Abstract: The present invention provides an adaptive temperature slope calibration method of a thermal sensor, wherein the method includes the steps of: obtaining a parameter of the thermal sensor under a temperature environment; calibrating a temperature slope of the thermal sensor by using the parameter of the thermal sensor obtained under the temperature environment without using parameter(s) of the thermal sensor under other temperature environment(s); and storing the temperature slope of the thermal sensor for subsequent use of detecting temperature.

Abstract: The present invention provides a processing circuit including logic cells and a thermal sensor. The thermal sensor is positioned within the logic cells and surrounded by the logic cells, and the logic cells and the thermal sensor are all implemented by core devices.

Abstract: An audio processing device is provided. The audio processing device includes a shaper. The shaper receives a digital input audio signal and generates an output audio signal at an output terminal according to the digital input audio signal. The shaper includes a gain adjustment unit and a shaping unit. The gain adjustment unit receives the digital input audio signal and adjusts the digital input audio signal to generate a gained audio signal. The shaping unit receives the gained audio signal. When the shaper operates in a first mode, the shaping unit shapes an envelope of the gained audio signal to generate a shaped audio signal, and the shaped audio signal serves as the output audio signal.

Abstract: A semiconductor device includes at least a die carried by a substrate, a plurality of bond pads disposed on the die, a plurality of conductive components, and a plurality of bond wires respectively connected between the plurality of bond pads and the plurality of conductive components. The plurality of bond pads respectively correspond to a plurality of signals, and include a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal. The plurality of conductive components include a first conductive component and a second conductive component. The first conductive component is bond-wired to the first bond pad, and the second conductive component is bond-wired to the second bond pad. The first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components, and the first signal is asserted when the second signal is asserted.

Abstract: An audio processing device is provided. The audio processing device includes a shaper. The shaper receives a digital input audio signal and generates an output audio signal at an output terminal according to the digital input audio signal. The shaper includes a gain adjustment unit and a shaping unit. The gain adjustment unit receives the digital input audio signal and adjusts the digital input audio signal to generate a gained audio signal. The shaping unit receives the gained audio signal. When the shaper operates in a first mode, the shaping unit shapes an envelope of the gained audio signal to generate a shaped audio signal, and the shaped audio signal serves as the output audio signal.

Abstract: A semiconductor device includes at least a die carried by a substrate, a plurality of bond pads disposed on the die, a plurality of conductive components, and a plurality of bond wires respectively connected between the plurality of bond pads and the plurality of conductive components. The plurality of bond pads respectively correspond to a plurality of signals, and include a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal. The plurality of conductive components include a first conductive component and a second conductive component. The first conductive component is bond-wired to the first bond pad, and the second conductive component is bond-wired to the second bond pad. The first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components, and the first signal is asserted when the second signal is asserted.