Patents by Inventor Chien-Chih Wu
Chien-Chih Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240178536Abstract: A cross-coupling structure for dielectric cavity filters includes a base and a tuner. The base is communicated with plural resonant cavities, a side through hole and a blind hole, and has a first channel formed between two adjacent resonant cavities which are not used for producing cross-coupling, and a second channel the resonant cavities formed between two adjacent resonant cavities which are used for producing cross-coupling. The side through hole is penetrated through the base and communicated with the second channel. The blind hole is formed on a wall of the second channel and has an opening facing the side through hole. The tuner is entered into the second channel from the side through hole and extended into the blind hole and can be adjustably moved between the opening of the blind hole and the bottom of the blind hole to set a cross-coupling amount target value.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: Universal Microwave Technology, Inc.Inventors: TUNG-YI WU, SHENG-FENG YEH, WUN-KAI WU, SUNG-FAN LIU, CHIEN-CHIH LEE, JEN-TI PENG
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Publication number: 20240177905Abstract: A gapless ferrite structure for circulator or isolator includes a first base having a first flange and a first limit slot surrounded by the first flange, a second base having a second flange and a second limit slot surrounded by the second flange, a ferrite with two ends accommodated in the first limit slot and the second limit slot respectively, two limit magnets installed on the first base and the second base respectively and configured to be corresponsive to the ferrite to generate an attraction force on the ferrite, and two sealing units configured between an end of the ferrite and the first limit slot and between the other end of the ferrite and the second limit slot respectively. In this way, a gapless structure can be formed on a signal transmission path in a circulator or isolator.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: Universal Microwave Technology, Inc.Inventors: TUNG-YI WU, SHENG-FENG YEH, WUN-KAI WU, SUNG-FAN LIU, CHIEN-CHIH LEE, JEN-TI PENG
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Publication number: 20240148301Abstract: The present invention provides a smart wearable device, which is held on an upper body of a wearer by a plurality of contact pad sets, and has a connection unit, a first sensing module, a second sensing module, and an extension unit.Type: ApplicationFiled: November 7, 2022Publication date: May 9, 2024Inventors: Chien-Hsiang Chang, Yang-Cheng Lin, Wei-Chih Lien, Tseng-Ping Chiu, Pei-Yun Wu, Bo Liu
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Publication number: 20240128955Abstract: An integrated circuit includes a semiconductor substrate and a plurality of circuit elements in or on the substrate. The circuit elements are defined by standard layout cells selected from a cell library. The circuit elements including a plurality of flip-flops. Each flip-flop has a data input terminal, a data output terminal, a clock input terminal, and a clock output terminal. A first one of the flip-flops directly abuts a second flip-flop such that the clock output terminal of the first flip-flop electrically connects with the clock input terminal of the second flip-flop.Type: ApplicationFiled: April 24, 2023Publication date: April 18, 2024Inventors: Shao-Yu Steve Wang, Chien-Te Wu, Shang-Chih Hsieh, Nick Tsai
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Publication number: 20240102860Abstract: An apparatus includes a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage carries a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device. A method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.Type: ApplicationFiled: September 5, 2023Publication date: March 28, 2024Inventors: Cheng Chih HSIEH, Tien Chi WU, Ming-Long LEE, Yu-Hsuan LIN, Tsung-I LIN, Chien-Hao MA
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Patent number: 11937932Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.Type: GrantFiled: July 8, 2022Date of Patent: March 26, 2024Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITYInventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
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Patent number: 11177183Abstract: A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.Type: GrantFiled: July 8, 2019Date of Patent: November 16, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yan-Hong Liu, Chien-Chih Wu, Che-Fu Chen
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Publication number: 20210035834Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.Type: ApplicationFiled: October 19, 2020Publication date: February 4, 2021Inventors: Yan-Hong Liu, Chien-Chih Wu, Che-Fu Chen
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Patent number: 10811290Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.Type: GrantFiled: May 23, 2018Date of Patent: October 20, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yan-Hong Liu, Chien-Chih Wu, Che-Fu Chen
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Publication number: 20200091013Abstract: A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.Type: ApplicationFiled: July 8, 2019Publication date: March 19, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yan-Hong LIU, Chien-Chih WU, Che-Fu CHEN
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Publication number: 20190362994Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.Type: ApplicationFiled: May 23, 2018Publication date: November 28, 2019Inventors: Yan-Hong LIU, Chien-Chih WU, Che-Fu CHEN
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Patent number: 9947610Abstract: A semiconductor structure includes a semiconductor substrate, a dielectric layer, a buffer layer, at least one recess, and at least one conductor. The dielectric layer is present on the semiconductor substrate. The buffer layer is present between the semiconductor substrate and the dielectric layer. The recess extends into the semiconductor substrate through the dielectric layer and the buffer layer, in which the buffer layer has a removing rate with respect to an etching process for forming the recess. The removing rate of the buffer layer is between those of the semiconductor substrate and the dielectric layer. The conductor is present in the recess.Type: GrantFiled: January 28, 2016Date of Patent: April 17, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shiang-Chin Lu, Chien-Chih Wu, Jer-Shien Yang, Hung-Wen Chen
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Publication number: 20170221794Abstract: A semiconductor structure includes a semiconductor substrate, a dielectric layer, a buffer layer, at least one recess, and at least one conductor. The dielectric layer is present on the semiconductor substrate. The buffer layer is present between the semiconductor substrate and the dielectric layer. The recess extends into the semiconductor substrate through the dielectric layer and the buffer layer, in which the buffer layer has a removing rate with respect to an etching process for forming the recess. The removing rate of the buffer layer is between those of the semiconductor substrate and the dielectric layer. The conductor is present in the recess.Type: ApplicationFiled: January 28, 2016Publication date: August 3, 2017Inventors: Shiang-Chin LU, Chien-Chih WU, Jer-Shien YANG, Hung-Wen CHEN
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Publication number: 20130282332Abstract: A method of obtaining a linear curve fitting conversion equation for use with a non-linear measurement system is introduced. The linear curve fitting conversion equation converts a subject value entered into the non-linear measurement system into a measured value for simulating a linear curve. The method includes substituting a known preset input value, an output value generated by entering the preset input value into the non-linear measurement system, and n operator settings falling within the measurement range of the non-linear measurement system into a (n-1)th order polynomial to form simultaneous equations including a number n of polynomials and thereby obtain a fitting parameter for creating the linear curve fitting conversion equation for use with the non-linear measurement system, thereby dispensing with the hassles of processing a large amount of data required for creating a conversion rule.Type: ApplicationFiled: July 25, 2012Publication date: October 24, 2013Inventors: SHENG-HUI YANG, CHIEN-CHIH WU
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Publication number: 20120250829Abstract: A device for testing a function of a telephone exchange during a production process includes a sending-end module for sending a test criterion, a receiving-end module for receiving a test criterion, an input/output interface module connected to a telephone exchange, a call connection indicating unit, a signal switching unit, and a controlling unit for controlling a test procedure. The device not only tests whether a call can be connected and whether a call can be answered, but analyzes local electrical characteristics of the telephone exchange at the telephone exchange-end. With the device, signals treated by an analog-to-digital conversion process can display various voice information of a voice signal conveyed by the telephone exchange, such that a damaged portion of the telephone exchange can be assessed whenever a test fails, thereby cutting test costs and production costs.Type: ApplicationFiled: June 22, 2011Publication date: October 4, 2012Inventors: CHIEN-CHIH WU, CHING-FENG HSIEH
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Publication number: 20080182546Abstract: The invention relates to mobile phone capable of making internet calls, a system and a method for making internet calls via a computer by the same. The system includes a computer installed with communication software and a mobile phone capable of making internet calls. Moreover, via the system, the method includes the steps of: transmitting related data of a communication software to mobile phone capable of making internet calls by a computer, storing related data of the communication software in the mobile phone capable of making internet calls, and operating the communication software of the computer to phone or answer a phone according to related data of the communication software by the mobile phone. Therefore, the main objective of the invention is to enable users to phone anytime and anywhere easily and enable the information needed by users to be shown completely by a wireless handheld electronic device.Type: ApplicationFiled: January 25, 2008Publication date: July 31, 2008Applicant: ASUSTEK COMPUTER INC.Inventors: Yu-Ching Wang, Alexander Mou, Shiuan-Ming Chen, Chao-Hsien Lin, Chien-Chih Wu
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Publication number: 20080063746Abstract: An injection molding mechanism capable of shortening an injection molding process is generally applied to a processing process of a power cord, and comprises a material-feeding machine, a storage tank, a compression type material-supplying device, a conveying device and at least one robotic arm. The material-feeding machine, the storage tank and the compression type material-supplying device are arranged in series. The conveying device is a closed-loop conveying platform for conveying molds repeatedly. The robotic arm and the material-feeding machine are located above the conveyance path of the conveying device. In addition, the storage tank and the compression type material-supplying device are connected to the front end of the material-feeding machine to decrease the time spent on melting the plastic materials.Type: ApplicationFiled: September 11, 2006Publication date: March 13, 2008Inventor: Chien-Chih Wu
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Publication number: 20070070187Abstract: A television with a built-in digital video recording device includes: an image receiving unit, receiving digital images from external cameras; an audio/video processing unit, processing the digital images and sound signals picked up by microphones, and outputting audio/video signals; a storage unit, storing the audio/video signals; a central processing unit, receiving and processing the audio/video signals and external television signals; and a display unit, presenting the sound and images of the audio/video signals or the television signals. The television with a built-in digital video recording device of the present invention not only has amusement, security monitoring, and digital video recording functions simultaneously but also has small size and high space efficiency.Type: ApplicationFiled: December 5, 2005Publication date: March 29, 2007Inventors: Wu-Hung Lin, Chien-Chih Wu, Hsin-Chuan Liu