Abstract: A semiconductor device with densified dielectric structures and a method of fabricating the same are disclosed. The method includes forming a fin structure, forming an isolation structure adjacent to the fin structure, forming a source/drain (S/D) region on the fin structure, depositing a flowable dielectric layer on the isolation structure, converting the flowable dielectric layer into a non-flowable dielectric layer, performing a densification process on the non-flowable dielectric layer, and repeating the depositing, converting, and performing to form a stack of densified dielectric layers surrounding the S/D region.

Abstract: An electrically pumped photonic-crystal surface-emitting laser, the epitaxy structure has a first mesa, the first mesa has multiple air holes and forming a photonic crystal structure, the epitaxy structure further has a second mesa, the second mesa and photonic crystal structure is facing the same direction; a first metal electrode arranged on the insulating layer, and covering the photonic crystal structure; a second metal electrode arranged on the second mesa and protruding out of the groove, making the first metal electrode and the second metal electrode face the same direction; and further make the first metal electrode connect to the first connecting metal and make the second metal electrode connect to the second connecting metal for making the photonic crystal structure become flip chip.

Abstract: A semiconductor device and method for making the semiconductor device comprising a flash memory cell is provided. In accordance with some embodiments, the method includes: patterning a first gate material layer and a gate insulating film over a substrate, the first gate material layer comprising a first gate material, the gate insulating film disposed on the first gate material layer; forming a second gate material layer over the substrate, the gate insulating film, and side walls of the first gate material layer, the second gate material layer comprising a second gate material; etching the second gate material layer to expose the substrate and the gate insulating film and provide a portion of the second gate material layer along each of the side walls of the first gate material layer; and etching the gate insulating film and the first gate material layer so as to form a plurality of gate structures.

Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.

Abstract: A photonic crystal surface emitting laser device including at least one photonic crystal surface emitting laser unit is provided. The photonic crystal surface emitting laser unit includes a light-emitting layer, a photonic crystal layer, a doped semiconductor layer, and a diffractive grating. The light-emitting layer is configured to emit a light beam. The photonic crystal layer is disposed on one side of the light-emitting layer. The doped layer is disposed on another side of the light-emitting layer. The diffractive grating is disposed on the photonic crystal layer or the doped semiconductor layer.

Abstract: A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.

Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

Abstract: An accelerator for neural network computing includes hardware engines and a buffer memory. The hardware engines include a convolution engine and at least a second engine. Each hardware engine includes circuitry to perform neural network operations. The buffer memory stores a first input tile and a second input tile of an input feature map. The second input tile overlaps with the first input tile in the buffer memory. The convolution engine is operative to retrieve the first input tile from the buffer memory, perform convolution operations on the first input tile to generate an intermediate tile of an intermediate feature map, and pass the intermediate tile to the second engine via the buffer memory.

Abstract: A coil module includes a coil assembly, a first induction substrate, a second induction substrate and an adhesive element. The coil assembly has a winding axis. The coil assembly is disposed on the first induction substrate. The first induction substrate is disposed on the second induction substrate. The adhesive element covers the first induction substrate and the second induction substrate, and the adhesive element has a first adhesive portion and a second adhesive portion. When viewed in a direction perpendicular to the winding axis, the first adhesive portion and the second adhesive portion are located on different planes.

Abstract: A semiconductor device and method for making the semiconductor device comprising a flash memory cell is provided. In accordance with some embodiments, the method includes: patterning a first gate material layer and a gate insulating film over a substrate, the first gate material layer comprising a first gate material, the gate insulating film disposed on the first gate material layer; forming a second gate material layer over the substrate, the gate insulating film, and side walls of the first gate material layer, the second gate material layer comprising a second gate material; etching the second gate material layer to expose the substrate and the gate insulating film and provide a portion of the second gate material layer along each of the side walls of the first gate material layer; and etching the gate insulating film and the first gate material layer so as to form a plurality of gate structures.

Abstract: The present disclosure provides a method for detecting the focus of attention. The method includes: obtaining the face of a person in the first image, as well as the result of facial recognition; determining whether the distance between the person and the target is within an effective attention range; determining whether the face is frontal; determining whether the effective attention period is not shorter than a period threshold; detecting the focus of attention for the person to the target.

Abstract: An oral scanner including a heating element, a reflecting element and a temperature difference generating element is provided. The temperature difference generating element has a high temperature end and a low temperature end. The high temperature end is connected to the reflecting element to heat the reflecting element, and the low temperature end is connected to the heating element to cool the heating element.

Abstract: An air filtration system includes a main body having a flow path; a first filter portion provided on the flow path and having a first body portion; a plurality of protrusions distributed and disposed on the first body portion; and a plurality of first through holes passing through the first body portion and interposed between the adjacent protrusions; wherein when an external fluid flows in the flow path, the external fluid passes through the protrusions first and then passes through each of the first through holes, so that the flowing external fluid is hindered by the protrusions, and thus a flow velocity at a position adjacent to the protrusions is lower than a flow velocity flowing through the first through holes, thereby vortices are respectively generated between orifices of the first through holes and the adjacent protrusions.

Abstract: A surface-emitting laser including a cladding layer, an active region, a first grating, a plurality of second gratings, a first electrode, and a second electrode is provided. The active region is disposed on the cladding layer. The first grating is disposed on the active region. The second gratings are disposed on the active region and separately distributed among the first grating. A diffraction order of the first grating is different from a diffraction order of the second gratings. The first electrode is electrically connected to the cladding layer. The second electrode covers at least the first grating.

Abstract: A slit door assembly includes a door plate, a supporting arm including a first end coupled to the door plate and a second end away from the first end, and a linkage unit including a rod member and a pin member protruding from the rod member and connecting to the second end of the supporting arm. A fillet is disposed between the pin member and the rod member. A method of operating a slit door assembly includes receiving a door plate, receiving a supporting arm coupled to the door plate, and coupling a linkage unit to the supporting arm, wherein the linkage unit includes a pin member and a rod member, the pin member is protrudes from the rod member and having a fillet. The method further includes applying a first force to the linkage unit to move the door plate from a first position to a second position.

Abstract: A neural network (NN) processing unit includes an operation circuit to perform tensor operations of a given layer of a neural network in one of a first number representation and a second number representation. The NN processing unit further includes a conversion circuit coupled to at least one of an input port and an output port of the operation circuit to convert between the first number representation and the second number representation. The first number representation is one of a fixed-point number representation and a floating-point number representation, and the second number representation is the other one of the fixed-point number representation and the floating-point number representation.

Abstract: A detection structure and a detection method are provided. The method includes the following. A display backplane, a detection circuit board, and a detection light-emitting diode (LED) chip are provided. The detection circuit board is disposed on the display backplane, to connect a first detection line on the detection circuit board with a first contact electrode and connect a second detection line on the detection circuit board with a second contact electrode. A drive signal is output via the display backplane to the first detection line and the second detection line. A contact electrode pair on the display backplane corresponding to the detection LED chip is determined to be abnormal on condition that the detection LED chip is unlighted.

Abstract: A detection method and a detection structure for a display backplane is provided in the disclosure. The detection method includes the following. The display backplane is provided. The display backplane is provided with a contact electrode pair. A detection structure is provided. The detection structure includes a light-emitting element and a detection circuit configured to conduct an electrical signal to the light-emitting element. The detection structure is assembled on the display backplane to connect the detection circuit to the contact electrode pair. A drive electrical signal is outputted to the contact electrode pair. If the light-emitting element does not emit light, the contact electrode pair is determined as a fault point.

Abstract: A detection method and a detection structure for a display backplane are provided. The method includes the following. The display backplane is provided. The display backplane is provided with multiple contact electrode pairs each of which includes an input electrode and an output electrode. The detection structure is provided. The detection structure includes multiple light-emitting elements and multiple detection circuits. Each two of the detection circuits are connected with at least one of the light-emitting elements and configured to conduct an electrical signal to the at least one of the light-emitting elements connected. The detection structure is assembled on the display backplane A drive electrical signal is outputted to the display backplane. The contact electrode pair to which the input electrode connected with the detection circuit belongs is determined as a fault point on condition that the light-emitting element does not emit light.

Abstract: A slit door assembly includes a door plate; a supporting arm including a first end coupled to the door plate and a second end away from the first end; and a linkage unit including a rod member and a pin member protruding from the rod member and connecting to the second end of the supporting arm. A fillet is disposed between the pin member and the rod member. A method of operating a slit door assembly includes receiving a door plate; receiving a supporting arm coupled to the door plate; and coupling a linkage unit to the supporting arm, wherein the linkage unit includes a pin member and a rod member, the pin member is protrudes from the rod member and having a fillet. The method further includes applying a first force to the linkage unit to move the door plate from a first position to a second position.