Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: In some embodiments, the present disclosure relates to a semiconductor device comprising a source and drain region arranged within a substrate. A conductive gate is disposed over a doped region of the substrate. A gate dielectric layer is disposed between the source region and the drain region and separates the conductive gate from the doped region. A bottommost surface of the gate dielectric layer is below a topmost surface of the substrate. First and second sidewall spacers are arranged along first and second sides of the conductive gate, respectively. An inner portion of the first sidewall spacer and an inner portion of the second sidewall spacer respectively cover a first and second top surface of the gate dielectric layer. A drain extension region and a source extension region respectively separate the drain region and the source region from the gate dielectric layer.

Abstract: A heating device includes a heating element, a temperature sensor, a first heat pump element, a first heating block, a second heating block and a controller. The heating element is to receive an energy of the controller and convert the energy into a first thermal energy provided to the first heating block. A sensing result is generated by the temperature sensor according to the first thermal energy. The first heat pump element is to receive the energy of the controller for generating a temperature difference. The first thermal energy is conducted to the first heat pump element for forming a second thermal energy. The second heating block is to receive the second thermal energy. The controller correspondingly outputs the energy to the heating element and the first heat pump element according to the sensing result, and thereby controls the first thermal energy and the temperature difference.

Abstract: An uninterruptible power apparatus is coupled between a power grid and a load. The uninterruptible power apparatus includes a bypass path, a power conversion module, and a control module. The bypass path is coupled to the power grid through a grid terminal, and coupled to the load through a load terminal. The control module turns off a first thyristor and a second thyristor by injecting a second voltage into the load terminal during a forced commutation period. The control module calculates a magnetic flux offset amount based on an error amount between the second voltage and a voltage command, and provides a compensation command in response to the magnetic flux offset amount. The control module controls the DC/AC conversion circuit to provide a third voltage to the load terminal based on the compensation command and the voltage command.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation element partially covering the magnetic element. The semiconductor device structure further includes a conductive feature over the isolation element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an adhesive element between the magnetic element and the substrate. The adhesive element extends exceeding opposite edges of the magnetic element. The semiconductor device structure further includes an isolation element extending exceeding the opposite edges of the magnetic element. The isolation element partially covers a top surface of the magnetic element. In addition, the semiconductor device structure includes a conductive line over the isolation element.

Abstract: A convective polymerase chain reaction apparatus and an optical detecting method thereof are provided. The optical detecting method includes the following steps. A substance in a tube to be tested is heated. At least two monochromatic lights are provided and are combined using a light combining element to irradiate the tube to be tested. At least two excited lights generated by exciting the substance in the tube to be tested by the at least two monochromatic lights are sensed.

Abstract: A heating device includes a heating element, a temperature sensor, a first heat pump element, a first heating block, a second heating block and a controller. The heating element is to receive an energy of the controller and convert the energy into a first thermal energy provided to the first heating block. A sensing result is generated by the temperature sensor according to the first thermal energy. The first heat pump element is to receive the energy of the controller for generating a temperature difference. The first thermal energy is conducted to the first heat pump element for forming a second thermal energy. The second heating block is to receive the second thermal energy. The controller correspondingly outputs the energy to the heating element and the first heat pump element according to the sensing result, and thereby controls the first thermal energy and the temperature difference.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an adhesive element between the magnetic element and the substrate. The adhesive element extends exceeding opposite edges of the magnetic element. The semiconductor device structure further includes an isolation element extending exceeding the opposite edges of the magnetic element. The isolation element partially covers a top surface of the magnetic element. In addition, the semiconductor device structure includes a conductive line over the isolation element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The magnetic element has a first edge. The semiconductor device structure also includes an adhesive element between the magnetic element and the semiconductor substrate, and the adhesive element has a second edge. The semiconductor device structure further includes an isolation element extending across the magnetic element. The isolation element partially covers a top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The isolation element has a third edge, and the second edge is closer to the third edge than the first edge. In addition, the semiconductor device structure includes a conductive line over the isolation element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The magnetic element has a first edge. The semiconductor device structure also includes an adhesive element between the magnetic element and the semiconductor substrate, and the adhesive element has a second edge. The semiconductor device structure further includes an isolation element extending across the magnetic element. The isolation element partially covers a top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The isolation element has a third edge, and the second edge is closer to the third edge than the first edge. In addition, the semiconductor device structure includes a conductive line over the isolation element.

Abstract: A system for controlling application devices by using dialogue or social media includes a first dialogue unit being a dialogue unit with respect to a specific dialogue software unit; the first dialogue unit including a first dialogue frame, a first user interface, and a first output unit; the first dialogue unit being installed in a first electronic device; a second dialogue unit signally connected to the first dialogue unit; the second dialogue unit including a second dialogue frame, a second user interface, and a second output unit; the second dialogue unit being installed in a second electronic device; at least one application device connected to the second dialogue unit in the second electronic device; and a downlink converter connected to the second dialogue unit for converting statements in the second dialogue unit into mechanical instructions; and then the mechanic instructions are transferred out through a network to the application device.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming an adhesive layer over a semiconductor substrate and forming a magnetic element over the adhesive layer. The method also includes forming an isolation element extending across the magnetic element. The isolation element partially covers the top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The method further includes partially removing the adhesive layer such that an edge of the adhesive layer is laterally disposed between an edge of the magnetic element and an edge of the isolation element. In addition, the method includes forming a conductive line over the isolation element.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming an adhesive layer over a semiconductor substrate and forming a magnetic element over the adhesive layer. The method also includes forming an isolation element extending across the magnetic element. The isolation element partially covers the top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The method further includes partially removing the adhesive layer such that an edge of the adhesive layer is laterally disposed between an edge of the magnetic element and an edge of the isolation element. In addition, the method includes forming a conductive line over the isolation element.

Abstract: An earphone case includes a shell, a rotating drum received in the shell, a driving assembly coupled to the rotating drum and configured for rotating the rotating drum, and a back cover latchable with the shell and receiving the driving assembly in a receiving space defined therein. The rotating drum is driven by the driving assembly to rotate to wind a wire of at least one pair of earphones.

Abstract: An earphone case includes a shell, a rotating drum received in the shell, a driving assembly coupled to the rotating drum and configured for rotating the rotating drum, and a back cover latchable with the shell and receiving the driving assembly in a receiving space defined therein. The rotating drum is driven by the driving assembly to rotate to wind a wire of at least one pair of earphones.

Abstract: A physiology detecting garment is provided in the invention. The physiology detecting garment includes a garment, a first transmission line, a second transmission line, a first detecting device, a second detecting device, a first textile antenna and a second textile antenna. The first textile antenna is configured in the garment and receives a first sensing signal. The second textile antenna is configured in the garment and receives a second sensing signal. The first detecting device samples the first sensing signal to generate a first time index and the second detecting device samples the second sensing signal to generate a feedback signal. The first detecting device generates a second time index according to the feedback signal, and generates a time parameter according to the first time index and the second time index, and obtains physiological information according to the time parameter.

Abstract: A display device includes a data driver, a gate driver, a plurality of first pixel unit and a first low-pass filter. Each first pixel unit includes a first transistor, a first storage capacitor and a first liquid crystal capacitor. The first transistor is electrically coupled to the data driver and the gate driver and from which to receive the first display data and the gate control signal, respectively. The first transistor is configured to output the first display data according to the gate control signal. The first low-pass filter is configured to have its input electrode terminal electrically coupled to the second electrode terminal of one of the plurality of first transistor and its output electrode terminal electrically coupled to the second electrode terminal of the first liquid crystal capacitor of each of the first pixel units. An operation method for the display device is also provided.

Abstract: One or more systems and methods for a cell based hybrid resistance and capacitance (RC) extraction are provided. The method includes generating a layout for a semiconductor arrangement, performing a three-dimensional (3D) RC extraction on a target unit cell to obtain a 3D RC result including a coupling capacitance between unit cells, generating a 3D RC netlist based upon the 3D RC result, performing a 2.5 dimensional (2.5D) RC extraction on a peripheral cell to obtain a 2.5D RC netlist, and combining the 3D RC netlist with the 2.5D RC netlist to create a hybrid RC netlist for the layout. In some embodiments, the hybrid RC netlist is generated by stitching the coupling capacitance for at least one of the target unit cell, a repeating unit cell, or the peripheral cell together. In some embodiments, the 3D RC result for the target unit cell is stitched to the repeating unit cell.