Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: Present disclosure provides a FinFET structure, including a substrate, a fin protruding from the substrate, including a first portion and a second portion below the first portion, wherein the first portion includes a first dopant concentration of a dopant, and the second portion includes a second dopant concentration of the dopant, the second dopant concentration is greater than the first dopant concentration, a gate over the fin, wherein the second portion of the fin is below a bottom surface of the gate, and an insulating layer over the substrate and proximal to the second portion of the fin, wherein at least a first portion of the insulating layer includes a third dopant concentration of the dopant, the third dopant concentration is greater than the first dopant concentration.

Abstract: A shoe making method includes adhesion of an outsole and a midsole, and adhesion of a sole and a vamp. When the outsole and the midsole are attached, an upper adhesion surface of the outsole is processed by coating absorbent and by spraying powder adhesive, while a lower adhesion surface of the midsole is processed by spraying two-in-one primer, to achieve a one-side cementing. When the sole and the vamp are attached, an upper surface of the sole is processed by coating absorbent and by spraying powder adhesive, while a lower adhesion surface of the vamp is processed by spraying two-in-one primer, to achieve a one-side cementing. The powder adhesive is uncharged powder adhesive which is directly sprayed by a machine, without needing static attachment. The two-in-one primer is made of reinforcer and glue.

Abstract: A method of gluing a single surface of a shoe contains a first-stage processing and a second-stage processing. The first-stage processing includes a sole bonding having a first washing and polishing step, a first surface modifying step, a glue spraying step, and a sole adhering step. The second-stage processing includes a second washing and polishing step, a second surface modifying step, and an adhesive agent coating step. A vamp and sole processing includes a vamp treating step, a treatment agent coating step, and an adhesion forming step. A shoe midsole on which an adhesion promoter is sprayed and a shoe outsole on which adhesive glue is coated are adhered together to finish a shoe sole. The adhesive glue is coated on an upper surface of the shoe sole to adhere with a lower adhering surface of a vamp on which a treatment agent is coated, thus finishing a shoe.

Abstract: A method of gluing a single surface of a shoe contains a first-stage processing and a second-stage processing. The first-stage processing includes a sole bonding having a first washing and polishing step, a first surface modifying step, a glue spraying step, and a sole adhering step. The second-stage processing includes a second washing and polishing step, a second surface modifying step, and an adhesive agent coating step. A vamp and sole processing includes a vamp treating step, a treatment agent coating step, and an adhesion forming step. A shoe midsole on which an adhesion promoter is sprayed and a shoe outsole on which adhesive glue is coated are adhered together to finish a shoe sole. The adhesive glue is coated on an upper surface of the shoe sole to adhere with a lower adhering surface of a vamp on which a treatment agent is coated, thus finishing a shoe.

Abstract: A handheld device includes a touch panel, a speaker, and a processor. The touch panel is operable to detect the touched area generated by an object touching the touch panel. The speaker is operable to provide sounds. The processor is connected to the touch panel and the speaker and controls the volume of the sounds provided by the speaker based on the touched area. The processor decreases the volume of the sounds when the value of the touched area is lower than a first predetermined value, and the processor increases the volume of the sounds when the value of the touched area is high than a second predetermined value. Furthermore, a method for controlling the handheld device is disclosed herein.

Abstract: A mobile phone and a method for displaying measurement unit conversion tool thereof are provided. The method for displaying measurement unit conversion tool of the mobile phone includes the following steps. Firstly, a global positioning system (GPS) signal is captured. Next, a classification of measurement unit is obtained by analyzing the GPS signal. Then, at least a particular measurement unit is obtained according to the classification of measurement unit. Lastly, the particular measurement unit is displayed on the unit conversion tool.

Abstract: A liquid crystal display device installed in a panel having an accommodating cavity is provided. The liquid crystal display device includes a display screen, two sliding supporters and an actuator. The display screen has a display surface parallel to the panel. The two sliding supporters connect the display screen. The actuator is disposed on a frame accommodated in the accommodating cavity to drive the two sliding supporters and the display screen moving away from the panel horizontally from a horizontal position to a destination position.

Abstract: An electronic device includes a housing and a connector. The connector is disposed in the housing to allow an external connection plug to be connected thereto. The connector includes an electromagnetic switch module and a sensing module. The electromagnetic switch module includes a first switch to activate the electromagnetic switch to produce an electromagnetic force. The sensing module includes a sensing element. The sensing element is positioned to be moved by the electromagnetic force when the electromagnetic switch module is activated thereby separating the external connection plug from the connection port.

Abstract: A mobile phone and a method for displaying measurement unit conversion tool thereof are provided. The method for displaying measurement unit conversion tool of the mobile phone includes the following steps. Firstly, a global positioning system (GPS) signal is captured. Next, a classification of measurement unit is obtained by analyzing the GPS signal. Then, at least a particular measurement unit is obtained according to the classification of measurement unit. Lastly, the particular measurement unit is displayed on the unit conversion tool.

Abstract: System and method for carrier transportation management in a wafer fabrication facility (“fab”) are described.

Abstract: System and method for carrier transportation management in a wafer fabrication facility (“fab”) are described.