Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A multilayer foaming lamination includes a foaming layer and two skin layers provided on opposite sides of the foaming layer. The foaming layer includes a first material with apertures and second materials filled in the apertures respectively. The first material and the second material are made of different materials or are made of the same material but having different foaming conditions.

Abstract: A siphon protective thermoplastic polyurethane compound material having an intermediate fabric layer prepared from cotton, nylon, or polyester, a top covering layer of thermoplastic polyurethane film and a bottom covering layer of thermoplastic polyurethane film respectively covered on the top and bottom sides of the intermediate fabric layer, and a bonding layer prepared from alcohols having a total molecular weight below 100000 and respectively bonded in between the top and bottom sides of the intermediate fabric layer and the top and bottom cover layers of thermoplastic polyurethane film. The molecular weight of the alcohols is below 4000.