Patents by Inventor Chien-Hua Liu

Chien-Hua Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961814
    Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240096812
    Abstract: A method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. Encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. Electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. Removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee
  • Publication number: 20090002984
    Abstract: An illumination device having an optical element fixing structure is disclosed. The illumination device includes a plurality of light emitting diodes, a plurality of lenses and a supporter. The lenses are provided on the optical paths of the light emitting diodes, and each of the lenses has a guiding part. The supporter has a plurality of holding rooms. One side of the holding room has an embedded portion. The guiding part may be guided to the embedded portion to allow the body of the lens to be provided in the holding room.
    Type: Application
    Filed: June 26, 2008
    Publication date: January 1, 2009
    Applicant: AMA PRECISION INC.
    Inventors: Chien-Hua Liu, Chiu-Chia Chen
  • Publication number: 20080310155
    Abstract: An LED lighting device is disclosed. The LED lighting device includes a lampshade, a circuit board, edge lighting light emitting diodes (LEDs), and an optical film set. The lampshade has a bottom and a side wall connected to the periphery of the bottom. The other end of the side wall opposite to the bottom defines a light outlet section. The circuit board is provided at the lampshade. The edge lighting LEDs are disposed on the bottom of the lampshade and are electrically connected to the circuit board. Light emitted from each of the edge lighting LEDs is reflected by the lampshade and then exits the lighting device through the light outlet section. The optical film set is disposed at the light outlet section of the lampshade.
    Type: Application
    Filed: June 3, 2008
    Publication date: December 18, 2008
    Applicant: AMA PRECISION INC.
    Inventors: Heng-Chun Huang, Chien-Hua Liu
  • Publication number: 20080285273
    Abstract: An LED table lamp including a base, a holder, and a light emitting device is provided, wherein an end of the holder is connected to the base. The light emitting device includes a lampshade connected to the other end of the holder, multiple Lambertian LED light source assemblies, multiple side-emitting LED light source assemblies, a transparent support provided at the lampshade, and multiple brightness enhancement films (BEF). The lampshade has a side wall and a top wall connected the side wall, and the Lambertian LED light source assemblies and the side-emitting LED light source assemblies are disposed on the top wall. The BEFs are disposed on the transparent supports correspondingly to the Lambertian LED light source assemblies and are suitable to focus the light emitted from the Lambertian LED light source assemblies.
    Type: Application
    Filed: May 8, 2008
    Publication date: November 20, 2008
    Applicant: AMA PRECISION INC.
    Inventors: Chien-Hua Liu, Heng-Chun Huang