Abstract: The present disclosure provides a method for manufacturing a heat dissipating plate. The method comprises the steps of providing a first substrate having a through hole and a second substrate having a first region and a second region defined thereon; disposing a capillary structure layer on the first region; disposing a plurality of support structures on the second region; disposing a sealing glue layer on the second substrate surrounding the first region and the second region; attaching the first substrate to the second substrate through the sealing glue layer so that the first substrate is positioned over the second substrate to form a cavity; injecting a heat dissipating liquid into the cavity through the through hole; heating the first substrate or the second substrate for a predetermined time duration to drive a part of air in the cavity from the cavity through the through hole; and sealing the through hole to convert the cavity into a non-vacuum sealed cavity.

Abstract: A power supply is provided. The power supply includes a power supply circuit and a control circuit. The power supply circuit includes a voltage converter and multiple point-of-load circuits. The voltage converter generates a third voltage according to a first voltage. The load point-of-load circuits generate at least one second voltage and at least one state signal according to the third voltage. The at least one second voltage is suitable for supplying power to a load. The control circuit is coupled to the power supply circuit. The control circuit determines whether a single event latch-up occurs in the power supply circuit according to the at least one state signal. When the single event latch-up occurs in the power supply circuit, the control circuit switches off the power supply circuit to stop generating the at least one second voltage and the at least one state signal.

Abstract: A wafer includes a plurality of testing dies, a plurality of non-testing dies, and a dicing region. Each testing die includes: a first active area including one or more first active devices, and one or more first device pads electrically coupled to the one or more first active devices. Each non-testing die includes: a second active area including one or more second active devices, and one or more second device pads electrically coupled to the one or more second active devices. The dicing region includes one or more testing pads electrically coupled to the one or more first device pads. The one or more testing pads are arranged to receive one or more external probes for determining one or more characteristics of the one or more first active devices of the plurality of testing dies. The plurality of non-testing dies are electrically isolated from the dicing region.

Abstract: A photo-detecting apparatus is provided. The photo-detecting apparatus includes: a substrate made by a first material or a first material-composite; an absorption layer made by a second material or a second material-composite, the absorption layer being supported by the substrate and the absorption layer including: a first surface; a second surface arranged between the first surface and the substrate; and a channel region having a dopant profile with a peak dopant concentration equal to or more than 1×1015 cm?3, wherein a distance between the first surface and a location of the channel region having the peak dopant concentration is less than a distance between the second surface and the location of the channel region having the peak dopant concentration, and wherein the distance between the first surface and the location of the channel region having the peak dopant concentration is not less than 30 nm.

Abstract: A cold plate is provided and includes: a casing formed with an accommodating groove; a base coupled to the casing to define an action space together with the casing, where the action space communicates with the accommodating groove; a heat transfer structure disposed on an inner side of the base for transferring a heat energy generated by a heat source in contact with an outer side of the base to a working medium in the action space; and a pump having a stator disposed in the accommodating groove.

Abstract: A heat dissipation device is provided and includes: a casing; a base unit combined with the casing to form a water collecting chamber, a water inlet chamber, an action space and a water outlet chamber; a heat transfer structure disposed on an inner side of the base unit; a water inlet pipeline unit communicated with the water collecting chamber; a water outlet pipeline unit communicated with the water outlet chamber; and a pump unit disposed outside the casing and the base unit, and connected with the water inlet pipeline unit and the water outlet pipeline unit, so as to drive a working medium.

Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.

Abstract: A heat dissipating plate includes a casing, a capillary structure layer, a support structure, and heat dissipating liquid. The casing includes a first substrate and a second substrate, which is disposed opposite to the first substrate to form a non-vacuum sealed cavity. The capillary structure layer is disposed in a first region of the non-vacuum sealed cavity and defines a first flow space. The support structure is disposed in a second region of the non-vacuum sealed cavity and defines a second flow space. The heat dissipating liquid is disposed in the non-vacuum sealed cavity, the liquid amount of which is more than 50% of the total capacity of the first flow space and the second flow space, and flows between the first flow space and the second flow space. The invention also provides a method for manufacturing the heat dissipation plate and an electronic device having the heat dissipation plate.

Abstract: A two-piece suspension pedicle anchor and its system and component-set is disclosed. The two-piece suspension pedicle anchor comprises a proximal piece and a distal piece that can rotate relatively. An external thread is arranged on the outer surface of the proximal piece, and a transverse through hole for an artificial ligament to pass through is arranged at the distal piece. As the two-piece suspension pedicle anchor is rotated and gradually locked into the bone, only the proximal piece is rotated, and the distal piece with the artificial ligament is pushed down but not rotated; in addition, the artificial ligament will be brought into the bone along with the distal piece and sandwiched between the outer surface of the proximal piece and the bone, that is, the artificial ligament will be sandwiched and fixed between the anchor-bone interface without wrapping around the outer surface of the proximal piece.

Abstract: A two-phase cold plate includes a base, an upper cover, a heat exchange cavity and a cooling fin module. The upper cover is installed on the base, the heat exchange cavity is formed between the base and the upper cover, and the cooling fin module is installed in the heat exchange cavity. The upper cover includes at least one nozzle module and a plurality of two-phase fluid channels. The two-phase fluid channels are respectively located on both sides of the nozzle module, and the nozzle module sprays a heat dissipating fluid to the cooling fin module, and the heat dissipating fluid flows along the cooling fin module to the two-phase fluid channels on both sides of the cooling fin module to cool the cooling fin module.

Abstract: A liquid cooling head includes an upper casing, an impeller, a bottom casing and a skived fin cooling plate. The upper casing has an inlet and an outlet, the upper casing is fixed on the bottom casing, and the impeller is arranged between the upper casing and the skived fin cooling plate. In addition, the skived fin cooling plate is fixed on the bottom casing, and the impeller sucks the heat-dissipating liquid from the inlet and drives the heat-dissipating liquid passing through the skived fin cooling plate, upwardly passing through the impeller and then discharged from the outlet.

Abstract: A visible-light-image physiological monitoring system with thermal detecting assistance is disclosed. The system takes a visible-light image and a thermal image of a body at the same time. A processing unit identifies a body feature of the visible-light image and determines a coordinate of the feature. In a learning mode, an initial temperature of the body feature is determined from the thermal image according to the coordinate of the body feature. After then, a physiological status monitoring mode is executed to monitor the temperature changes of the body feature and output an alarm when the temperature is determined to be abnormal. Therefore, a monitoring accuracy of the visible-light-image physiological monitoring system is increased and avoids transmitting false alarms or no alarms.

Abstract: A switch capable of decreasing parasitic inductance includes: a semiconductor device, a first top metal line, and a second top metal line. The second top metal line electrically connects a power supply input end and a current inflow end of the semiconductor device, wherein a first part of the first top metal line is arranged in parallel and adjacent to a second part of the second top metal line. When the semiconductor device is in an ON operation, an input current outflows from the power supply input end, and is divided into a first current and a second current. When the first current and the second current flow through the first part and the second part respectively, the first current and the second current flow opposite to each other, to reduce an total parasitic inductance of the first top metal line and the second top metal line.

Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

Abstract: An optical sensing apparatus is provided. The optical sensing apparatus includes a substrate, one or more pixels supported by the substrate, where each of the one or more pixels includes an absorption region, a field control region, a first contact region, a second contact region and a carrier confining region. The field control region and the first contact region are doped with a dopant of a first conductivity type. The second contact region is doped with a dopant of a second conductivity type. The carrier confining region includes a first barrier region and a channel region, where the first barrier region is doped with a dopant of the second conductivity type and has a first peak doping concentration, and where the channel region is intrinsic or doped with a dopant of the second conductivity type and has a second peak doping concentration lower than the first peak doping concentration.

Abstract: A light supply method and a light supply system for phototherapy are provided. The light supply method includes the following. A plurality of light emitting modules of a light source device are driven so that a light source device outputs a first light. The first light is sensed by a light sensing module. A light parameter corresponding to best physiology of a user is received. A light output ratio of the light emitting modules is adjusted based on the light parameter, thereby adjusting the first light to a second light. The light emitting modules respectively have different central wavelengths. A half-height width of a plurality of spectra of the light emitting modules is less than 30 nanometers.

Abstract: A photo-detecting apparatus is provided. The photo-detecting apparatus includes at least one pixel, and each pixel includes N subpixels, wherein each of the subpixels comprises a detection region, two first conductive contacts, wherein the detection region is between the two first conductive contacts, wherein N is a positive integer and is ?2.

Abstract: The present invention extends to methods, systems, and computer program products for integrating healthcare screening with other identity-based functions. In general, components facilitating healthcare screening interoperate with and/or are integrated into other systems, including facility access, identity, time keeping, payroll, etc. Aspects of the invention include using facial recognition to improve healthcare screening and satisfy governmental regulations. A thermal scanner can include a camera and an InfraRed (IR) camera. The thermal scanner can collect a facial image and derive a temperature for a person (e.g., from an IR image). The thermal scanner can also collect or access previously collected healthcare screening questionnaire answers. The collected temperate and healthcare screening questionnaire answers can be used to control access to the facility.

Abstract: Methods, devices, apparatus, and systems for photo-detecting are provided. In one aspect, a photo-detecting apparatus includes: a pixel having an absorption region configured to receive an optical signal and to generate photo-carriers in response to the optical signal, a substrate supporting the absorption region, and at least one additional region formed in the substrate. The absorption region includes a first material, the substrate includes a second material different from the first material. The at least one additional region includes a third material different from the second material. A total area of the absorption region and the at least one additional region is at least 20% of an area of the pixel.