Patents by Inventor Chien-Hsiang Huang

Chien-Hsiang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145919
    Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.
    Type: Application
    Filed: September 6, 2023
    Publication date: May 2, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Shih-Keng Huang, Chao-Hsu Wu, Chih-Wei Liao, Sheng-Chin Hsu, Hao-Hsiang Yang, Tse-Hsuan Wang
  • Publication number: 20240136191
    Abstract: A method of forming a semiconductor device includes forming source/drain regions on opposing sides of a gate structure, where the gate structure is over a fin and surrounded by a first dielectric layer; forming openings in the first dielectric layer to expose the source/drain regions; selectively forming silicide regions in the openings on the source/drain regions using a plasma-enhanced chemical vapor deposition (PECVD) process; and filling the openings with an electrically conductive material.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Min-Hsiu Hung, Chien Chang, Yi-Hsiang Chao, Hung-Yi Huang, Chih-Wei Chang
  • Patent number: 11955338
    Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Ru-Gun Liu, Chin-Hsiang Lin, Yu-Tien Shen
  • Patent number: 11955707
    Abstract: An antenna module includes first to third radiators and a ground radiator. The first radiator includes first and second sections and excites at a first frequency band. An extension direction of the first section, including a feeding end, is not parallel to an extension direction of the second section. The second radiator includes third and fourth sections. The third section extends from an intersection of the first and second sections. The third section excites at a second frequency band. The third radiator is disposed beside the first radiator and away from the second radiator. The ground radiator is disposed on one side of the first, second, and third radiators, and includes a ground end. The fourth section of the second radiator is connected to the third section and the ground radiator. The third radiator is connected to the ground end.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: April 9, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Chao-Hsu Wu, Hau Yuen Tan, Chien-Yi Wu, Shih-Keng Huang, Cheng-Hsiung Wu, Ching-Hsiang Ko
  • Publication number: 20240113429
    Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.
    Type: Application
    Filed: August 16, 2023
    Publication date: April 4, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Sheng-Chin Hsu, Chia-Hung Chen, Chih-Wei Liao, Hau Yuen Tan, Hao-Hsiang Yang, Shih-Keng Huang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20230386013
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 30, 2023
    Inventors: PEI-HSUAN LEE, CHIEN-HSIANG HUANG, KUANG-SHING CHEN, KUAN-HSIN CHEN, CHUN-CHIEH CHIN
  • Patent number: 11783469
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pei-Hsuan Lee, Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin
  • Patent number: 11264352
    Abstract: An electronic package structure and a chip thereof are provided. The electronic package structure includes a substrate, a chip, a plurality of signal wires, and a core ground wire. The chip disposed on and electrically connected to the substrate has a core wiring region and an input and output pad region located at a top surface thereof. The input and output pad region is located between the core wiring region and an edge of the chip. The chip includes a plurality of signal pads in the input and output region and a core ground pad adjacent to one of the signal pads. The core ground pad located in the core wiring region. The signal wires are respectively connected to the signal pads. The core ground wire connected to the core ground pad is adjacent to and shields one of the signal wires.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: March 1, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Ting-Ying Wu, Chien-Hsiang Huang, Chin-Yuan Lo, Chih-Wei Chang
  • Publication number: 20210304397
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Application
    Filed: June 11, 2021
    Publication date: September 30, 2021
    Inventors: PEI-HSUAN LEE, CHIEN-HSIANG HUANG, KUANG-SHING CHEN, KUAN-HSIN CHEN, CHUN-CHIEH CHIN
  • Patent number: 11037289
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: June 15, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pei-Hsuan Lee, Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin
  • Publication number: 20200402948
    Abstract: An electronic package structure and a chip thereof are provided. The electronic package structure includes a substrate, a chip, a plurality of signal wires, and a core ground wire. The chip disposed on and electrically connected to the substrate has a core wiring region and an input and output pad region located at a top surface thereof. The input and output pad region is located between the core wiring region and an edge of the chip. The chip includes a plurality of signal pads in the input and output region and a core ground pad adjacent to one of the signal pads. The core ground pad located in the core wiring region. The signal wires are respectively connected to the signal pads. The core ground wire connected to the core ground pad is adjacent to and shields one of the signal wires.
    Type: Application
    Filed: June 10, 2020
    Publication date: December 24, 2020
    Inventors: TING-YING WU, CHIEN-HSIANG HUANG, CHIN-YUAN LO, CHIH-WEI CHANG
  • Patent number: 10683834
    Abstract: A supercharging and stabilizing structure for an all terrain vehicle or a utility vehicle includes an engine body including a cylinder having an intake passage and an outtake passage. A supercharger includes a chamber having an inlet and an outlet. The supercharger further includes a duct at the inlet. An air accumulator is mounted between the cylinder and the supercharger and includes an air chamber. An input side of the air chamber intercommunicates with the outlet and the duct of the supercharger. An intake manifold is connected between an output side of the air chamber and the intake passage. When fuel is added into an engine, a control valve on the duct is closed. During fuel return or idling of the engine, the control valve is opened, and the inlet and the outlet of the supercharger, the air chamber, and the duct intercommunicate with each other to balance pressure.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: June 16, 2020
    Inventor: Chien-Hsiang Huang
  • Publication number: 20200134810
    Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
    Type: Application
    Filed: February 26, 2019
    Publication date: April 30, 2020
    Inventors: PEI-HSUAN LEE, CHIEN-HSIANG HUANG, KUANG-SHING CHEN, KUAN-HSIN CHEN, CHUN-CHIEH CHIN
  • Patent number: 10415518
    Abstract: A supercharger structure for an all terrain vehicle or a utility vehicle includes an engine body and a supercharging device. The engine body includes a cylinder having an intake passage and an outtake passage. The supercharging device includes a supercharger, a throttle, an intake manifold, and at least one nozzle. The supercharger includes a chamber having an inlet coupled with the throttle and an outlet connected to the intake manifold. The intake manifold and the at least one nozzle intercommunicate with the intake passage. The at least one nozzle is connected to a fuel supply pipe of a vehicle. External air is drawn in by a guiding device in the chamber, flows through the throttle and the inlet into the chamber, and is pressurized. The pressurized air flows through the intake manifold to mix with fuel ejected by the at least one nozzle and then enters the cylinder.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 17, 2019
    Inventor: Chien-Hsiang Huang
  • Patent number: 10397804
    Abstract: A wireless access point system includes a wireless access point (WAP) apparatus, a location-setting module, and a portable electronic device. The location-setting module stores a location list recording a location and an optimum direction corresponding to the location. The portable electronic device has a detection mode and a connection mode. In the detection mode, the portable electronic device controls the WAP apparatus to radiate a wireless signal and change the radiation direction within a specified direction range. The portable electronic device analyzes the wireless signal to obtain the optimum direction having an optimum signal receiving strength, so as to update the location list with the optimum direction and the location corresponding to the optimum direction. In the connection mode, the portable electronic device loads the optimum direction corresponding to the location and controls the radiation direction to be adjusted as the loaded optimum direction.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: August 27, 2019
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Zhong-Yu Guo, Min-Yuan Yang, Chien-Hsiang Huang
  • Publication number: 20190203679
    Abstract: A supercharging and stabilizing structure for an all terrain vehicle or a utility vehicle includes an engine body including a cylinder having an intake passage and an outtake passage. A supercharger includes a chamber having an inlet and an outlet. The supercharger further includes a duct at the inlet. An air accumulator is mounted between the cylinder and the supercharger and includes an air chamber. An input side of the air chamber intercommunicates with the outlet and the duct of the supercharger. An intake manifold is connected between an output side of the air chamber and the intake passage. When fuel is added into an engine, a control valve on the duct is closed. During fuel return or idling of the engine, the control valve is opened, and the inlet and the outlet of the supercharger, the air chamber, and the duct intercommunicate with each other to balance pressure.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventor: Chien-Hsiang Huang
  • Publication number: 20190203677
    Abstract: A supercharging and pressure accumulating structure for an all terrain vehicle or a utility vehicle includes an engine body including a cylinder having an intake passage and an outtake passage. A supercharger includes a chamber having an inlet and an outlet. An air accumulator is mounted between the cylinder and the supercharger and includes an air chamber. An input side of the air chamber intercommunicates with the outlet of the supercharger. An intake manifold is connected between an output side of the air chamber and the intake passage. Operation of the engine body actuates the supercharger to generate a supercharged air current. The supercharged air current is firstly introduced through the input side of the air accumulator into the air chamber, passes through the output side of the air accumulator into the intake manifold to mix with fuel ejected by at least one nozzle, and then enters the cylinder.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventor: Chien-Hsiang Huang
  • Publication number: 20190203678
    Abstract: A supercharger structure for an all terrain vehicle or a utility vehicle includes an engine body and a supercharging device. The engine body includes a cylinder having an intake passage and an outtake passage. The supercharging device includes a supercharger, a throttle, an intake manifold, and at least one nozzle. The supercharger includes a chamber having an inlet coupled with the throttle and an outlet connected to the intake manifold. The intake manifold and the at least one nozzle intercommunicate with the intake passage. The at least one nozzle is connected to a fuel supply pipe of a vehicle. External air is drawn in by a guiding device in the chamber, flows through the throttle and the inlet into the chamber, and is pressurized. The pressurized air flows through the intake manifold to mix with fuel ejected by the at least one nozzle and then enters the cylinder.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventor: Chien-Hsiang Huang
  • Publication number: 20190132748
    Abstract: A wireless access point system includes a wireless access point (WAP) apparatus, a location-setting module, and a portable electronic device. The location-setting module stores a location list recording a location and an optimum direction corresponding to the location. The portable electronic device has a detection mode and a connection mode. In the detection mode, the portable electronic device controls the WAP apparatus to radiate a wireless signal and change the radiation direction within a specified direction range. The portable electronic device analyzes the wireless signal to obtain the optimum direction having an optimum signal receiving strength, so as to update the location list with the optimum direction and the location corresponding to the optimum direction. In the connection mode, the portable electronic device loads the optimum direction corresponding to the location and controls the radiation direction to be adjusted as the loaded optimum direction.
    Type: Application
    Filed: January 3, 2018
    Publication date: May 2, 2019
    Inventors: Zhong-Yu Guo, Min-Yuan Yang, Chien-Hsiang Huang