Abstract: The present disclosure provides a wireless charging coil, and the wireless charging coil comprises a first coil layer, a second coil layer and a first magnetic material. The second coil layer is stacked in parallel on a surface of the first coil layer to form a stacked structure, and it has a winding path identical to a winding path of the first coil layer. The first magnetic material is disposed on one side of the first coil layer and has a winding path which is different from the winding path of the first coil layer and with said side away from the second coil layer. Currents generated by a power source are evenly distributed in the stack structure to reduce a skin effect when the wireless charging coil is electrically connected to the power source.

Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.

Abstract: A wireless charging coil structure with a function of heat dissipation comprises a first connecting terminal, a second connecting terminal and a coil. The coil is disposed between the first connecting terminal and the second connecting terminal, and configured to transmit a signal between the first connecting terminal and the second connecting terminal. The coil comprises a heat-pipe segment and a transmission segment electrically and heat-conductively connected with each other. The transmission segment has a predetermined thickness, the heat-pipe segment encircles an accommodating space, and a heat-dissipating medium is disposed in the accommodating space.

Abstract: An integrated circuit includes a semiconductor substrate and a plurality of circuit elements in or on the substrate. The circuit elements are defined by standard layout cells selected from a cell library. The circuit elements including a plurality of flip-flops. Each flip-flop has a data input terminal, a data output terminal, a clock input terminal, and a clock output terminal. A first one of the flip-flops directly abuts a second flip-flop such that the clock output terminal of the first flip-flop electrically connects with the clock input terminal of the second flip-flop.

Abstract: An integrated circuit includes a semiconductor substrate and a plurality of circuit elements in or on the substrate. The circuit elements are defined by standard layout cells selected from a cell library. The circuit elements including a plurality of flip-flops. Each flip-flop has a data input terminal, a data output terminal, a clock input terminal, and a clock output terminal. A first one of the flip-flops directly abuts a second flip-flop such that the clock output terminal of the first flip-flop electrically connects with the clock input terminal of the second flip-flop.

Abstract: Systems, methods, and devices are described herein for a deterministic approach that includes receiving an original layout of a semiconductor device that has a number of layers. A violation of a first design rule associated with a first layer of the number of layers is identified. A design rule compilation includes a plurality of design rules associated with each layer of the number of layers. A plurality of derived layers are generated based upon the plurality of design rules. Each derived layer of the plurality of derived layers includes one or more layers of the number of layers of the semiconductor device in which a physical movement to one layer impacts another layer. A forbidden region associated with a second layer of the plurality of layers is designated. A new layout of the number of layers having oriented differently than the original layout is generated such that no layer protrudes within the forbidden region.

Abstract: Systems, methods, and devices are described herein for a deterministic approach that includes receiving an original layout of a semiconductor device that has a number of layers. A violation of a first design rule associated with a first layer of the number of layers is identified. A design rule compilation includes a plurality of design rules associated with each layer of the number of layers. A plurality of derived layers are generated based upon the plurality of design rules. Each derived layer of the plurality of derived layers includes one or more layers of the number of layers of the semiconductor device in which a physical movement to one layer impacts another layer. A forbidden region associated with a second layer of the plurality of layers is designated. A new layout of the number of layers having oriented differently than the original layout is generated such that no layer protrudes within the forbidden region.

Abstract: An integrated circuit includes a semiconductor substrate and a plurality of circuit elements in or on the substrate. The circuit elements are defined by standard layout cells selected from a cell library. The circuit elements including a plurality of flip-flops. Each flip-flop has a data input terminal, a data output terminal, a clock input terminal, and a clock output terminal. A first one of the flip-flops directly abuts a second flip-flop such that the clock output terminal of the first flip-flop electrically connects with the clock input terminal of the second flip-flop.

Abstract: The present disclosure provides a wireless charging coil, and the wireless charging coil comprises a first coil layer, a second coil layer and a first magnetic material. The second coil layer is stacked in parallel on a surface of the first coil layer to form a stacked structure, and it has a winding path identical to a winding path of the first coil layer. The first magnetic material is disposed on one side of the first coil layer and has a winding path which is different from the winding path of the first coil layer and with said side away from the second coil layer. Currents generated by a power source are evenly distributed in the stack structure to reduce a skin effect when the wireless charging coil is electrically connected to the power source.

Abstract: A punching process for wireless charging coils comprises: punching a metal piece for forming a coil structure and a fixing element, the coiling structure having a plurality of coil segments, a gap being between two of the plurality of coil segments, and the fixing element connecting the coil segments for keeping the width of the gap.

Abstract: A wireless charging coil structure with a function of heat dissipation comprises a first connecting terminal, a second connecting terminal and a coil. The coil is disposed between the first connecting terminal and the second connecting terminal, and configured to transmit a signal between the first connecting terminal and the second connecting terminal. The coil comprises a heat-pipe segment and a transmission segment electrically and heat-conductively connected with each other. The transmission segment has a predetermined thickness, the heat-pipe segment encircles an accommodating space, and a heat-dissipating medium is disposed in the accommodating space.

Abstract: A magnetic electronic device includes a first body and a second body. The first body includes a first case and a magnetic member inside the first case. The second body includes a second case and includes a magnetic sensor, a magnetism guiding member and a switch control component inside the second case. The second case is connected to the first body to be movable relative to the first body. The magnetic sensor is disposed on the magnetism guiding member, and the switch control component is electrically connected to the magnetic sensor. The magnetism guiding member guides the magnetic field caused by the magnetic member, and the magnetic sensor detects the magnetic flux caused by the magnetic member. When the magnetic flux is larger than a first value, the switch control component switches a component's switch.

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed.

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed.

Abstract: A root assembly includes an implant body and a positioning device connected to the implant body. The implant body has a positioning hole formed through one end thereof and an engaging portion opposite to the positioning hole. The positioning hole has an end edge. The positioning device has a positioning seat where an artificial tooth is attached and a positioning unit extending through and out of the positioning seat. A first recognition portion is formed on the positioning seat. The location of the first recognition portion of the positioning seat corresponding to the end edge of the positioning hole can recognize that the positioning device is exactly positioned on the implant body, thereby preventing the positioning device from loosening.

Abstract: An orthodontic structure includes a body where at least one connecting hole is formed, a fastening part disposed on the body and fastened to an implant, and at least one traction assembly connected to the body. The traction assembly includes an orthodontic table and an adjustment part extending outwards from the orthodontic table to engage the connecting hole. The orthodontic table has at least one locking recess capable of holding a metal wire in place. The orthodontic structure is connected to the implant which is embedded in an alveolar bone in advance to provide a requisite anchorage effect required by orthodontics. Thus, the implant treatment and the orthodontic treatment can be concurrently executed to shorten the treatment time for straightening teeth and attain good implanting and straightening effects.

Abstract: An orthodontic structure includes a body where at least one connecting hole is formed, a fastening part disposed on the body and fastened to an implant, and at least one traction assembly connected to the body. The traction assembly includes an orthodontic table and an adjustment part extending outwards from the orthodontic table to engage the connecting hole. The orthodontic table has at least one locking recess capable of holding a metal wire in place. The orthodontic structure is connected to the implant which is embedded in an alveolar bone in advance to provide a requisite anchorage effect required by orthodontics. Thus, the implant treatment and the orthodontic treatment can be concurrently executed to shorten the treatment time for straightening teeth and attain good implanting and straightening effects.