Patents by Inventor Chien-Ying Chen

Chien-Ying Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090269945
    Abstract: A butterfly interface transfer structure including an interface card, a first add-in card and a second add-in card is disclosed. The interface card includes a plate, a first connector, a second connector and a spacer. The plate has a set of electrical connecting pins, a first surface and a second surface. The first connector is disposed on the first surface, and the second connector is disposed on the second surface, wherein the first connector and the second connector are respectively electrically connected to the electrical connecting pins. The spacer is disposed between the first connector and the plate. The first add-in card is coupled to the first connector, and the second add-in card is coupled to the second connector.
    Type: Application
    Filed: March 9, 2009
    Publication date: October 29, 2009
    Applicant: ASUSTeK Computer Inc.
    Inventors: Ching-Sung Tzeng, Chien-Ying Chen
  • Patent number: 7433189
    Abstract: A heat dissipation module is suitable for being assembled on a circuit board to dissipate the heat source on the circuit board. The heat dissipation module includes a holding unit, a fan and a cover unit. The holding unit is formed by a holder base and multiple first support posts extending from the holder base downwards, each of the first support posts has an elastic snap sleeve to be snapped in a snap hole and the elastic snap sleeve has an accommodation space. The fan is assembled on the holder base and the cover unit covers the fan and is assembled on the holding unit, and an end of each second support post of the fan has a snap tenon plugged in the accommodation space.
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: October 7, 2008
    Assignee: ASUSTeK Computer Inc.
    Inventor: Chien-Ying Chen
  • Publication number: 20070274040
    Abstract: A heat dissipation module is suitable for being assembled on a circuit board to dissipate the heat source on the circuit board. The heat dissipation module includes a holding unit, a fan and a cover unit. The holding unit is formed by a holder base and multiple first support posts extending from the holder base downwards, each of the first support posts has an elastic snap sleeve to be snapped in a snap hole and the elastic snap sleeve has an accommodation space. The fan is assembled on the holder base and the cover unit covers the fan and is assembled on the holding unit, and an end of each second support post of the fan has a snap tenon plugged in the accommodation space.
    Type: Application
    Filed: April 9, 2007
    Publication date: November 29, 2007
    Applicant: ASUSTeK COMPUTER INC.
    Inventor: Chien-Ying Chen
  • Publication number: 20060056147
    Abstract: A latch structure is for fixing a detachable electronic assembly, which at least has a hole. The latch structure has a casing, a latch member, and at least a fixing member. In this case, the casing has at least a first opening, at least a second opening, and a limit portion. The limit portion is adjacent to the first opening. The latch member has an engaging portion, and at least a fixing portion. One part of the fixing member passes through the fixing portion and the hole so as to fix the latch member to the detachable electronic assembly. When the engaging portion engages with the second opening, another part of the fixing member is positioned at the limit portion.
    Type: Application
    Filed: September 7, 2005
    Publication date: March 16, 2006
    Inventor: Chien Ying Chen
  • Publication number: 20020141151
    Abstract: A server comprises six sets of hard disk drivers as well as a floppy disk driver and an optical disk driver. The floppy disk driver adopts a compact floppy disk driver used for notebook and the optical disk driver adopts a compact optical disk driver used for notebook computer to reduce occupied volume. Therefore, the number of the hard disk drivers is increased to expand data storage capacity without increasing physical size.
    Type: Application
    Filed: March 29, 2001
    Publication date: October 3, 2002
    Inventors: Chien Ying Chen, Frederick James Nemec