Abstract: An electronic device is provided and includes a substrate, a first contact pad, a second contact pad, an electronic element, and a third contact pad. The first contact pad and the second contact pad are disposed on the substrate. The electronic element is located above the substrate and electrically connected to the first contact pad and the second contact pad. The third contact pad is electrically connected to the first contact pad. A test method for an electronic device is also provided.

Abstract: An electronic device includes a display panel, a backlight source, an ambient light sensor, and a controller. The backlight source is disposed below the display panel and includes light-emitting units. The ambient light sensor detects the brightness of the ambient light. The controller judges the modes of the electronic device according to the detecting results of the ambient light sensor. When the electronic device is in a low-brightness mode, the brightness of a white frame of the display panel is greater than 0 nit and less than or equal to 50 nits, and in a general mode, the brightness of the white frame of the display panel is greater than 50 nits. The backlight source includes a local dimming function. When in the low-brightness mode, the local dimming function is in a first mode. When in the general mode, the local dimming function is in a second mode.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units and a reflective structure. The plurality of light-emitting units are electrically connected to the driving substrate. The reflective structure is disposed adjacent to the plurality of light-emitting units. The reflective structure includes a first reflective element. The first reflective element has a first surface, and the first surface is adjacent to at least one of the plurality of light-emitting units. There is a first distance between an edge of the bottom of the first surface and an edge of the driving substrate. The first distance is greater than 0 mm and less than 10 mm.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a light-emitting unit, and a reflective structure. The driving substrate includes a contact. The light-emitting unit is disposed on the driving substrate and electrically connected to the contact. The reflective structure is disposed on the driving substrate. Wherein the reflective structure includes a first insulating layer, a metal layer, and a second insulating layer, and the metal layer is disposed between the first insulating layer and the second insulating layer.

Abstract: Disclosed are an electronic device and another electronic device. The electronic device includes a circuit substrate, a conductive adhesive, a driving element and a first protective layer. The circuit substrate includes a connection pad. The conductive adhesive covers the connection pad. The driving element is arranged on the connection pad, and is electrically connected to the circuit substrate through the conductive adhesive. Another electronic device includes a circuit substrate, a first electronic unit, a second electronic unit, and a first protective layer. The first electronic unit is arranged on the circuit substrate and has two side walls. The second electronic unit is arranged on the circuit substrate and has two side walls. The first protective layer at least surrounds a part of both side walls of the first electronic unit and a part of both side walls of the second electronic unit.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units, and a protective layer. The light-emitting units are electrically connected to the driving substrate. The protective layer covers the light-emitting units, and the protective layer has a Young's modulus less than or equal to 20 MPa.

Abstract: An electronic device includes a substrate; a first bonding pad and a second bonding pad disposed on the substrate; an electronic assembly on the substrate; a first conductive structure; and a second conductive structure. The electronic assembly includes a third bonding pad and a fourth bonding pad. The third bonding pad is electrically connected to the first bonding pad by the first conductive structure and the fourth bonding pad is electrically connected to the second bonding pad by the second conductive structure. The thickness of the first conductive structure and the thickness of the second conductive structure are greater than or equal to 10 ?m and less than or equal to 30 ?m.

Abstract: A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a thin-film transistor layer on the substrate; forming a first passivation layer on the substrate; forming an organic layer on the substrate; patterning the organic layer to expose a first region; forming a second passivation layer on the substrate; patterning the first passivation layer to expose a second region; forming a bonding pad on the substrate, wherein the bonding pad corresponds to an overlapping area of the first region and the second region; and bonding an electronic component to the bonding pad. An electronic device manufactured by the method is also provided.

Abstract: A method for fabricating an electronic device is provided. The method includes the following steps. A substrate is provided. A solder and a flux are formed on the substrate. An electronic component is bonded on the solder. At least a portion of the flux is removed. An electronic device is also provided.

Abstract: An electronic device is provided. The electronic device includes: a support structure, a heat-dissipation layer, a first adhesive and an electronic panel. The heat-dissipation layer is disposed on the support structure and includes at least one first hole. The first adhesive is disposed in the at least one first hole. The electronic panel is disposed on the heat-dissipation layer.

Abstract: A light emitting module and a display device including the same are disclosed. The light emitting module including: a substrate; a plurality of light emitting units disposed on the substrate; a plurality of encapsulating elements covering the plurality of light emitting units; and a reflective layer surrounding each of the plurality of light emitting units.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units, and a protective layer. The light-emitting units are electrically connected to the driving substrate. The protective layer covers the light-emitting units, and the protective layer has a Young's modulus less than or equal to 20 MPa.

Abstract: An electronic device is provided. The electronic device includes: a support structure, a heat-dissipation layer, a first adhesive and an electronic panel. The heat-dissipation layer is disposed on the support structure and includes at least one first hole. The first adhesive is disposed in the at least one first hole. The electronic panel is disposed on the heat-dissipation layer.

Abstract: An organic light emitting diode (OLED) display device and a display panel thereof are provided. The organic light emitting diode display panel comprises a first substrate, a first electrode, an organic light emitting layer, a second electrode, and a second substrate. The first electrode is disposed on the first substrate. The organic light emitting layer is disposed on the first electrode. The second electrode is disposed on the organic light emitting layer. The second substrate is located on the second electrode. The material of the second electrode comprises an alkaline earth element and silver. The second electrode comprises a first portion and a second portion, and the first portion is located between the second portion and the first substrate. The ratios of the alkaline earth element to silver in the first portion and in the second portion are different.

Abstract: An organic light emitting diode (OLED) display device and a display panel thereof are provided. The organic light emitting diode display panel comprises a first substrate, a first electrode, an organic light emitting layer, a second electrode, and a second substrate. The first electrode is disposed on the first substrate. The organic light emitting layer is disposed on the first electrode. The second electrode is disposed on the organic light emitting layer. The second substrate is located on the second electrode. The material of the second electrode comprises an alkaline earth element and silver. The second electrode comprises a first portion and a second portion, and the first portion is located between the second portion and the first substrate. The ratios of the alkaline earth element to silver in the first portion and in the second portion are different.

Abstract: An organic light emitting diode (OLED) display device and a display panel thereof are provided. The organic light emitting diode display panel comprises a first substrate, a first electrode, an organic light emitting layer, a second electrode, and a second substrate. The first electrode is disposed on the first substrate. The organic light emitting layer is disposed on the first electrode. The second electrode is disposed on the organic light emitting layer. The second substrate is located on the second electrode. The material of the second electrode comprises an alkaline earth element and silver. The second electrode comprises a first portion and a second portion, and the first portion is located between the second portion and the first substrate. The ratios of the alkaline earth element to silver in the first portion and in the second portion are different.

Abstract: A method of fabricating a pixel structure for an organic light-emitting display (OLED) is disclosed. A substrate having at least a sub-pixel region is provided. An auxiliary electrode layer and an insulating layer are formed on the substrate in the sub-pixel region, wherein the insulating layer has an opening to expose the auxiliary electrode layer. A lower electrode layer, an organic light emission layer, and an upper electrode layer are formed on the substrate, wherein the organic light emission layer fills the opening in the insulating layer. Another opening is formed in the upper electrode layer and the organic light emission layer directly on the opening in the insulating layer by performing a laser process, such that the upper electrode layer and the auxiliary electrode layer are welded together through the opening in the upper electrode layer and the organic light emission layer.

Abstract: An organic light emitting diode (OLED) display device and a display panel thereof are provided. The organic light emitting diode display panel comprises a first substrate, a first electrode, an organic light emitting layer, a second electrode, and a second substrate. The first electrode is disposed on the first substrate. The organic light emitting layer is disposed on the first electrode. The second electrode is disposed on the organic light emitting layer. The second substrate is located on the second electrode. The material of the second electrode comprises an alkaline earth element and silver. The second electrode comprises a first portion and a second portion, and the first portion is located between the second portion and the first substrate. The ratios of the alkaline earth element to silver in the first portion and in the second portion are different.

Abstract: A method of fabricating a pixel structure for an organic light-emitting display (OLED) is disclosed. A substrate having at least a sub-pixel region is provided. An auxiliary electrode layer and an insulating layer are formed on the substrate in the sub-pixel region, wherein the insulating layer has an opening to expose the auxiliary electrode layer. A lower electrode layer, an organic light emission layer, and an upper electrode layer are formed on the substrate, wherein the organic light emission layer fills the opening in the insulating layer. Another opening is formed in the upper electrode layer and the organic light emission layer directly on the opening in the insulating layer by performing a laser process, such that the upper electrode layer and the auxiliary electrode layer are welded together through the opening in the upper electrode layer and the organic light emission layer.

Abstract: A dual display device has pixels and each pixel includes a transparent substrate, an active driving circuit, a top organic LED, a bottom organic LED, an insulation layer that covers the active driving circuit and the bottom organic LED, and a contact hole. A connection element covers the insulation layer, the top organic LED is deposited on the connection element, and the anodes of the two LEDs electrically connect to the active driving circuit through the contact hole by the connection element. Hence, each pixel forms a structure that two organic LEDs stack together on the transparent substrate and the top and bottom organic LEDs can be driven respectively so as to achieve the dual display device.