Patents by Inventor Chien-Hsin Lai
Chien-Hsin Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6322057Abstract: An auxiliary gasline-heating unit is used in a chemical vapor deposition apparatus. The auxiliary gasline-heating unit serves to increase the exit temperature of the mixture of N2 gas and He-dilute gas in order to prevent TDMAT, Ti[N(CH3)2]4, from being condensed and becoming a gasline contaminant when the mixture mixes with the TDMAT and a carrier gas.Type: GrantFiled: May 22, 2000Date of Patent: November 27, 2001Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Fu-Yang Yu
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Publication number: 20010042930Abstract: An auxiliary gasline-heating unit is used in a chemical vapor deposition apparatus. The auxiliary gasline-heating unit serves to increase the exit temperature of the mixture of N2 gas and He-dilute gas in order to prevent TDMAT, Ti[N(CH3)2]4, from being condensed and becoming a gasline contaminant when the mixture mixes with the TDMAT and a carrier gas.Type: ApplicationFiled: July 20, 2001Publication date: November 22, 2001Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Fu-Yang Yu
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Patent number: 6307163Abstract: A chemical mixer tank calibrator and a calibrating method for the same. The chemical mixer tank calibrator calibrates the weight of the mixer tank through a step motor. Once the chemical in the mixer tank is used up, the mixer tank can be automatically filled with chemical. Thus, the chemical in the mixer tank can adequately supply the buffer tank and the machine at any given time.Type: GrantFiled: April 2, 1999Date of Patent: October 23, 2001Assignee: United Microelectronics Corp.Inventors: Chien-Hsin Lai, Fu-Yang Yu
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Patent number: 6293850Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.Type: GrantFiled: October 22, 1999Date of Patent: September 25, 2001Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Kun-Lin Wu, Daniel Chiu, Chih-Chiang Yang, Juan-Yuan Wu, Hao-Kuang Chiu
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Patent number: 6267654Abstract: A pad backer for a polishing head of a chemical mechanical polishing machine is described wherein scribe lines in the x-direction and in the y-direction are formed on the surface of the pad backer. Additional scribe lines are formed at angles of about 45 degrees and about 135 degrees from the x-direction scribe lines to increase the usage rate of the polishing pad.Type: GrantFiled: June 2, 2000Date of Patent: July 31, 2001Assignee: United Microelectronics Corp.Inventors: Chien-Hsin Lai, Jung-Nan Tseng, Huang-Yi Lin, Hui-Shen Shih
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Patent number: 6241582Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.Type: GrantFiled: September 18, 1998Date of Patent: June 5, 2001Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Kun-Lin Wu, Daniel Chiu, Chih-Chiang Yang, Juan-Yuan Wu, Hao-Kuang Chiu
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Patent number: 6234876Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.Type: GrantFiled: October 22, 1999Date of Patent: May 22, 2001Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Kun-Lin Wu, Daniel Chiu, Chih-Chiang Yang, Juan-Yuan Wu, Hao-Kuang Chiu
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Patent number: 6228420Abstract: A method to maintain a consistent thin film thickness deposited by chemical vapor deposition is described in which method a compensative coefficient K is provided. The initial preset deposition time T0 is multiplied by the compensative coefficient K to obtain an actual deposition time T, where T=K×T0. Using the actual deposition time T to conduct the deposition, the expected thickness of the thin film is obtained.Type: GrantFiled: October 20, 1999Date of Patent: May 8, 2001Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Hao-Kuang Chiu, Fu-Yang Yu
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Publication number: 20010000770Abstract: A wafer polishing head for planarizing a wafer. The wafer polishing head comprises a carrier, a retaining ring, a first pressure chamber, a second pressure chamber and an automatic control system. The retaining ring is surrounding the carrier. The first pressure chamber having a first inner pressure is disposed above the retaining ring. The second pressure chamber having a second inner pressure is disposed on the carrier. The automatic control system is respectively coupled to the first pressure chamber and the second pressure chamber.Type: ApplicationFiled: December 21, 2000Publication date: May 3, 2001Applicant: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Chia-Jui Chang
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Patent number: 6220930Abstract: A wafer polishing head for planarizing a wafer. The wafer polishing head comprises a carrier, a retaining ring, a first pressure chamber, a second pressure chamber and an automatic control system. The retaining ring is surrounding the carrier. The first pressure chamber having a first inner pressure is disposed above the retaining ring. The second pressure chamber having a second inner pressure is disposed on the carrier. The automatic control system is respectively coupled to the first pressure chamber and the second pressure chamber.Type: GrantFiled: January 14, 2000Date of Patent: April 24, 2001Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Chia-Jui Chang
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Patent number: 6206758Abstract: A method for increasing the working life of retaining rings in a chemical-mechanical polishing machine. The method includes adding an extra pad between a retaining ring and a carrier so that the retaining ring is prevented from slippage and pressure on wafer can be evenly spread over the polishing pad of a polishing machine. Therefore, the rate at which a retaining ring wears out in chemical-mechanical polishing operation can be greatly reduced, and the working life of a retaining ring can be doubled.Type: GrantFiled: July 13, 1998Date of Patent: March 27, 2001Assignee: United Microelectronics Corp.Inventors: Chien-Hsin Lai, Juen-Kuen Lin, Peng-Yih Peng
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Patent number: 6183350Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.Type: GrantFiled: October 22, 1999Date of Patent: February 6, 2001Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Kun-Lin Wu, Daniel Chiu, Chih-Chiang Yang, Juan-Yuan Wu, Hao-Kuang Chiu
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Patent number: 6165255Abstract: A chemical-liquid controlling apparatus is described. The chemical-liquid controlling apparatus is mounted between a chemical-liquid container and an exhaust apparatus. During a chemical-liquid refilling process, once the chemical liquid is drawn out of the container by the exhaust apparatus, the chemical liquid first enters the chemical-liquid controlling apparatus. The chemical-liquid controlling apparatus separates the chemical liquid from a nitrogen gas and a chemical gas. In addition, the chemical-liquid refilling process is stopped by a signal transmitted from a leak sensor.Type: GrantFiled: March 12, 1999Date of Patent: December 26, 2000Assignee: United Microelectronics Corp.Inventors: Chien-Hsin Lai, Peng-Yih Peng, Li-Min Chang, Fu-Yang Yu
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Patent number: 6129043Abstract: A gas tube with heating apparatus. The gas tube is applicable in a chemical vapor deposition machine. The gas comprises a gas circulating tube and a coaxial gas tube invaginating a gas transporting tube therein. A heater is installed in the gas circulating tube, while the coaxial tube is covered by a thermal insulating layer. In addition, a control valve, a pressure gauge, and a particle trap are installed in a gas supplying tube connecting with the gas circulating tube.Type: GrantFiled: February 25, 1999Date of Patent: October 10, 2000Assignee: United Microelectronics Corp.Inventors: Chien-Hsin Lai, Fu-Yang Yu
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Patent number: 6119294Abstract: An auto brush pressure cleaning system is described. The system includes a first pneumatic brush, a second pneumatic brush disposed to align with the first pneumatic brush adjacent and parallel to the first pneumatic brush, and a computer. The system also includes a first brush pressure regulator electrically coupled to the computer and transmitting a first and a second signal to the computer and a second brush pressure regulator coupled to the second pneumatic brush and the first brush pressure regulator through a first three-way valve and electrically coupled to the computer, wherein the second pneumatic brush transmits a third signal to the second brush pressure regulator and to the first brush pressure regulator and the second brush pressure regulator transmits a fourth signal to the computer.Type: GrantFiled: January 14, 1999Date of Patent: September 19, 2000Assignee: United Microelectronics Corp.Inventors: Chien-Hsin Lai, Juen-Kuen Lin, Kun-Lin Wu, Peng-Yih Peng
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Patent number: 6120366Abstract: The invention provides a chemical-mechanical polishing pad, which includes a plurality of annular grooves and a plurality of streamline grooves designed according to principles of the hydrodynamics. The streamline grooves of polishing pad are designed according to flow equations derived from source flow and vortex flow, and the streamline grooves of polishing pad uniformly distribute the slurry on the polishing pad. An angle and a depth of the streamline groove, which are calculated by boundary layer effect of the streamline groove function, are used to design an optimum structure for polishing pad.Type: GrantFiled: January 4, 1999Date of Patent: September 19, 2000Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Edward Yang, Kun-Lin Wu, Fu-Yang Yu
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Patent number: 6096162Abstract: A CMP machine includes several polishing tables mounted on a carousel, which rotates in one direction. Each of the polishing tables includes a polishing pad. Each polishing pad can polish one wafer on its first surface. Each polishing pad also has one distributing duct used to supply slurry onto the polishing pad. An exhaust duct is included to exhaust slurry, in which the exhaust duct has a first end and a second end. The first end of the exhaust duct is coupled to slurry. A regulating valve is included to regulate slurry exhaust. An exhaust pump is included to produce a exhausting force of slurry. The exhaust pump is coupled to the second end of the exhaust duct. A regulating valve controller is included to control the regulating valve.Type: GrantFiled: December 4, 1998Date of Patent: August 1, 2000Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Chia-Jui Chang
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Patent number: 6062963Abstract: A chemical-mechanical polishing machine having an improved wafer retainer ring design for the polishing head, comprising a polishing table, a polishing pad, a polishing head and a wafer retainer ring, wherein the polishing pad is above the polishing table, the polishing head is above the polishing pad, and the wafer retainer ring is mounted onto the polishing head. Improvement of the retainer ring design includes the formation of a plurality of guiding holes around the periphery of the retainer ring such that the guiding hole axis follows the centrifugal line produced by a rotating polishing head. Furthermore, the guiding hole has a gradual diffusing structure from the outer inlet to the inner outlet.Type: GrantFiled: April 14, 1998Date of Patent: May 16, 2000Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng, Hao-Kuang Chiu, Kun-Lin Wu
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Patent number: 6051139Abstract: A filtering device used to filter the slurry is disclosed, including a crossflow fan within the filter housing, and a driving mechanism relative to the crossflow fan under the filter housing to drive the crossflow fan spinning to agitate the slurry in the filter housing, so as to prevent the particles in the slurry from adhering to the surface of the filter. The filtering device further includes a spoiler between the crossflow fan and the filter, so that larger particles remain circulating somewhere between the tip of the spoiler and the crossflow fan, instead of flowing to the filter, to prolong the lifetime of the filter.Type: GrantFiled: August 31, 1998Date of Patent: April 18, 2000Assignee: United Microelectronics Corp.Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng
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Patent number: 6036356Abstract: An in-situ CMP slurry mixing apparatus. The apparatus comprises a tubular main body and a plurality of tapered plugs. The tubular main body further comprises a plurality of first tubes with a first diameter, a plurality of second tubes with a second diameter. Each tapered plug is placed in each second tube, the tips of each tapered plug are pointed in the same direction, and the tips are each oriented opposite to a flowing direction of a CMP slurry. In addition, the second diameter is larger than the first diameter, and a diameter of the base of each tapered plug is larger than the first diameter but is smaller than the second diameter.Type: GrantFiled: December 23, 1998Date of Patent: March 14, 2000Assignee: United Microelectronics Corp.Inventors: Ming-Sheng Yang, Chien-Hsin Lai, Chia-Jui Chang, Juan-Yuan Wu