Patents by Inventor Chien-Hsiang Chen
Chien-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12002251Abstract: A method for inputting an image display information is provided, and the method comprises: taking a measurement result image of a measuring device to obtain an output image by a camera of a terminal device; transmitting the output image to a cloud server via a communication interface of the terminal device; and recognizing the output image to obtain a recognized matching result related to a recognized measurement value and a recognized measurement unit; and saving the recognized matching result via the cloud server.Type: GrantFiled: March 9, 2021Date of Patent: June 4, 2024Assignee: MEIYO MEDICAL TECHNOLOGY INCInventors: Hung-Wen Chen, Chien-Chung Liao, Hung-Hsiang Ku
-
Patent number: 11988625Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.Type: GrantFiled: December 23, 2020Date of Patent: May 21, 2024Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Cheng-Ping Chang, Chien-Hui Li, Chien-Hsun Wu, Tai-I Yang, Yung-Hsiang Chen
-
Publication number: 20240145433Abstract: A package structure includes a first die and a second die embedded in a first molding material, a first redistribution structure over the first die and the second die, a second molding material over portions of the first die and the second die, wherein the second molding material is disposed between a first portion of the first redistribution structure and a second portion of the first redistribution structure, a first via extending through the second molding material, wherein the first via is electrically connected to the first die, a second via extending through the second molding material, wherein the second via is electrically connected to the second die and a silicon bridge electrically coupled to the first via and the second via.Type: ApplicationFiled: January 4, 2023Publication date: May 2, 2024Inventors: Po-Yao Lin, Chia-Hsiang Lin, Chien-Sheng Chen, Kathy Wei Yan
-
Package structure comprising buffer layer for reducing thermal stress and method of forming the same
Patent number: 11961777Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.Type: GrantFiled: June 27, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao -
Publication number: 20240113429Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.Type: ApplicationFiled: August 16, 2023Publication date: April 4, 2024Applicant: PEGATRON CORPORATIONInventors: Chien-Yi Wu, Chao-Hsu Wu, Sheng-Chin Hsu, Chia-Hung Chen, Chih-Wei Liao, Hau Yuen Tan, Hao-Hsiang Yang, Shih-Keng Huang
-
Patent number: 11948497Abstract: A display device includes a plurality of sub-pixels. The sub-pixels include a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light emitting element and a first control circuit. The first control circuit is configured to provide a first driving current to the first light emitting element. The second sub-pixel includes a second light emitting element and a second control circuit. The second control circuit is configured to provide a second driving current to the second light emitting element. The first control circuit and the second control circuit are configured to differently control pulse amplitude of the first driving current and pulse amplitude of the second driving current, such that both of the first light emitting element and the second light emitting element emit at a target wavelength or a color point range (e.g. +/?1.5˜2 nm).Type: GrantFiled: August 30, 2021Date of Patent: April 2, 2024Assignee: Lextar Electronics CorporationInventors: Chih-Hao Lin, Chien-Nan Yeh, Jo-Hsiang Chen, Shih-Lun Lai
-
Patent number: 11909373Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.Type: GrantFiled: October 15, 2020Date of Patent: February 20, 2024Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLCInventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes
-
Publication number: 20240048255Abstract: A method for estimating distribution of wireless signal strength, selecting measuring locations to measure wireless signal strength and compensating estimated wireless signal strength is provided, wherein the method for estimating distribution of wireless signal strength estimates the wireless signal strength at an estimation location in accordance with a plurality of single-reflection paths started from a signal emitter, the method for selecting position for measuring wireless signal strength determines whether a signal measuring process should be performed at the specific location, and the method for compensating estimated wireless signal strength compensates an estimated wireless signal strength near a specific location in accordance with a signal strength value measured at the specific location.Type: ApplicationFiled: July 20, 2023Publication date: February 8, 2024Inventors: CHIA-SHUO YEH, CHIEN-HSIANG CHEN, JEN-HUNG YANG, SHIH-FANG AO
-
Publication number: 20240014016Abstract: A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Hsiang Chen, Ching-Horng Chen, Yen-Ji Chen, Cheng-Yi Huang, Chih-Shen Yang
-
Publication number: 20230391806Abstract: A phosphorus-containing compound of Formula (1) and a preparation method thereof are provided. The phosphorus-containing compound is a compound having a reactive functional group and containing a phosphorus atom in its structure. The preparation method includes: (1) reacting magnolol and phosphoryl chloride in a first alkaline environment to obtain an intermediate product; and (2) reacting the intermediate product and a benzenediol in a second alkaline environment to obtain the phosphorus-containing compound.Type: ApplicationFiled: May 23, 2023Publication date: December 7, 2023Inventors: Chien-Hsiang CHEN, Chun-Hsiung CHANG
-
Patent number: 11697711Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3?-dimethyl-5,5?-diethyl-4,4?-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.Type: GrantFiled: June 22, 2021Date of Patent: July 11, 2023Assignee: ELITE MATERIAL CO., LTD.Inventors: Chen-Yu Hsieh, Chien-Hsiang Chen, Yi-Fei Yu
-
Publication number: 20220380545Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3?-dimethyl-5,5?-diethyl-4,4?-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method.Type: ApplicationFiled: June 22, 2021Publication date: December 1, 2022Inventors: Chen-Yu HSIEH, Chien-Hsiang CHEN, Yi-Fei YU
-
Patent number: 11075104Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.Type: GrantFiled: August 27, 2019Date of Patent: July 27, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
-
Publication number: 20210111702Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.Type: ApplicationFiled: October 15, 2020Publication date: April 15, 2021Inventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes
-
Publication number: 20210066054Abstract: A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.Type: ApplicationFiled: July 14, 2020Publication date: March 4, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chien-Hsiang Chen, Ching-Horng Chen, Yen-Ji Chen, Cheng-Yi Huang, Chih-Shen Yang
-
Publication number: 20210066108Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.Type: ApplicationFiled: August 27, 2019Publication date: March 4, 2021Inventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
-
Patent number: 10845915Abstract: An electronic apparatus and a method for switching touch modes thereof are provided. A touch screen of the electronic apparatus has a plurality of touch modes. A current touch mode of the touch screen is one of the plurality of touch modes. The method includes the following steps. Firstly, the number of times a key module of the electronic apparatus is pressed is determined according to a pulse count of a trigger signal provided by the key module. Next, a first touch mode of the plurality of touch modes is looked up in a lookup table according to the number of times. Afterwards, the current touch mode of the touch screen is switched to the first touch mode.Type: GrantFiled: January 10, 2019Date of Patent: November 24, 2020Assignee: PEGATRON CORPORATIONInventors: Min-Shao Hsieh, Chih-Yung Li, Chien-Hsiang Chen, Jing-Rung Wang
-
Publication number: 20190212866Abstract: An electronic apparatus and a method for switching touch modes thereof are provided. A touch screen of the electronic apparatus has a plurality of touch modes. A current touch mode of the touch screen is one of the plurality of touch modes. The method includes the following steps. Firstly, the number of times a key module of the electronic apparatus is pressed is determined according to a pulse count of a trigger signal provided by the key module. Next, a first touch mode of the plurality of touch modes is looked up in a lookup table according to the number of times. Afterwards, the current touch mode of the touch screen is switched to the first touch mode.Type: ApplicationFiled: January 10, 2019Publication date: July 11, 2019Applicant: PEGATRON CORPORATIONInventors: Min-Shao Hsieh, Chih-Yung Li, Chien-Hsiang Chen, Jing-Rung Wang
-
Publication number: 20190140589Abstract: Embodiments relate to a computer device and a method for determining whether a solar energy panel array is abnormal. In the embodiments, the computer device uses a current power generation calculation model to calculate a set of current reference power generation parameters of the solar energy panel array according to a set of current environment parameters of the solar energy panel array. The computer device also defines a power generation indicator for the solar energy panel array according to a contrast between a set of current actual power generation parameters of the solar energy panel array and the set of current reference power generation parameters, and determines whether the solar energy panel array is abnormal according to the power generation indicator.Type: ApplicationFiled: January 10, 2018Publication date: May 9, 2019Inventors: Chia-shin YEN, Jen-Chih WANG, Chien-Hsiang CHEN
-
Patent number: D1024932Type: GrantFiled: March 10, 2022Date of Patent: April 30, 2024Assignee: WALSIN LIHWA CORPORATIONInventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin