Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: An object sampling method is applied to an image analysis apparatus with an image receiver and an operation processor. The image receiver acquires an image stream. The object sampling method includes transforming color space of at least one surveillance image in the image stream, computing saturation and gradient of specific pixels within the at least one surveillance image, setting a bonding box within the at least one surveillance image, and computing a background score relevant to the saturation and value of all pixels in the bonding box, and comparing the background score with a first sampling condition so as to determine whether the at least one surveillance image is applicable for the image analysis apparatus via a comparison result of comparing the foreground score with the first sampling condition.

Abstract: An electronic lock components includes a bracket configured to be mounted on a door panel and an electronic lock body configured to be assembled on or disassembled from the bracket. The bracket includes an elastic piece, and a portion of the elastic piece is inclined downward. The electronic lock body includes: a back cover body, having a through hole therethrough, in which when the back cover body is leaned against the bracket and then moved downward, one end of the portion of the elastic piece is able to be stuck in the through hole; and a main cover body, including a pushing piece having a convex portion facing the through hole, in which when the pushing piece is pushed toward the through hole, the convex portion is able to push the end of the portion of the elastic piece away from the through hole.

Abstract: A host system operates to manage a storage device. The host system initiates an abort of a command when the command has been fetched from a submission queue (SQ) of the host system and the SQ entry has been fetched from the SQ and the host system has not received a corresponding command completion response from the storage device. The host system sends an abort request to the storage device, and issues a cleanup request to direct a host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry to indicate completion of the abort request.

Abstract: The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

Abstract: A method of storing an input data of a data set into a memory storage having bit cells. The method includes determining a bit value of a characterization bit in the input data. The method also includes writing each of remaining bits in the input data into one of the bit cells as a first state if the characterization bit has a first value, and writing each of remaining bits in the input data into the bit cells as a second state if the characterization bit has a second value that is complement to the first value. In the method, either reading the bit cell with the first state consumes less energy than reading the bit cell with the second state or the bit cell with the first state has less retention errors than the bit cell with the second state.

Abstract: In an embodiment, a method includes: heating a byproduct transport ring of an extreme ultraviolet source, the byproduct transport ring disposed beneath vanes of the extreme ultraviolet source; after heating the byproduct transport ring for a first duration, heating the vanes; after heating the vanes, cooling the vanes; and after cooling the vanes for a second duration, cooling the byproduct transport ring.

Abstract: A retainer is used for a linear guideway, including a main body, a retaining portion, and a hollow portion. The main body extends along the longitudinal direction of the retainer. The retaining portion extends from a long side of the main body along the width direction of the retaining portion. The hollow portion is abutted between the retaining portion and the main body for allowing a part of the retaining portion to be elastically deformed when the retaining portion is compressed by an external force. Therefore, when balls are assembled, the retainer of the present invention uses the partial elastic deformation of the retaining portion to avoid damage caused by directly collided with the balls, thereby enhancing convenience of installing and removing the balls. In addition, the hollow portion can be used to save lubricating oil for achieving the effect of extended lubrication.

Abstract: A transmission mechanism for an electronic door lock is provided. The transmission mechanism includes a gear box, a motor module, a transmission gear set, a transmission rod, a clutch transmission module and a motion detection circuit board. A returning detection module is installed on the motion detection circuit board. The returning detection module is used to detect the actuation state of the clutch transmission module.

Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.

Abstract: A method includes bonding a first device die to a second device die, encapsulating the first device die in a first encapsulant, performing a backside grinding process on the second device die to reveal through-vias in the second device die, and forming first electrical connectors on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant, and forming an interconnect structure overlapping the first package and the second encapsulant. The interconnect structure comprises second electrical connectors.

Abstract: A circuit includes a sense amplifier, a first clamping circuit, a second clamping circuit, and a feedback circuit. The first clamping circuit includes first clamping branches coupled in parallel between the sense amplifier and a memory array. The second clamping circuit includes second clamping branches coupled in parallel between the sense amplifier and a reference array. The feedback circuit is configured to selectively enable or disable one or more of the first clamping branches or one or more of the second clamping branches in response to an output data outputted by the sense amplifier.

Abstract: The present disclosure provides a method for forming an integrated circuit (IC) structure. The method includes providing a metal gate (MG), an etch stop layer (ESL) formed on the MG, and a dielectric layer formed on the ESL. The method further includes etching the ESL and the dielectric layer to form a trench. A surface of the MG exposed in the trench is oxidized to form a first oxide layer on the MG. The method further includes removing the first oxide layer using a H3PO4 solution.

Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device transmits a device information of the first member device to the Bluetooth host device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device further establishes a connection with the first member device to conduct pairing procedure to generate a first cypher key after receiving a selection command. The first member device further establishes a connection with the Bluetooth host device to conduct pairing procedure to generate a second cypher key.

Abstract: An imaging lens assembly includes a lens barrel, optical lens elements, an annular retaining element and a nano-microstructure. The optical lens elements include at least one optical lens element disposed in the lens barrel. The annular retaining element is physically contacted with the optical lens element, and the annular retaining element includes an object-side surface, an image-side surface, an outer diameter surface and a light-through hole. The outer diameter surface is connected to the object-side surface and the image-side surface. The light-through hole is formed by gradually tapering from the object-side surface and the image-side surface towards the optical axis. The nano-microstructure has a plurality of irregular ridged convexes. The nano-microstructure is located between a lens barrel area defined via the lens barrel and a lens element area defined via the optical lens element on a direction vertical to the optical axis.

Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably transmit a corresponding first device information to the Bluetooth host device. The second member device is arranged to operably transmit a corresponding second device information to the Bluetooth host device. The Bluetooth host device is arranged to operably control a display device to simultaneously display a first device item for representing the first member device and a second device item for representing the second member device in a graphical user interface. The Bluetooth host device is further arranged to operably establish a Bluetooth connection with the first member device and conduct pairing procedure with the first member device after receiving a selection command corresponding to the first member device.

Abstract: A method for fabricating a memory device includes: providing a substrate; forming a first dielectric layer over the substrate; forming a plurality of conductive layers and a plurality of dielectric layers alternately and horizontally disposed on the substrate; forming a channel column structure on the substrate and in the plurality of conductive layers and the plurality of dielectric layers, where a side wall of the channel column structure is in contact with the plurality of conductive layers; forming a second dielectric layer covering the first dielectric layer; and forming, in the first and second dielectric layers, a conductive column structure adjacent to the channel column structure and in contact with one of the plurality of conductive layers, where the conductive column structure includes a liner insulating layer as a shell layer.

Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device transmits a device information of the first member device to the Bluetooth host device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device further establishes a connection with the first member device to conduct pairing procedure to generate a first cypher key after receiving a selection command. The first member device further establishes a connection with the Bluetooth host device to conduct pairing procedure to generate a second cypher key.

Abstract: Three-dimensional memories are provided. A three-dimensional memory includes a memory cell array, a first interconnect structure, a bit line decoder and a second interconnect structure. The bit line decoder is formed under the memory cell array and the first interconnect structure. The memory cell array includes a plurality of memory cells formed in a plurality of levels stacked in a first direction. The first interconnect structure includes at least one bit line extending in a second direction that is perpendicular to the first direction. The bit line includes a plurality of sub-bit lines stacked in the first direction. Each of the sub-bit lines is coupled to the memory cells that are arranged in a line in the corresponding level of the memory cell array. The second interconnect structure is configured to connect the bit line to the bit line decoder passing through the first interconnect structure.

Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.