Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A memory structure including a substrate, a first doped region, a second doped region, a first gate, a second gate, a first charge storage structure, and a second charge storage structure is provided. The first gate is located on the first doped region. The second gate is located on the second doped region. The first charge storage structure is located between the first gate and the first doped region. The first charge storage structure includes a first tunneling dielectric layer, a first dielectric layer, and a first charge storage layer. The second charge storage structure is located between the second gate and the second doped region. The second charge storage structure includes a second tunneling dielectric layer, a second dielectric layer, and a second charge storage layer. The thickness of the second tunneling dielectric layer is greater than the thickness of the first tunneling dielectric layer.

Abstract: The present invention provides a preparation method for a fluorine-free water repellent, comprising (A) a homogenization step in which the raw materials are mixed in single step to obtain a mixture; and (B) a polymerization step to react said mixture into said water repellent. The operation of the present method is simple, and the water repellent produced has the advantage of high stability and high washing durability.

Abstract: The present invention provides a preparation method for a fluorine-free water repellent, comprising (A) a homogenization step in which the raw materials are mixed in single step to obtain a mixture; and (B) a polymerization step to react said mixture into said water repellent. The operation of the present method is simple, and the water repellent produced has the advantage of high stability and high washing durability.

Abstract: A backlight apparatus includes a guiding element and a light source disposed at one side of the guiding element. There is a plurality of reflective patterns at the bottom surface of the guiding element. Each reflective pattern is composed of at least one concavity and at least one convexity. The concavity is disposed at the rim around the convexity. As the light source emits light to the guiding element, the reflective area is increased by the concavity of the reflective pattern for increasing the reflecting effect and for distributing the brightness more uniformly, and thereby higher brightness and uniformity can be achieved.

Abstract: A method for patterning a light guide plate (LGP) is disclosed. The method includes a step of using laser beams to form a roughened surface on a mold, and a step of manufacturing the light guide plate with the mold so that a roughened surface containing micro-mirror structures is formed on the surface of the light guide plate.

Abstract: A backlight apparatus includes a guiding element and a light source disposed at one side of the guiding element. There is a plurality of reflective patterns at the bottom surface of the guiding element. Each reflective pattern is composed of at least one concavity and at least one convexity. The concavity is disposed at the rim around the convexity. As the light source emits light to the guiding element, the reflective area is increased by the concavity of the reflective pattern for increasing the reflecting effect and for distributing the brightness more uniformly, and thereby higher brightness and uniformity can be achieved.

Abstract: The present invention provides a method for forming microstructure optical elements. The method comprises providing a mold and forming a cavity in the mold according to the shape of microstructure optical elements. The cavity is formed a sealed space, which is vacuumed through an extraction opening arranged near the end of the cavity. Filling material into the cavity is to be formed the microstructure optical elements. Due to an extraction opening arranged near the end of filling process, the filling process is smooth so as to improve the element quality, manufacturing efficiency and transferability.

Abstract: A security monitoring system with addressable capability is provided. This system allows a plurality of video cameras to be connected to the security guard room via a single cable instead of a plurality of dedicated cables, as in the prior art. The security monitoring system comprises the following: a cable; a central control unit connected at the first end of the cable, capable of issuing a first signal; at least one addressable video camera connected at the second end of the cable connected to the central control unit; and a monitoring device for displaying a second signal. The addressable video camera receives the first signal from the central control unit and compares the first signal with a preset value; if these match, the addressable video camera sends out a second signal via the cable back to the central control unit. This second signal is then displayed on the monitoring device coupled to the monitor.

Abstract: A heat-radiating structure includes a closed container connected to an end of a thermal pipe that is connected at another end to a heat source. The closed container is made of a heat-conductive material and filled with heat-absorptive ethanol. Outer wall surfaces of the closed container may be provided with parallel ribs or other raised portions in different patterns to increase the contact area of the closed container with ambient air and thereby speed up heat radiation from the closed container. No other power-consuming cooling fan is needed to help the heat radiation from the closed container into the ambient environment.

Abstract: An addressable video camera has an ability to be assigned an address, that allows a security monitoring system utilizing a plurality of such addressable video cameras to be connected to the security guard room via a single cable. The addressable video camera includes the following: a video imaging device for generating a video signal; an amplifier for amplifying the output video signal; a switch connected between the amplifier and the input/output port of the addressable video camera; an address setting unit for presetting an address value to the addressable video camera; a sync signal detector which is capable of generating a demodulation enable signal in response to the received video control signal; a demodulator for demodulating the address signal in the video control signal; and a microprocessor capable of comparing the demodulated address data with the preset address value. If these match, the switch is turned to the conducting state and the video-imaging device is switched to active operation.