Patents by Inventor Chie Terauchi

Chie Terauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heating apparatus
    Patent number: 7661573
    Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: February 16, 2010
    Assignee: Fujitsu Limited
    Inventors: Osamu Saito, Tetsuji Ishikawa, Chie Terauchi
  • Heating apparatus
    Publication number: 20060273141
    Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.
    Type: Application
    Filed: September 14, 2005
    Publication date: December 7, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Osamu Saito, Tetsuji Ishikawa, Chie Terauchi