Patents by Inventor Chien-Wen Wang
Chien-Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240176093Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: ApplicationFiled: February 5, 2024Publication date: May 30, 2024Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
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Publication number: 20240175771Abstract: Embodiments of the disclosure provide a method and device for providing a wire breakage warning. The method includes: obtaining a plurality of process values when a crystal ingot cutting machine uses a cutting wire to cut a crystal ingot; dividing the process values into N groups, and determining a statistical property of each of the groups; identifying outlier values in the process values based on the statistical property of each of the groups, or determining a statistical property variation corresponding to each of the groups based on the statistical property of each of the groups; and in response to determining that the outlier values in the process values meet a first warning condition, or the statistical property variation corresponding to each of the groups meets a second warning condition, providing a wire breakage warning associated with the cutting wire.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: GlobalWafers Co., Ltd.Inventors: Chien-Wen YU, Shang-Chi Wang, Bo-Ting Lin
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Patent number: 11989005Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.Type: GrantFiled: September 30, 2021Date of Patent: May 21, 2024Assignee: MediaTek Inc.Inventors: Bo-Jr Huang, Jia-Wei Fang, Jia-Ming Chen, Ya-Ting Chang, Chien-Yuan Lai, Cheng-Yuh Wu, Yi-Pin Lin, Wen-Wen Hsieh, Min-Shu Wang
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Publication number: 20240162833Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.Type: ApplicationFiled: November 13, 2023Publication date: May 16, 2024Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
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Publication number: 20240152194Abstract: A power consumption reduction method can include defining y operation scenarios according to x types of extracted information, generating z power profiles each used for controlling power provided to a subset of a plurality of processors, assigning the z power profiles to the y operation scenarios in a machine learning model, collecting to-be-evaluated information by the plurality of processors, comparing the to-be-evaluated information with the x types of extracted information to find a most similar type of extracted information, using the machine learning model to select an optimal power profile from the z power profiles according to the most similar type of extracted information, and applying the optimal power profile to control the power provided to the subset of the plurality of processors. The subset of the plurality of processors are of the same type of processor. x, y and z can be an integer larger than zero.Type: ApplicationFiled: August 18, 2023Publication date: May 9, 2024Applicant: MEDIATEK INC.Inventors: Wen-Wen Hsieh, Ying-Yi Teng, Chien-Chih Wang
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Patent number: 11967717Abstract: Disclosed is a tungsten-doped lithium manganese iron phosphate-based particulate for a cathode of a lithium-ion battery. The particulates include a composition represented by a formula of LixMn0.998-y-zFeyMzW0.002PaO4a±p/C, wherein x, y, z, a, p, and M are as defined herein. Also disclosed is a powdery material including the particulates, and a method for preparing the powdery material.Type: GrantFiled: July 16, 2021Date of Patent: April 23, 2024Assignee: HCM CO., LTD.Inventors: Chien-Wen Jen, Hsin-Ta Huang, Chih-Tsung Hsu, Yi-Hsuan Wang
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Patent number: 11966628Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.Type: GrantFiled: June 2, 2022Date of Patent: April 23, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Wei-Chen Wang, Han-Wen Hu, Yung-Chun Li, Huai-Mu Wang, Chien-Chung Ho, Yuan-Hao Chang, Tei-Wei Kuo
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Publication number: 20240119200Abstract: A method of building a characteristic model includes: acquiring raw electrical data from a measurement system outside one or more processing units; acquiring operational state-related data from an information collector inside the one or more processing units; performing a data annealing process on the raw electrical data and the operational state-related data to obtain and purified electrical data and purified operational state-related data; and performing a machine learning (ML)-based process to build the characteristic model based on the purified electrical data and the purified operational state-related data.Type: ApplicationFiled: October 3, 2023Publication date: April 11, 2024Applicant: MEDIATEK INC.Inventors: Yu-Jen Chen, Chien-Chih Wang, Wen-Wen Hsieh, Ying-Yi Teng
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Publication number: 20240120317Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.Type: ApplicationFiled: July 13, 2023Publication date: April 11, 2024Applicant: Western Digital Technologies, Inc.Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
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Publication number: 20240114688Abstract: A memory structure including a substrate, a first doped region, a second doped region, a first gate, a second gate, a first charge storage structure, and a second charge storage structure is provided. The first gate is located on the first doped region. The second gate is located on the second doped region. The first charge storage structure is located between the first gate and the first doped region. The first charge storage structure includes a first tunneling dielectric layer, a first dielectric layer, and a first charge storage layer. The second charge storage structure is located between the second gate and the second doped region. The second charge storage structure includes a second tunneling dielectric layer, a second dielectric layer, and a second charge storage layer. The thickness of the second tunneling dielectric layer is greater than the thickness of the first tunneling dielectric layer.Type: ApplicationFiled: November 21, 2022Publication date: April 4, 2024Applicant: United Microelectronics Corp.Inventors: Chia-Wen Wang, Chien-Hung Chen, Chia-Hui Huang, Ling Hsiu Chou, Jen Yang Hsueh, Chih-Yang Hsu
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 11812578Abstract: An enclosure for receiving a plurality of storage components is provided. The enclosure includes a deck, a top cover, a front panel, a stress distributing member, and a pair of component housings. The front panel is disposed between the deck and the top cover disposed over the deck. The stress distributing member traverses an entire width of the deck and is fastened to the deck and the top cover. A front section is defined between the front panel and the stress distributing member. The component housings are arranged in the front section. Each of the component housings has a front end facing outward the enclosure and a back end facing inward the enclosure. Each of the component housings is configured to receive at least a set of one or more of the storage components, and ends of the stress distributing member extend beyond the front ends of the component housings.Type: GrantFiled: November 18, 2022Date of Patent: November 7, 2023Assignee: CHENBRO MICOM CO., LTD.Inventors: Chien-Wen Wang, Han-Chung Chien, Sheng-Chan Lin, Hao-Hsiang Hsu, Chiung-Wei Lin, An-Hsin Chen
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Patent number: 11812575Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.Type: GrantFiled: July 6, 2021Date of Patent: November 7, 2023Assignee: CHENBRO MICOM CO., LTD.Inventors: Chien-Wen Wang, Han-Chung Chien, Sheng-Chan Lin, Hao-Hsiang Hsu, Chiung-Wei Lin, An-Hsin Chen
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Publication number: 20230086839Abstract: An enclosure for receiving a plurality of storage components is provided. The enclosure includes a deck, a top cover, a front panel, a stress distributing member, and a pair of component housings. The front panel is disposed between the deck and the top cover disposed over the deck. The stress distributing member traverses an entire width of the deck and is fastened to the deck and the top cover. A front section is defined between the front panel and the stress distributing member. The component housings are arranged in the front section. Each of the component housings has a front end facing outward the enclosure and a back end facing inward the enclosure. Each of the component housings is configured to receive at least a set of one or more of the storage components, and ends of the stress distributing member extend beyond the front ends of the component housings.Type: ApplicationFiled: November 18, 2022Publication date: March 23, 2023Inventors: CHIEN-WEN WANG, HAN-CHUNG CHIEN, SHENG-CHAN LIN, HAO-HSIANG HSU, CHIUNG-WEI LIN, AN-HSIN CHEN
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Patent number: 11558975Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.Type: GrantFiled: May 19, 2021Date of Patent: January 17, 2023Assignee: CHENBRO MICOM CO., LTD.Inventors: Chien-Wen Wang, Han-Chung Chien, Sheng-Chan Lin, Hao-Hsiang Hsu, Chiung-Wei Lin, An-Hsin Chen
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Patent number: 11259437Abstract: A server system comprises a base, a front panel (13) arranged on the base and defining a collecting space; two doors (16) arranged on opposite sides of the base, and being perpendicular to the front panel; two storage cases (171) arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two first corridors are each defined between one of the doors and one of the storage case facing the one door; two circuit boards (18) arranged between the two storage cases, wherein the two circuit boards comprise a plurality of slits, wherein a second corridor is defined between the two circuit boards; a storage cover (121) disposed above the base over the two first corridors, the second corridor, the two storage cases, and the two circuit boards.Type: GrantFiled: October 27, 2020Date of Patent: February 22, 2022Assignee: CHENBRO MICOM CO., LTD.Inventors: Chien-Wen Wang, Han-Chung Chien, Sheng-Chan Lin, Pao-Lung Wang, Tsung Hsun Chiang, Hao-Hsiang Hsu
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Publication number: 20210337692Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.Type: ApplicationFiled: July 6, 2021Publication date: October 28, 2021Inventors: CHIEN-WEN WANG, HAN-CHUNG CHIEN, SHENG-CHAN LIN, HAO-HSIANG HSU, CHIUNG-WEI LIN, AN-HSIN CHEN
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Patent number: 11114134Abstract: A holding bracket includes a frame body, an elastic rib, a stopping block and a cover plate. The frame body is formed with a holding space for holding a loaded object such as a hard disk. One end of the elastic rib is connected to the frame body, and the other end is a free end. The stopping block is protrusively formed on one surface of the elastic rib facing away from the holding space, and is located at the free end. The cover plate is pivotally connected to one end of the frame body.Type: GrantFiled: May 21, 2020Date of Patent: September 7, 2021Assignee: CHENBRO MICOM CO., LTD.Inventors: Chien-Wen Wang, Tung-Yang Hu, Cheng-Yung Tsai
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Publication number: 20210274674Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.Type: ApplicationFiled: May 19, 2021Publication date: September 2, 2021Inventors: CHIEN-WEN WANG, HAN-CHUNG CHIEN, SHENG-CHAN LIN, HAO-HSIANG HSU, CHIUNG-WEI LIN, AN-HSIN CHEN
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Publication number: 20210127522Abstract: A server system comprises a base, a front panel (13) arranged on the base and defining a collecting space; two doors (16) arranged on opposite sides of the base, and being perpendicular to the front panel; two storage cases (171) arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two first corridors are each defined between one of the doors and one of the storage case facing the one door; two circuit boards (18) arranged between the two storage cases, wherein the two circuit boards comprise a plurality of slits, wherein a second corridor is defined between the two circuit boards; a storage cover (121) disposed above the base over the two first corridors, the second corridor, the two storage cases, and the two circuit boards.Type: ApplicationFiled: October 27, 2020Publication date: April 29, 2021Inventors: CHIEN-WEN WANG, HAN-CHUNG CHIEN, SHENG-CHAN LIN, PAO-LUNG WANG, TSUNG HSUN CHIANG, HAO-HSIANG HSU