Patents by Inventor Chie Kabuo

Chie Kabuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8487423
    Abstract: In a semiconductor integrated circuit chip including an interconnect layer in which there is a limitation on the lengths of interconnects or areas occupied by the interconnects, empty spaces between power supply interconnect segments having the same potential located in parallel to a priority interconnect direction, are shifted relative to each other within the limits of the lengths and areas of power supply interconnects. As a result, a local increase in resistance is dispersed, whereby an influence on a voltage drop is reduced.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: July 16, 2013
    Assignee: Panasonic Corporation
    Inventors: Yoichi Matsumura, Chie Kabuo, Takako Ohashi, Tadafumi Kadota, Kazuhiko Fujimoto, Hirofumi Miyashita
  • Publication number: 20110260333
    Abstract: In a semiconductor integrated circuit chip including an interconnect layer in which there is a limitation on the lengths of interconnects or areas occupied by the interconnects, empty spaces between power supply interconnect segments having the same potential located in parallel to a priority interconnect direction, are shifted relative to each other within the limits of the lengths and areas of power supply interconnects. As a result, a local increase in resistance is dispersed, whereby an influence on a voltage drop is reduced.
    Type: Application
    Filed: June 27, 2011
    Publication date: October 27, 2011
    Applicant: Panasonic Corporation
    Inventors: Yoichi MATSUMURA, Chie Kabuo, Takako Ohashi, Tadafumi Kadota, Kazuhiko Fujimoto, Hirofumi Miyashita
  • Patent number: 7913221
    Abstract: A method for designing an interconnect structure of an interconnect layer in a semiconductor integrated circuit device includes the steps of: (a) inputting layout data of the semiconductor integrated circuit device; (b) controlling an air gap exclusion area based interconnects in the layout data; and (c) outputting layout data including the air gap exclusion area determined in the step (b).
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: March 22, 2011
    Assignee: Panasonic Corporation
    Inventors: Hirofumi Miyashita, Chie Kabuo, Nobuyuki Iwauchi, Yoichi Matsumura, Fumihiro Kimura, Tatsuo Gou, Yukiji Hashimoto
  • Publication number: 20080097641
    Abstract: A method for designing an interconnect structure of an interconnect layer in a semiconductor integrated circuit device includes the steps of: (a) inputting layout data of the semiconductor integrated circuit device; (b) controlling an air gap exclusion area based interconnects in the layout data; and (c) outputting layout data including the air gap exclusion area determined in the step (b).
    Type: Application
    Filed: October 19, 2007
    Publication date: April 24, 2008
    Inventors: Hirofumi Miyashita, Chie Kabuo, Nobuyuki Iwauchi, Yoichi Matsumura, Fumihiro Kimura, Tatsuo Gou, Yukiji Hashimoto
  • Publication number: 20070083844
    Abstract: A circuit structure analysis unit performs structure analysis for logic circuit information, obtained from an HDL description, and acquires analysis results for function parts, such as a register, an operation unit and a multiplexer. A synthesis instruction generation unit compares the analysis results with a synthesis instruction correlation rule, and automatically generates a synthesis instruction to control a logic synthesis method. Finally, an HDL description output unit outputs a synthesis instruction added HDL description, wherein a synthesis instruction is inserted into the original HDL description. When the synthesis instruction added HDL description is employed in the logic synthesis, starting at the top hierarchical level, a synthesis instruction for the logic circuit is not required in a synthesis execution script.
    Type: Application
    Filed: October 4, 2006
    Publication date: April 12, 2007
    Inventors: Chie Kabuo, Yoko Shimada, Kasumi Hamaguchi, Takashi Ishimura, Katsuya Fujimura
  • Patent number: 7114139
    Abstract: A plurality of blocks are optimally placed within a short process time while minimizing the exceeding of the delay time. Input means receives information on a logic circuit having a hierarchical structure including a plurality of blocks, and RTL estimation means calculates a delay time in the blocks in advance. Path detection means detects a timing path extending via a plurality of blocks, and delay calculation means calculates a delay value while assuming that the inter-block interconnect length is zero. Delay margin setting means sets a delay margin obtained by subtracting the delay value from a predetermined delay time. The delay margin forms a part of an objective function as a weight on the virtual interconnect length between each of the inter-block terminal pairs in the placement process, and the blocks are automatically placed by using the objective function.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: September 26, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Chie Kabuo
  • Publication number: 20050108668
    Abstract: A plurality of blocks are optimally placed within a short process time while minimizing the exceeding of the delay time. Input means receives information on a logic circuit having a hierarchical structure including a plurality of blocks, and RTL estimation means calculates a delay time in the blocks in advance. Path detection means detects a timing path extending via a plurality of blocks, and delay calculation means calculates a delay value while assuming that the inter-block interconnect length is zero. Delay margin setting means sets a delay margin obtained by subtracting the delay value from a predetermined delay time. The delay margin forms a part of an objective function as a weight on the virtual interconnect length between each of the inter-block terminal pairs in the placement process, and the blocks are automatically placed by using the objective function.
    Type: Application
    Filed: November 10, 2004
    Publication date: May 19, 2005
    Inventor: Chie Kabuo
  • Publication number: 20040049753
    Abstract: In estimating the performance of an integrated circuit, provided are RTL description inputting means for inputting an RTL logic description and creating the correspondence of a substitution portion with respect to each of signals; invariable attribute setting means for setting an invariable attribute with respect to a signal whose correspondence has been created; partial circuit synthesizing means for logically optimizing a partial circuit except for the signal having the invariable attribute; invariable part optimizing means for inserting a buffer in order to satisfy a design rule with respect to the signal having the invariable attribute; performance calculating means for calculating the performance of the integrated circuit; and display means for displaying the result of the performance calculation and the logic description.
    Type: Application
    Filed: September 5, 2003
    Publication date: March 11, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventor: Chie Kabuo
  • Patent number: 6169968
    Abstract: The invention provides an apparatus and a method for accurately and rapidly estimating a performance of an integrated circuit in the design at a register transfer level. A parsing member converts an HDL description of the integrated circuit at the register transfer level into a representation by using parse trees, and a parse tree allocation member allocates elements of the integrated circuit to respective nodes of the parse trees. A trade-off estimation member predicts a minimum area which can satisfy a timing constraint by applying estimation models stored in an estimation library to the respective elements of the integrated circuit represented by using connections between the elements, and by appropriately changing application of driver models stored in a driver library.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: January 2, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Chie Kabuo