Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A combinable nucleic acid pre-processing apparatus includes a sample transfer chamber transferring a sample from a sampling tube to a nucleic acid extraction kit, a nucleic acid extraction chamber performing a nucleic acid extraction of the sample in the nucleic acid extraction kit for obtaining a nucleic acid extract, an assay setup chamber preparing reagents and transferring reagents and the nucleic acid extract to an assay plate, and at least two bridging modules respectively disposed between the sample transfer chamber and the nucleic acid extraction chamber and between the nucleic acid extraction chamber and the assay setup chamber. The sample transfer chamber, the nucleic acid extraction chamber and the assay setup chamber are separated and operated independently. Three chambers are connected through the bridging modules, so the nucleic acid extraction kit can be sequentially moved in the sample transfer chamber, the nucleic acid extraction chamber and the assay setup chamber.

Abstract: The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a method of formation. In some embodiments, the integrated circuit comprises an isolation structure disposed in the boundary region of the substrate. A first polysilicon component is disposed directly on an upper surface of the substrate alongside the isolation structure. A boundary dielectric layer is disposed on the isolation structure. A second polysilicon component is disposed on the sacrifice dielectric layer.

Abstract: An integrated circuit has a first pin, a voltage outputting circuit electrically connected to the first pin, a second pin, a current receiving circuit electrically connected to the second pin and a comparing circuit electrically connected to the current receiving circuit. The voltage outputting circuit outputs a first current which flow into the current receiving circuit through the second pin. After receiving the first current, the current receiving circuit outputs an output current to the comparing circuit and the comparing circuit compares the output current and a reference current to output an output signal.

Abstract: An integrated circuit has a first pin, a voltage outputting circuit electrically connected to the first pin, a second pin, a current receiving circuit electrically connected to the second pin and a comparing circuit electrically connected to the current receiving circuit. The voltage outputting circuit outputs a first current which flow into the current receiving circuit through the second pin. After receiving the first current, the current receiving circuit outputs an output current to the comparing circuit and the comparing circuit compares the output current and a reference current to output an output signal.

Abstract: The display apparatus includes a LCD panel, a power module, a driving module, and a switch unit. The LCD panel includes several pixels. The power module is turned on to provide an operation voltage to the driving module based on a start signal. The power module includes a voltage stabilizing capacitor. The driving module includes a gate driver and a discharge resistor. The discharge resistor is connected between the voltage stabilizing capacitor and a ground terminal. The switch unit is electrically connected between the voltage stabilizing capacitor and the discharge resistor. When the switch unit is conducted, the voltage stabilizing capacitor is electrically connected to the discharge resistor through the switch unit, and residual electric charges in the voltage stabilizing capacitor are released to the ground terminal through the discharge resistor.

Abstract: An inductor mechanism includes a base member having two opposite side portions, a bottom portion, and an upper portion, a conductive coil member engaged in the base member and having two terminals extended toward the side portions of the base member, two conductive coverings attached to the side portions of the base member and electrically connected to the terminals of the coil member, and two electro-plated devices attached to the conductive coverings respectively. The electro-plated devices each include an inner layer attached onto the conductive covering, and one or more further layers attached onto the inner layer, the layers are made of copper, brass, nickel, tin, or silver, or the like.

Abstract: A method for making an inductor mechanism which includes a base member having two opposite side portions, a bottom portion, and an upper portion, a conductive coil member engaged in the base member and having two terminals extended toward the side portions of the base member, two conductive coverings are attached to the side portions of the base member and electrically connected to the terminals of the coil member, and two electro-plated devices are attached to the conductive coverings respectively. The electro-plated devices each include an inner layer attached onto the covering, and one or more further layers attached onto the inner layer, the layers are made of copper, brass, nickel, tin, or silver, or the like.

Abstract: A method for manufacturing an inductor includes a mold device having a mold cavity, disposing a coil member above the mold cavity of the mold device, filling metallic particles into the mold cavity of the mold device, forcing the coil member into the metallic particles to form a base member, applying two conductive coating members onto the base member and electrically connecting to the terminals of the coil member respectively, and attaching two conductive coverings onto the conductive coating members respectively and electrically connecting to the conductive coating members respectively for allowing the inductors to be quickly manufactured in a mass production.

Abstract: A method for manufacturing an inductor includes a mold device having a mold cavity, disposing a coil member above the mold cavity of the mold device, filling metallic particles into the mold cavity of the mold device, forcing the coil member into the metallic particles to form a base member, applying two conductive coating members onto the base member and electrically connecting to the terminals of the coil member respectively, and attaching two conductive coverings onto the conductive coating members respectively and electrically connecting to the conductive coating members respectively for allowing the inductors to be quickly manufactured in a mass production.

Abstract: A portable electronic device (200) includes a housing (20) and a digital camera module (30). The housing is configured for containing electronic components, and has an aperture (21) defined therethrough for allowing light to be transmitted therethrough. The aperture has a diameter which grows smaller from an outer side of the housing to an inner side of the housing. The digital camera module is mounted inside the inner side of the housing, and receives light transmitted from the aperture.

Abstract: A method for updating a firmware of a memory card is provided. The method includes: first, starting the memory card; then, determining whether there is a new firmware code or not in the nonvolatile memory; if it is determined that there is a new firmware code in the nonvolatile memory, then determining whether the new firmware code has been updated; if it is determined that the new firmware code has not been updated yet, then performing the firmware updating, and then performing the general operating procedure of the memory card. Therefore, instead of returning back to the memory card manufacturer, the user can conveniently update the memory card with a PC or a card reader.

Abstract: A wireless device with a remote control function. The wireless device comprises a wired I/O port, a switching circuit, a storage device, and a remote control circuit. The switching circuit, coupled with the wired I/O port, selectively operating in an audio mode or a data mode for inputing/outputing from the wired port. A set of control codes of an external electronic device is input into the storage device for storage through the wired I/O port in the data mode. When the wireless device is in a remote control mode, the remote control circuit reads out the set of control codes from the storage device and converts the set of control codes into a wireless signal to be transmitted through an antenna, and thereby the wireless device remotely controls the external electronic device in the remote control mode.

Abstract: An apparatus for dynamic derivatives desktops and methods of operating the same result in a dynamic derivatives desktop server for a CORBA (Common Object Request Broker Architecture) operating system that processes analytic requests without compromising the analytics of the analysis. The dynamic derivatives desktop server comprises an ORB (Object Request Broker) interface which receives an analytic request from the CORBA operating system. A Java applet coupled to the ORB interface having analytics which processes the analytic request to provide analytic results to the ORB interface.