Patents by Inventor Chien Hou
Chien Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984323Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.Type: GrantFiled: July 12, 2021Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
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Publication number: 20240103520Abstract: A method of controlling movement of an autonomous mobile apparatus including a driving module, a processor, and a positioning module includes steps of: the processor moving the autonomous mobile apparatus at a default speed from a first location toward a second location along a straight path; the positioning module obtaining data related to a current location; when the processor determines that a distance between the current location and the second location is greater than a predetermined distance, the processor obtaining a deviating direction and a minimum distance of the current location relative to the straight path; the processor setting a movement speed and an angular velocity based on the deviating direction, a tolerant distance, the minimum distance, and the default speed; and the processor controlling the driving apparatus to move the autonomous mobile apparatus at the movement speed and turning the autonomous mobile apparatus at the angular velocity.Type: ApplicationFiled: September 21, 2023Publication date: March 28, 2024Inventors: Chien-Tung CHEN, Chung-Hou WU, Chao-Cheng CHEN, Wen-Wei CHIANG
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Patent number: 11865666Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.Type: GrantFiled: December 19, 2022Date of Patent: January 9, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai, Yung-Cheng Lu
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Publication number: 20230405756Abstract: Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be used transport and/or carry substrates among various polishers and cleaners in a CMP tool while preventing the substrates from drying out during transportation. By keeping surfaces of the substrates wet during substrate waiting time or idle time in the CMP tool, embodiments of the present disclosure prevent many types of defects, such as byproducts, agglomerated abrasives, pad debris, slurry residues, from accumulate on the substrate surface during CMP processing, thus improve yields and device performance.Type: ApplicationFiled: May 24, 2022Publication date: December 21, 2023Inventors: Te-Chien HOU, Chih Hung CHEN, Kang HUANG, Wen-Pin LIAO, Shich-Chang SUEN, Kei-Wei CHEN
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Publication number: 20230398659Abstract: Polishing pads having varying protrusions and methods of forming the same are disclosed. In an embodiment, a polishing pad includes a polishing pad substrate; a first protrusion on the polishing pad substrate, the first protrusion including a central region and a peripheral region surrounding the central region, and a first hardness of the central region being greater than a second hardness of the peripheral region; and a first groove adjacent a first side of the first protrusion.Type: ApplicationFiled: August 29, 2022Publication date: December 14, 2023Inventors: Te-Chien Hou, Chih Hung Chen, Liang-Che Chen, Shich-Chang Suen, Liang-Guang Chen
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Publication number: 20230390882Abstract: Disclosed are a chemical mechanical polishing apparatus, a control method for the chemical mechanical polishing apparatus and a chemical mechanical polishing system. In one embodiment, the chemical mechanical polishing apparatus includes a polishing pad, a sensor, a polishing head and a conditioner. The sensor is configured to obtain surface roughness of the polishing pad. The polishing head is located above the polishing pad and configured to polish a wafer which is push against the polishing pad. The conditioner is located on the polishing pad and configured to recondition the polishing pad, wherein the conditioner is operated according to at least one polishing condition, and the polishing condition is tuned according to the surface roughness of the polishing pad.Type: ApplicationFiled: June 6, 2022Publication date: December 7, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Te-Chien Hou, Wen-Pin Liao, Chen-Chi Tang, Shich-Chang Suen, Kei-Wei Chen
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Publication number: 20230370120Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.Type: ApplicationFiled: July 26, 2023Publication date: November 16, 2023Applicant: PixArt Imaging Inc.Inventors: Mu-Tsung Lai, Tung-Ying Chiang, Chien-An Hou, Chia-Pei Chen
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Patent number: 11750247Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.Type: GrantFiled: January 26, 2022Date of Patent: September 5, 2023Assignee: PixArt Imaging Inc.Inventors: Mu-Tsung Lai, Tung-Ying Chiang, Chien-An Hou, Chia-Pei Chen
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Publication number: 20230239008Abstract: An inductor circuit includes a receiver inductive circuit, a transmitter inductive circuit, and an antenna inductive circuit which are implemented on a single chip die; the receiver inductive circuit is disposed on a specific ring of a specific plane to form a ring shape; the transmitter inductive circuit and the antenna inductive circuit are disposed inside the specific ring and surrounded by the specific ring of the specific plane; and, a circuit area, occupied by the transmitter inductive circuit, inside the specific ring and on the specific plane, is larger than a circuit area occupied by the receiver inductive circuit and by the antenna inductive circuit.Type: ApplicationFiled: January 26, 2022Publication date: July 27, 2023Applicant: PixArt Imaging Inc.Inventors: Mu-Tsung Lai, Tung-Ying Chiang, Chien-An Hou, Chia-Pei Chen
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Publication number: 20230125195Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.Type: ApplicationFiled: December 19, 2022Publication date: April 27, 2023Inventors: Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai, Yung-cheng Lu
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Publication number: 20230021149Abstract: Some implementations described herein relate to dispensing a slurry onto a polishing pad for a chemical-mechanical planarization (CMP) process. These implementations also involve rotating the polishing pad while the slurry is dispensed onto the polishing pad. Rotation of the polishing pad results in a traversal of the slurry radially outward toward a polishing pad outer edge of the polishing pad. The polishing pad includes a plurality of groove segments and a geometric patterns formed by the plurality of the groove segments impede the flow of the slurry to the polishing pad outer edge.Type: ApplicationFiled: November 2, 2021Publication date: January 19, 2023Inventors: Te-Chien HOU, Chih Hung CHEN, Shich-Chang SUEN, Liang-Guang CHEN, Wen-Pin LIAO, Kei-Wei CHEN
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Publication number: 20220415665Abstract: A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A pad conditioner conditions the pad during the process. An impurity removal system removes debris and impurities from the slurry.Type: ApplicationFiled: June 23, 2021Publication date: December 29, 2022Inventors: Te-Chien HOU, Po-Chin NIEN, Chih Hung CHEN, Ying-Tsung CHEN, Kei-Wei CHEN
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Patent number: 11529712Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.Type: GrantFiled: December 19, 2018Date of Patent: December 20, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai, Yung-Cheng Lu
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Publication number: 20220362906Abstract: A method includes measuring a first thickness at a first location of the polishing pad and a second thickness at a second location of the polishing pad; obtaining a first reference thickness at the first location of the polishing pad, wherein the first reference thickness is an average thickness of multiple thicknesses at the first location; obtaining a second reference thickness at the second location of the polishing pad, wherein the second reference thickness is an average thickness of multiple thicknesses at the second location; calculating a first thickness difference; calculating a second thickness difference; modifying a conditioning parameter value at the first location of the polishing pad; and sweeping a conditioner across a surface of the polishing pad; and applying a downforce or a sweeping speed to the conditioner that urges the conditioner against the first location of the polishing pad according to the modified conditioning parameter value.Type: ApplicationFiled: July 17, 2022Publication date: November 17, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shen-Nan LEE, Te-Chien HOU, Teng-Chun TSAI, Chung-Wei HSU, Chen-Hao WU
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Patent number: 11389928Abstract: A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.Type: GrantFiled: September 25, 2018Date of Patent: July 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shen-Nan Lee, Te-Chien Hou, Teng-Chun Tsai, Chung-Wei Hsu, Chen-Hao Wu
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Publication number: 20210343538Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.Type: ApplicationFiled: July 12, 2021Publication date: November 4, 2021Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
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Patent number: 11069533Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.Type: GrantFiled: July 18, 2019Date of Patent: July 20, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
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Publication number: 20210020449Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.Type: ApplicationFiled: July 18, 2019Publication date: January 21, 2021Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
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Publication number: 20190160628Abstract: A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.Type: ApplicationFiled: September 25, 2018Publication date: May 30, 2019Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shen-Nan LEE, Te-Chien HOU, Teng-Chun TSAI, Chung-Wei HSU, Chen-Hao WU
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Publication number: 20190126429Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.Type: ApplicationFiled: December 19, 2018Publication date: May 2, 2019Inventors: Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai, Yung-Cheng Lu