Patents by Inventor Chien-Chan YEH
Chien-Chan YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11583171Abstract: A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region.Type: GrantFiled: August 22, 2019Date of Patent: February 21, 2023Assignee: OmniVision Technologies, Inc.Inventors: Teng-Sheng Chen, Chien-Chan Yeh, Cheng-Fang Chiu, Wei-Feng Lin
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Patent number: 11114483Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.Type: GrantFiled: August 10, 2018Date of Patent: September 7, 2021Assignee: OmniVision Technologies, Inc.Inventors: Chien-Chan Yeh, Ying-Chih Kuo, Wei-Feng Lin, Chun-Sheng Fan
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Patent number: 11056529Abstract: A method for fabricating an image-sensor chip-scale package includes bonding, with temporary adhesive, a glass wafer to a device wafer including an array of image sensors. The method also includes forming an isolated-die wafer by removing, from the device wafer, each of a plurality of inter-sensor regions each located between a respective pair of image sensors of the array of image sensors. The isolated-die wafer includes a plurality of image-sensor dies each including a respective image sensor, of the array of image sensors, bonded to the glass wafer. The method also includes encapsulating the isolated-die wafer to form an encapsulated-die wafer; removing, from each of the plurality of image-sensor dies, a respective region of the glass wafer covering the respective image sensor; and singulating the encapsulated-die wafer.Type: GrantFiled: October 11, 2019Date of Patent: July 6, 2021Assignee: OmniVision Technologies, Inc.Inventors: Chien-Chan Yeh, Ying-Chih Kuo
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Patent number: 11049894Abstract: An image sensor package includes a transparent material, and a substrate adhered to the transparent material. An image sensor is disposed on or within the substrate so that the image sensor is disposed between the substrate and the transparent material to receive light from an optical side of the image sensor package through the transparent material. A solder mask dam is disposed between the substrate and the transparent material to form a gap between the image sensor and the transparent material, and the solder mask dam is structured to indicate an orientation of the image sensor, when the image sensor is viewed from the optical side.Type: GrantFiled: November 7, 2018Date of Patent: June 29, 2021Assignee: OmniVision Technologies, Inc.Inventor: Chien-Chan Yeh
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Patent number: 10998285Abstract: A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern of a first group and at least one code pattern of a second group formed on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the code patterns are visible from a backside of the chip, and wherein a tracing number of the chip is represented by the code patterns.Type: GrantFiled: January 25, 2019Date of Patent: May 4, 2021Assignee: OmniVision Technologies, Inc.Inventors: Chien-Chan Yeh, Ying-Chih Kuo
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Patent number: 10985149Abstract: A semiconductor device package includes a transparent substrate, a photo detector and a first conductive layer. The transparent substrate has a first surface and a first cavity underneath the first surface. The photo detector is disposed within the first cavity. The photo detector has a sensing area facing toward a bottom surface of the first cavity of the transparent substrate. The first conductive layer is disposed over the transparent substrate and electrically connected to the photo detector.Type: GrantFiled: January 15, 2019Date of Patent: April 20, 2021Assignee: Omnivision Technologies, IncInventors: Chien Chan Yeh, Ying-Chih Kuo, Wei-Feng Lin
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Publication number: 20210111221Abstract: A method for fabricating an image-sensor chip-scale package includes bonding, with temporary adhesive, a glass wafer to a device wafer including an array of image sensors. The method also includes forming an isolated-die wafer by removing, from the device wafer, each of a plurality of inter-sensor regions each located between a respective pair of image sensors of the array of image sensors. The isolated-die wafer includes a plurality of image-sensor dies each including a respective image sensor, of the array of image sensors, bonded to the glass wafer. The method also includes encapsulating the isolated-die wafer to form an encapsulated-die wafer; removing, from each of the plurality of image-sensor dies, a respective region of the glass wafer covering the respective image sensor; and singulating the encapsulated-die wafer.Type: ApplicationFiled: October 11, 2019Publication date: April 15, 2021Inventors: Chien-Chan YEH, Ying-Chih KUO
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Publication number: 20210052134Abstract: A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region.Type: ApplicationFiled: August 22, 2019Publication date: February 25, 2021Inventors: Teng-Sheng CHEN, Chien-Chan YEH, Cheng-Fang CHIU, Wei-Feng LIN
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Publication number: 20200243472Abstract: A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern of a first group and at least one code pattern of a second group formed on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the code patterns are visible from a backside of the chip, and wherein a tracing number of the chip is represented by the code patterns.Type: ApplicationFiled: January 25, 2019Publication date: July 30, 2020Applicant: OmniVision Technologies, Inc.Inventors: Chien-Chan Yeh, Ying-Chih Kuo
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Publication number: 20200227394Abstract: A semiconductor device package includes a transparent substrate, a photo detector and a first conductive layer. The transparent substrate has a first surface and a first cavity underneath the first surface. The photo detector is disposed within the first cavity. The photo detector has a sensing area facing toward a bottom surface of the first cavity of the transparent substrate. The first conductive layer is disposed over the transparent substrate and electrically connected to the photo detector.Type: ApplicationFiled: January 15, 2019Publication date: July 16, 2020Inventors: Chien Chan YEH, Ying-Chih KUO, Wei-Feng LIN
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Publication number: 20200144321Abstract: An image sensor package includes a transparent material, and a substrate adhered to the transparent material. An image sensor is disposed on or within the substrate so that the image sensor is disposed between the substrate and the transparent material to receive light from an optical side of the image sensor package through the transparent material. A solder mask dam is disposed between the substrate and the transparent material to form a gap between the image sensor and the transparent material, and the solder mask dam is structured to indicate an orientation of the image sensor, when the image sensor is viewed from the optical side.Type: ApplicationFiled: November 7, 2018Publication date: May 7, 2020Inventor: Chien-Chan Yeh
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Publication number: 20200052019Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.Type: ApplicationFiled: August 10, 2018Publication date: February 13, 2020Inventors: Chien-Chan YEH, Ying-Chih KUO, Wei-Feng LIN, Chun-Sheng FAN