Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.

Abstract: The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

Abstract: An automated photomask storage and retrieval system includes a plurality of mobile storage units aligned in a first direction. Each mobile storage unit is movable in the first direction and includes a plurality of storage cells. A gantry is disposed over the plurality of mobile storage units. The gantry includes a supporting frame movable in the first direction. The plurality of mobile storage units interpose a pair of supporting members of the supporting frame. A beam connects the pair of supporting members and is movable along the pair of supporting members in a second direction perpendicular to the first direction. The beam includes a plurality of buffer cells. A robotic arm is disposed adjacent to the plurality of buffer cells and movable along the beam. The robotic arm is configured to transfer a container containing a photomask between a storage cell and a buffer cell.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.

Abstract: An automated photomask storage and retrieval system includes a plurality of mobile storage units aligned in a first direction. Each mobile storage unit is movable in the first direction and includes a plurality of storage cells. A gantry is disposed over the plurality of mobile storage units. The gantry includes a supporting frame movable in the first direction. The plurality of mobile storage units interpose a pair of supporting members of the supporting frame. A beam connects the pair of supporting members and is movable along the pair of supporting members in a second direction perpendicular to the first direction. The beam includes a plurality of buffer cells. A robotic arm is disposed adjacent to the plurality of buffer cells and movable along the beam. The robotic arm is configured to transfer a container containing a photomask between a storage cell and a buffer cell.

Abstract: The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: An automated photomask storage and retrieval system includes a plurality of mobile storage units aligned in a first direction. Each mobile storage unit is movable in the first direction and includes a plurality of storage cells. A gantry is disposed over the plurality of mobile storage units. The gantry includes a supporting frame movable in the first direction. The plurality of mobile storage units interpose a pair of supporting members of the supporting frame. A beam connects the pair of supporting members and is movable along the pair of supporting members in a second direction perpendicular to the first direction. The beam includes a plurality of buffer cells. A robotic arm is disposed adjacent to the plurality of buffer cells and movable along the beam. The robotic arm is configured to transfer a container containing a photomask between a storage cell and a buffer cell.

Abstract: The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

Abstract: A load port for a processing tool includes a carrier, a carrier actuator, an input table, an input table actuator, and a controller. The carrier has a plurality of cassette buffering spaces. The carrier is movable relative to the processing tool. The carrier actuator is operably connected to the carrier. The input table is configured to receive at least one cassette. The input table is movable relative to the carrier. The input table actuator is operably connected to the input table. The controller is configured to control the carrier actuator to move the carrier, such that one of the cassette buffering spaces is aligned with the input table, configured to control the input table actuator to move the input table with the cassette into the aligned cassette buffering space, and configured to control the input table to load the cassette into the aligned cassette buffering space.

Abstract: An automated photomask storage and retrieval system includes a plurality of mobile storage units aligned in a first direction. Each mobile storage unit is movable in the first direction and includes a plurality of storage cells. A gantry is disposed over the plurality of mobile storage units. The gantry includes a supporting frame movable in the first direction. The plurality of mobile storage units interpose a pair of supporting members of the supporting frame. A beam connects the pair of supporting members and is movable along the pair of supporting members in a second direction perpendicular to the first direction. The beam includes a plurality of buffer cells. A robotic arm is disposed adjacent to the plurality of buffer cells and movable along the beam. The robotic arm is configured to transfer a container containing a photomask between a storage cell and a buffer cell.

Abstract: A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.

Abstract: A load port for a processing tool includes a carrier, a carrier actuator, an input table, an input table actuator, and a controller. The carrier has a plurality of cassette buffering spaces. The carrier is movable relative to the processing tool. The carrier actuator is operably connected to the carrier. The input table is configured to receive at least one cassette. The input table is movable relative to the carrier. The input table actuator is operably connected to the input table. The controller is configured to control the carrier actuator to move the carrier, such that one of the cassette buffering spaces is aligned with the input table, configured to control the input table actuator to move the input table with the cassette into the aligned cassette buffering space, and configured to control the input table to load the cassette into the aligned cassette buffering space.

Abstract: A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.