Patents by Inventor Chien-Yu Huang

Chien-Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Publication number: 20240153992
    Abstract: A device includes a first channel structure, a second channel structure, and a gate structure. The first channel structure connects a first source region and a first drain region, and includes alternating stacking first semiconductor layers and second semiconductor layers. The second semiconductor layers have a width smaller than a width of the first semiconductor layers. The second channel structure connects a second source region and a second drain region. The second channel structure includes alternating stacking third semiconductor layers and fourth semiconductor layers. The fourth semiconductor layers have a width smaller than a width of the third semiconductor layers. The gate structure wraps around the first and second channel structures.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 9, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Hung-Yu YE, Yu-Shiang HUANG, Chien-Te TU, Chee-Wee LIU
  • Publication number: 20240151743
    Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).
    Type: Application
    Filed: February 7, 2023
    Publication date: May 9, 2024
    Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
  • Patent number: 11973052
    Abstract: An electronic device includes a bond wire with a first end bonded by a ball bond to a planar side of a first conductive plate, and a second end bonded by a stitch bond to a conductive stud bump at an angle greater than or equal to 60 degrees. A wirebonding method includes bonding the first end of the conductive bond wire to the first conductive plate includes forming a ball bond to join the first end of the conductive bond wire to a planar side of the first conductive plate by a ball bond, and bonding the second end of the conductive bond wire to the conductive stud bump includes forming a stitch bond to join the second end of the conductive bond wire to the conductive stud bump.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: April 30, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Chien-Chang Li, Hung-Yu Chou, Sheng-Wen Huang, Zi-Xian Zhan, Byron Lovell Williams
  • Publication number: 20240138030
    Abstract: An electrothermal module includes a first conductive layer, a second conductive layer, and a heat generating layer. The first conductive layer and the second conductive layer respectively include silver metal. The heat generating layer has a first portion, the first portion is disposed between the first conductive layer and the second conductive layer to form an electrothermal conversion portion of the electrothermal module, and the heat generating layer includes a conductive carbon material.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 25, 2024
    Inventors: Hou-Sheng HUANG, Chien-Lung SHEN, Shu-Chu TSAI, Hung-Yu LIN
  • Patent number: 11963533
    Abstract: The disclosure provides stable antimicrobial (e.g., antibacterial or antifungal or both) peptides (SAMPs) that may be used in methods of preventing or treating a bacterial disease (e.g., a Liberibacter disease, such as citrus greening disease (also called Huanglongbing (HLB)) or potato Zebra Chip disease, and other bacterial diseases such as those caused by Agrobacterium tumefaciens (also known as Rhizobium radiobacter) and Pseudomonas syringae) in plants (e.g., citrus plants or potato plants). SAMPs disclosed herein may be heat stable, as well as stable in plant extracts and/or in plant lysates (e.g., citrus lysates).
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: April 23, 2024
    Assignee: The Regents of The University of California
    Inventors: Hailing Jin, Chien Yu Huang
  • Publication number: 20240124887
    Abstract: The present disclosure provides methods and compositions for increasing resistance of plants to a disease caused by infection with bacteria of a Liberibacter species.
    Type: Application
    Filed: February 9, 2022
    Publication date: April 18, 2024
    Applicant: The Regents of the University of California
    Inventors: Hailing Jin, Chien Yu Huang
  • Patent number: 11960253
    Abstract: A system and a method for parameter optimization with adaptive search space and a user interface using the same are provided. The system includes a data acquisition unit, an adaptive adjustment unit and an optimization search unit. The data acquisition unit obtains a set of executed values of several operating parameters and a target parameter. The adaptive adjustment unit includes a parameter space transformer and a search range definer. The parameter space transformer performs a space transformation on a parameter space of the operating parameters according to the executed values. The search range definer defines a parameter search range in a transformed parameter space based on the sets of the executed values. The optimization search unit takes the parameter search range as a limiting condition and takes optimizing the target parameter as a target to search for a set of recommended values of the operating parameters.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: April 16, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Yu Huang, Chun-Fang Chen, Hong-Chi Ku, Te-Ming Chen, Chien-Liang Lai, Sen-Chia Chang
  • Patent number: 11953063
    Abstract: A normally closed disc clamp system includes a housing with a rotating disc, a brake ring and a pressure-enhancing ring arranged therein. When only a first chamber is supplied with fluid, the fluid pushes the brake ring to release the rotating disc. When only a second chamber is fed with fluid, the fluid pushes the brake ring to keep the rotating disc in the braking state, and pushes the pressure-enhancing ring to compress an elastic unit. The energy generated by the compression of the elastic unit acts on the brake ring through the fluid, so that the brake ring achieves a double pressurization effect. If the action of the fluid fails, the brake ring can still provide a braking effect to the rotating disc through the elastic unit to improve operational safety. Further, the present invention further provides a rotating table using the normally closed disc clamp system.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 9, 2024
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventors: Peng-Wen Chen, Chien-Yu Lin, Li-Wen Huang
  • Publication number: 20240111337
    Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.
    Type: Application
    Filed: May 8, 2023
    Publication date: April 4, 2024
    Applicant: Acer Incorporated
    Inventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
  • Publication number: 20240109941
    Abstract: The disclosure provides stable antimicrobial (e.g., antibacterial or antifungal or both) peptides (SAMPs) that can be used in methods of preventing or treating a bacterial disease (e.g., a Liberibacter disease, such as citrus greening disease (also called Huanglongbing (HLB)) or potato Zebra Chip disease, and other bacterial diseases such as those caused by Agrobacterium tumefaciens (also known as Rhizobium radiobacter) and Pseudomonas syringae) in plants (e.g., citrus plants or potato plants).
    Type: Application
    Filed: October 10, 2020
    Publication date: April 4, 2024
    Inventors: Hailing Jin, Chien Yu Huang
  • Patent number: 11938156
    Abstract: An isolated and purified lactic acid bacteria is provided, which is Lactobacillus paracasei PS23 (PS23) and its applications in delaying aging process, improving immunomodulatory activity, reducing, preventing or treating allergic and inflammation, preventing or treating a chronic disorder and/or (vi) preventing and/or treating a mood disorder or a neurological condition.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: March 26, 2024
    Assignee: BENED BIOMEDICAL CO., LTD.
    Inventors: Ying-Chieh Tsai, Hui-Yu Huang, Chien-Chen Wu, Jyh-Shing Hsu
  • Publication number: 20240096719
    Abstract: A semiconductor device includes a first substrate, an electronic component, and a lid. The first substrate includes a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a connector structure. The electronic component is coupled to the first substrate top side and coupled to the connector structure. The lid includes a wall part including a ring part coupled to the first substrate top side, a first part of an overhang part coupled to the first substrate lateral side, and a second part of the overhang part extending from the first part of the overhang part away from the first substrate lateral side.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240088182
    Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20230410935
    Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.
    Type: Application
    Filed: July 31, 2023
    Publication date: December 21, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Yu Huang, Chia-En Huang, Cheng Hung Lee, Hua-Tai Shieh
  • Publication number: 20230328202
    Abstract: A frame interpolation method for generating a third image frame interpolated between a first image frame and a second image frame includes: performing motion estimation upon a first input image frame and a second input image frame, to obtain a single-directional motion, wherein the first input image frame is derived from the first image frame, and the second input image frame is derived from the second image frame; scaling the single-directional motion according to a time point of the third image frame, to generate a scaled motion; deriving a forward-warped result from a result of performing a forward warping operation and a first inverse operation upon the scaled motion; performing a second inverse operation upon the forward-warped result, to generate an inversed result; and generating the third image frame according to the first image frame, the second image frame, the forward-warped result, and the inversed result.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 12, 2023
    Applicant: MEDIATEK INC.
    Inventors: Yao-Sheng Wang, Pei-Kuei Tsung, Chia-Ni Lu, Yu-Sheng Lin, Chien-Yu Huang, Chih-Wen Goo, Cheng-Lung Jen
  • Patent number: 11756647
    Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Yu Huang, Chia-En Huang, Cheng Hung Lee, Hua-Tai Shieh
  • Publication number: 20230197702
    Abstract: A sunk-type package structure includes a substrate, an optical sensing chip, and a housing. The substrate has a cavity with a first depth. The optical sensing chip is disposed inside the cavity and electrically connected with the substrate. A surface of the optical sensing chip has a first sensing area for sensing light. The housing covers the substrate and the optical sensing chip. The housing has a light-permeable portion disposed above the first sensing area.
    Type: Application
    Filed: November 18, 2022
    Publication date: June 22, 2023
    Inventors: Zhong-Hao DENG, Chien-Yu Huang, Yi-Yung CHEN, KAO-PIN WU
  • Patent number: 11569207
    Abstract: A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: January 31, 2023
    Assignees: Interface Technology (ChengDu) Co., Ltd., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Chien-Yu Huang, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu, Chia-Ming Fan, Ping-Hsiang Kao