Abstract: A planar magnetic component is arranged on a circuit board of a resonant converter, and the resonant converter includes a primary-side circuit and a secondary-side circuit. The planar magnetic component includes an inductor trace, an inductor iron core, and a current transformer trace. The inductor trace is arranged on the primary-side circuit and formed one layer board of the circuit board to serve as a resonant inductor coupled to the primary-side circuit. The inductor iron core includes a core pillar, and the core pillar penetrates a through hole of the circuit board, and the inductor trace surrounds the through hole. The current transformer trace is formed on the circuit board to serve as a current transformer coil coupled to the resonant inductor. The current transformer trace surrounds the through hole to form a common-core structure that shares the inductor iron core.

Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

Abstract: A setting method for connecting to wireless network access points, and an electronic device are applied to connect a network video surveillance device such as a network camera, a network video server or a network video recorder to wireless network access points. A first electronic device is set to operate in an access point mode. A second electronic device is connected to the first electronic device wirelessly, and setting information of a target access point is sent to the first electronic device by the second electronic device. After the first electronic device obtains the setting information, the first electronic device is switched to operate in a client mode instead of the access point mode. The first electronic device is connected to the target access point according to the setting information.

Abstract: A setting method for connecting to wireless network access points, and an electronic device are applied to connect a network video surveillance device such as a network camera, a network video server or a network video recorder to wireless network access points. A first electronic device is set to operate in an access point mode. A second electronic device is connected to the first electronic device wirelessly, and setting information of a target access point is sent to the first electronic device by the second electronic device. After the first electronic device obtains the setting information, the first electronic device is switched to operate in a client mode instead of the access point mode. The first electronic device is connected to the target access point according to the setting information.