Patents by Inventor Chien-Shiung Tzou

Chien-Shiung Tzou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Design of hardware features to facilitate arc-spray coating applications and functions
    Patent number: 6797131
    Abstract: A method and apparatus for forming a coating on a sputter chamber workpiece. The apparatus generally includes a sputter chamber having at least one workpiece. The at least one workpiece generally includes one or more trenches formed therein, the trenches being configured to define an arc spray coating region. The method generally includes forming one or more trenches in the workpiece, the trenches defining a coating region and applying a metal coating to the coating region by arc spraying.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: September 28, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Alan Barry Liu, Chien-Shiung Tzou, James Tsung
  • Design of hardware features to facilitate arc-spray coating applications and functions
    Publication number: 20040089542
    Abstract: A method and apparatus for forming a coating on a sputter chamber workpiece. The apparatus generally includes a sputter chamber having at least one workpiece. The at least one workpiece generally includes one or more trenches formed therein, the trenches being configured to define an arc spray coating region. The method generally includes forming one or more trenches in the workpiece, the trenches defining a coating region and applying a metal coating to the coating region by arc spraying.
    Type: Application
    Filed: November 12, 2002
    Publication date: May 13, 2004
    Applicant: Applied Materials,Inc.
    Inventors: Alan Barry Liu, Chien-Shiung Tzou, James Tsung
  • Substrate support with multilevel heat transfer mechanism
    Patent number: 6506291
    Abstract: A substrate support having heat transfer enhancing topography. Generally, the substrate support includes a first side that supports the substrate and a second side. A ring and a plurality of substrate support pads project from the first side. The ring is disposed proximate the perimeter of the substrate support. A fluid passage is disposed through the substrate support and is coupled to a well disposed in the first side. A plurality of gas flow channels are disposed in the first side and orientated radially outward from the well to a perimeter channel disposed radially inward and adjacent to the ring.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: January 14, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Cheng-Hsiung Tsai, Chien-Shiung Tzou
  • SUBSTRATE SUPPORT WITH MULTILEVEL HEAT TRANSFER MECHANISM
    Publication number: 20020189940
    Abstract: A substrate support having heat transfer enhancing topography. Generally, the substrate support includes a first side that supports the substrate and a second side. A ring and a plurality of substrate support pads project from the first side. The ring is disposed proximate the perimeter of the substrate support. A fluid passage is disposed through the substrate support and is coupled to a well disposed in the first side. A plurality of gas flow channels are disposed in the first side and orientated radially outward from the well to a perimeter channel disposed radially inward and adjacent to the ring.
    Type: Application
    Filed: June 14, 2001
    Publication date: December 19, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Cheng-Hsiung Tsai, Chien-Shiung Tzou