Patents by Inventor Chien-Wu Chu

Chien-Wu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Production and packaging control for repaired integrated circuits
    Patent number: 7521266
    Abstract: A method for reducing the scrap rate of fuse structures after laser repairing is provided. The method includes providing a semiconductor wafer comprising integrated circuits, performing a yield test on the semiconductor wafer to determine defective circuits, predetermining a wavelength limit, and keeping the semiconductor wafer away from lights having wavelengths lower than the wavelength limit. The defects on the semiconductors wafer are repaired by burning laser fuses. For copper-based fuse structures, the wavelength limit is about 550 nm.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: April 21, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Jung Tseng, Chi Chang Su, Chien-Wu Chu, You-Wen Yau, Long Sheng Yeou
  • Production and packaging control for repaired integrated circuits
    Publication number: 20070111402
    Abstract: A method for reducing the scrap rate of fuse structures after laser repairing is provided. The method includes providing a semiconductor wafer comprising integrated circuits, performing a yield test on the semiconductor wafer to determine defective circuits, predetermining a wavelength limit, and keeping the semiconductor wafer away from lights having wavelengths lower than the wavelength limit. The defects on the semiconductors wafer are repaired by burning laser fuses. For copper-based fuse structures, the wavelength limit is about 550 nm.
    Type: Application
    Filed: April 28, 2006
    Publication date: May 17, 2007
    Inventors: Shu-Jung Tseng, Chi Su, Chien-Wu Chu, You-Wen Yau, Long Yeou