Patents by Inventor Chieh-Hsien Lee

Chieh-Hsien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
    Publication number: 20240120207
    Abstract: A semiconductor package includes a die having a plurality of devices over a first substrate, where the first substrate includes a dopant at a first concentration and the first substrate has a first width along a horizontal direction. The semiconductor package further includes a second substrate fused with the first substrate, where the second substrate includes the dopant at a second concentration greater than the first concentration.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lung-Kai Mao, Wen-Hsiung Lu, Pei-Wei Lee, Szu-Hsien Lee, Chieh-Ning Feng
  • Jewelry box having video and audio playing functions
    Publication number: 20070295619
    Abstract: A jewelry box includes a base, a top cover pivotally mounted on the base, and a video/audio player mounted in the top cover. Thus, the jewelry box has a storage function and a video/audio playing function so as to attract the consumer's interest, thereby enhancing the amusement effect of the jewelry box. In addition, the user can hear the sound from the video/audio player by the horns or the earphone, thereby enhancing the versatility of the jewelry box, and thereby facilitating the user operating the video/audio player of the jewelry box.
    Type: Application
    Filed: June 26, 2006
    Publication date: December 27, 2007
    Applicant: Magnetic Communication Corp.
    Inventor: Chieh-Hsien Lee