy, and x is in a range from 0.4 to 0.8.

Abstract: Semiconductor device structures having gate structures with tunable threshold voltages are provided. Various geometries of device structure can be varied to tune the threshold voltages. In some examples, distances from tops of fins to tops of gate structures can be varied to tune threshold voltages. In some examples, distances from outermost sidewalls of gate structures to respective nearest sidewalls of nearest fins to the respective outermost sidewalls (which respective gate structure overlies the nearest fin) can be varied to tune threshold voltages.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: Disclosed is an apparatus for power interconnection, adapted for use between a main connector and a DC main. The power connector has a connector power terminal and the DC main has a DC main power terminal. The apparatus includes an apparatus power terminal for being electrically coupled to the DC main power terminal in response to the apparatus in connection with the DC main; a first conductor including a resistor and a conductive contact, the conductive contact being electrically coupled to the resistor; and a second conductor, the resistor being electrically coupled to the second conductor, wherein, in response to an action of the power connector in connection with the apparatus, the connector power terminal contacts the conductive contact and a first current flowing therethrough is limited by the resistor. A receptacle structure for power interconnection is also disclosed.

Abstract: Disclosed is an apparatus for power interconnection, adapted for use between a main connector and a DC main. The power connector has a connector power terminal and the DC main has a DC main power terminal. The apparatus includes an apparatus power terminal for being electrically coupled to the DC main power terminal in response to the apparatus in connection with the DC main; a first conductor including a resistor and a conductive contact, the conductive contact being electrically coupled to the resistor; and a second conductor, the resistor being electrically coupled to the second conductor, wherein, in response to an action of the power connector in connection with the apparatus, the connector power terminal contacts the conductive contact and a first current flowing therethrough is limited by the resistor. A receptacle structure for power interconnection is also disclosed.

Abstract: Disclosed is an apparatus for power interconnection, adapted for use between a main connector and a DC main. The power connector has a connector power terminal and the DC main has a DC main power terminal. The apparatus includes an apparatus power terminal for being electrically coupled to the DC main power terminal in response to the apparatus in connection with the DC main; a first conductor including a resistor and a conductive contact, the conductive contact being electrically coupled to the resistor; and a second conductor, the resistor being electrically coupled to the second conductor, wherein, in response to an action of the power connector in connection with the apparatus, the connector power terminal contacts the conductive contact and a first current flowing therethrough is limited by the resistor. A receptacle structure for power interconnection is also disclosed.

Abstract: Disclosed is an apparatus for power interconnection, adapted for use between a main connector and a DC main. The power connector has a connector power terminal and the DC main has a DC main power terminal. The apparatus includes an apparatus power terminal for being electrically coupled to the DC main power terminal in response to the apparatus in connection with the DC main; a first conductor including a resistor and a conductive contact, the conductive contact being electrically coupled to the resistor; and a second conductor, the resistor being electrically coupled to the second conductor, wherein, in response to an action of the power connector in connection with the apparatus, the connector power terminal contacts the conductive contact and a first current flowing therethrough is limited by the resistor. A receptacle structure for power interconnection is also disclosed.

Abstract: Disclosed is a method of network connection in a wireless local area network. The wireless local area network comprises a client, an access point, and an authentication database coupled to the access point. The authentication database comprises a plurality of collections of data entries, wherein each of the collections of data entries comprises a plurality of data entries. The network connection method comprises: passing messages containing queries relating to data entries in the authentication database and receiving responsive answer tags.