Abstract: A method for fabricating a semiconductor device includes the steps of providing a substrate having a high electron mobility transistor (HEMT) region and a capacitor region, forming a first mesa isolation on the HEMT region and a second mesa isolation on the capacitor region, forming a HEMT on the first mesa isolation, and then forming a capacitor on the second mesa isolation.

Abstract: Provided is a peptide and method in preventing or treating infections caused by a wide spectrum of pathogens, including bacteria and fungus in hosts such as plants and animals. Methods of preventing or treating plant diseases and infection in animals are also provided.

Abstract: A magnetoresistive random access memory (MRAM) includes a first transistor and a second transistor on a substrate, a source line coupled to a first source/drain region of the first transistor, and a first metal interconnection coupled to a second source/drain region of the first transistor. Preferably, the first metal interconnection is extended to overlap the first transistor and the second transistor and the first metal interconnection further includes a first end coupled to the second source/drain region of the first transistor and a second end coupled to a magnetic tunneling junction (MTJ).

Abstract: A packaging substrate assembly for fabricating a packaged module can include a packaging substrate having a surface, and an array of conductive pads implemented on the surface. The assembly can further include a conductive post formed over each conductive pad, with the conductive post including a first portion having a lateral dimension formed over the conductive pad and a second portion having a lateral dimension formed over the first portion. In some embodiments, the lateral dimension of the first portion is less than the lateral dimension of the second portion. In some embodiments, a dielectric layer can be implemented over the surface to cover the conductive pads and surround the first portion of each conductive post.

Abstract: A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.

Abstract: A holder of a portable electric device includes a main body formed integrally. The main body has an intermediate portion formed with a recessed wire-collecting portion, having one end provided with a holding portion having an outer wall disposed with a crevice and a wire-positioning hole bored under the crevice, and another end formed with a clamping portion having an outer wall cut with a clamping opening, a crevice, and a wire-positioning hole bored inside the crevice. Thus, the clamping opening can clamp the portable electric device and the holding portion can be fixed on a table top to have the portable electric device positioned obliquely at an appropriate angle for facilitating browsing and operating. Further, the wires of the portable electric device or of its peripheral products can be positioned in the wire-collecting holes and orderly wound on the wire-collecting portion.

Abstract: A wireless light indication and control device connected with a helmet is provided. The wireless light indication and control device includes a direction detector, a wireless transmitter, and at least one light element, wherein the direction detector senses a movement of the helmet to generate a turning signal, the wireless transmitter receives the turning signal and cooperates with a frequency hopping unit and a matching unit to generate a wireless signal, and the light element includes a wireless receiver for receiving the wireless signal. As the user wears the helmet of the present invention, the light can generate warning effect based on the movement of the helmet, so as to provide the user a more comprehensive traffic safety.

Abstract: A wireless light indication and control device connected with a helmet is provided. The wireless light indication and control device includes a direction detector, a wireless transmitter, and at least one light element, wherein the direction detector senses a movement of the helmet to generate a turning signal, the wireless transmitter receives the turning signal and cooperates with a frequency hopping unit and a matching unit to generate a wireless signal, and the light element includes a wireless receiver for receiving the wireless signal. As the user wears the helmet of the present invention, the light can generate warning effect based on the movement of the helmet, so as to provide the user a more comprehensive traffic safety.

Abstract: A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.

Abstract: A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.

Abstract: A method of activating a non-conductive substrate for use in electroless deposition is proposed, in which an aqueous solution containing nanoparticles of noble metals and their alloys is used as an activation solution in an electroless plating process, so as to electrolessly deposit a conductive metal deposition on the substrate and into micrometer-sized trenches formed on the substrate. By using this method with provision of a solution of a copper or nickel salt, copper or nickel can be deposited on the non-conductive substrate, allowing high aspect-ratio trenches on the substrate to be filled with copper or nickel for subsequent use in fabrication of integrated circuit interconnection.

Abstract: A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.