Patents by Inventor Chie-Ta LEE

Chie-Ta LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9769361
    Abstract: An assembly structure for industrial camera has a camera module including an electric circuit board and a sensor component configured on the electric circuit board, a base of a camera seat combined onto the electric circuit board, a protrusive and hollow engaging portion installed on the surface of the base, an installation hole combined with a predetermined lens installed in the engaging portion, and a lens hole creating a closure state configured at the bottom of the installation hole.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: September 19, 2017
    Assignee: Adlink Technology Inc.
    Inventor: Chie-Ta Lee
  • Publication number: 20170062303
    Abstract: A circuit chip module heat dissipation structure includes a circuit module including a circuit board and a chip unit mounted at the circuit board, and a heat dissipation device consisting of a plurality of heat-transfer blocks bonded to the surface of the circuit board and abutted against the peripheral walls of the chip unit to create a heat-transfer path for transferring heat from the chip unit for quick dissipation.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 2, 2017
    Inventor: Chie-Ta LEE
  • Publication number: 20170064159
    Abstract: An assembly structure for industrial camera has a camera module including an electric circuit board and a sensor component configured on the electric circuit board, a base of a camera seat combined onto the electric circuit board, a protrusive and hollow engaging portion installed on the surface of the base, an installation hole combined with a predetermined lens installed in the engaging portion, and a lens hole creating a closure state configured at the bottom of the installation hole.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 2, 2017
    Inventor: Chie-Ta LEE