Patents by Inventor Chih Chao Wang
Chih Chao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11996483Abstract: The present disclosure provides a semiconductor device that includes a semiconductor fin disposed over a substrate, an isolation structure at least partially surrounding the fin, an epitaxial source/drain (S/D) feature disposed over the semiconductor fin, where an extended portion of the epitaxial S/D feature extends over the isolation structure, and a silicide layer disposed on the epitaxial S/D feature, where the silicide layer covers top, bottom, sidewall, front, and back surfaces of the extended portion of the S/D feature.Type: GrantFiled: December 14, 2022Date of Patent: May 28, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pei-Hsun Wang, Chih-Chao Chou, Shih-Cheng Chen, Jung-Hung Chang, Jui-Chien Huang, Chun-Hsiung Lin, Chih-Hao Wang
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Patent number: 11973079Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes forming a stack of semiconductor layers comprising a plurality of first semiconductor layers and a plurality of second semiconductor layers over a semiconductor substrate. A first stack of masking layers is formed over the stack of semiconductor layers with a first width and a second stack of masking layers is formed laterally offset from the stack of semiconductor layers with a second width less than the first width. A patterning process is performed on the semiconductor substrate and the stack of semiconductor layers, thereby defining a first fin structure laterally adjacent to a second fin structure. The first fin structure has the first width and the second fin structure has the second width. The stack of semiconductor layers directly overlies the first fin structure and has the first width.Type: GrantFiled: May 19, 2022Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chao Chou, Chih-Hao Wang, Shi Ning Ju, Kuo-Cheng Chiang, Wen-Ting Lan
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Publication number: 20240131827Abstract: An impact-resistant polypropylene film and a method for producing the same are provided. The impact-resistant polypropylene film includes two outer layers and a middle layer. Each of the outer layers includes a propylene block polymer. The propylene block polymer includes a propylene monomer and an ethylene-propylene polymer, and the ethylene-propylene polymer is dispersed in the propylene monomer to form a sea-island structure. The sea-island structure includes a sea phase and an island phase, the propylene monomer is defined as the sea phase, and the ethylene-propylene polymer is defined as the island phase. The middle layer includes a propylene block polymer and an ethylene elastomer. Based on 100 parts by weight of the middle layer, a content of the propylene block polymer is 60 to 80 parts by weight, and a content of the ethylene elastomer is 20 to 40 parts by weight.Type: ApplicationFiled: December 29, 2022Publication date: April 25, 2024Inventors: TE-CHAO LIAO, CHING-YAO YUAN, CHIH-FENG WANG
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Publication number: 20240123713Abstract: A polyolefin film for an aluminum plastic film and an aluminum plastic film structure are provided. The polyolefin film includes a laminating film, a middle film, and a heat-sealed film. The middle film is disposed between the laminating film and the heat-sealed film. A lamination temperature of the laminating film ranges from 70° C. to 100° C. A material forming the laminating film is a first polyolefin material. The first polyolefin material has a modified group, and a structure of the modified group contains maleic anhydride. A material forming the middle film includes: 50 phr to 90 phr of a propylene block copolymer, 5 phr to 30 phr of an ethylene elastomer, and 5 phr to 20 phr of a propylene random copolymer.Type: ApplicationFiled: November 30, 2022Publication date: April 18, 2024Inventors: TE-CHAO LIAO, CHING-YAO YUAN, Chih-Feng Wang
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Publication number: 20240097888Abstract: In a file sharing system, a key manager unit realizes a correspondence between the first user identifier and the first public key in response to a registration request of the first user, generates a first key material for encrypting the first file into a first encrypted file, and generates a first credential according to the first user identifier, the first file identifier, the first public key and the first key material after receiving an access-right claim request to the first file from the first user. A file storage unit stores the first encrypted file and the first credential. The first user uses the first user identifier, the first file identifier and the first private key to retrieve the first key material out of the first credential, and uses the first key material to decrypt the first encrypted file into the first file.Type: ApplicationFiled: September 18, 2023Publication date: March 21, 2024Inventors: CHIA-JUNG LIANG, CHIHHUNG LIN, CHIH-PING HSIAO, YU-JIE SU, CHIA-HSIN CHENG, TUN-HOU WANG, MENG-CHAO TSAI, YUEH-CHIN LIN
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Patent number: 11916125Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a dielectric layer formed over a conductive feature; a semiconductor stack formed over the dielectric layer, wherein the semiconductor stack including semiconductor layers stacked up and separated from each other; a first metal gate structure and a second metal gate structure formed over a channel region of the semiconductor stack, wherein the first metal gate structure and the second metal gate structure wrap each of the semiconductor layers of the semiconductor stack; and a first epitaxial feature disposed between the first metal gate structure and the second metal gate structure over a first source/drain region of the semiconductor stack, wherein the first epitaxial feature extends through the dielectric layer and contacts the conductive feature.Type: GrantFiled: July 22, 2022Date of Patent: February 27, 2024Inventors: Chih-Chao Chou, Kuo-Cheng Chiang, Shi Ning Ju, Wen-Ting Lan, Chih-Hao Wang
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Patent number: 9434315Abstract: A driving assistance device to accommodate, and communicate with, a portable device includes a housing, a plug connector, a controller and an ejection member. The housing defines a receiving chamber therein and an end opening communicating with the receiving chamber. The housing includes a bulkhead assembled in the receiving chamber to divide the receiving chamber into a first receiving portion and a second receiving portion, the first receiving portion communicates with the opening. The plug connector is assembled to the bulkhead and aligned to the opening. The controller is received in the second receiving portion and electrically coupled to the plug connector. The ejection member can be operated to eject the portable device.Type: GrantFiled: June 23, 2014Date of Patent: September 6, 2016Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Kuang-Yao Liao, Chih-Chao Wang
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Publication number: 20140375075Abstract: A driving assistance device to accommodate, and communicate with, a portable device includes a housing, a plug connector, a controller and an ejection member. The housing defines a receiving chamber therein and an end opening communicating with the receiving chamber. The housing includes a bulkhead assembled in the receiving chamber to divide the receiving chamber into a first receiving portion and a second receiving portion, the first receiving portion communicates with the opening. The plug connector is assembled to the bulkhead and aligned to the opening. The controller is received in the second receiving portion and electrically coupled to the plug connector. The ejection member can be operated to eject the portable device.Type: ApplicationFiled: June 23, 2014Publication date: December 25, 2014Inventors: KUANG-YAO LIAO, CHIH-CHAO WANG
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Patent number: 8617963Abstract: An integrated circuit wafer dicing method is provided. The method includes forming a plurality of integrated circuits and a plurality of test-keys on a wafer substrate, wherein the plurality of test-keys are disposed between the adjacent integrated circuits; forming a patterned protective film on the wafer to cover the plurality of integrated circuits and expose the plurality of test-keys; etching the plurality of test-keys by using the patterned protective film as a mask; and dicing an area between the plurality of integrated circuits to form a plurality of discrete integrated circuit dies.Type: GrantFiled: June 24, 2011Date of Patent: December 31, 2013Assignee: Raydium Semiconductor CorporationInventors: Ching-San Lin, Kun-Tai Wu, Chih-Chao Wang
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Publication number: 20120003817Abstract: An integrated circuit wafer dicing method is provided. The method includes forming a plurality of integrated circuits and a plurality of test-keys on a wafer substrate, wherein the plurality of test-keys are disposed between the adjacent integrated circuits; forming a patterned protective film on the wafer to cover the plurality of integrated circuits and expose the plurality of test-keys; etching the plurality of test-keys by using the patterned protective film as a mask; and dicing an area between the plurality of integrated circuits to form a plurality of discrete integrated circuit dies.Type: ApplicationFiled: June 24, 2011Publication date: January 5, 2012Inventors: Ching-San Lin, Kun-Tai Wu, Chih-Chao Wang
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Publication number: 20100240493Abstract: An exercise apparatus is composed of a counterweight device, a pulley assembly, a pulley sensor, an operating device, and a control device. The counterweight device includes a frame, a plurality of weight pieces mounted to the frame, and a plurality of electronic switches mounted to the frame for detecting the number of the weight pieces that are moved. The pulley assembly includes at least one pulley mounted to the frame; and a transmission member mounted to the pulley and connected with the weight pieces. The pulley sensor is mounted to the frame for sensing the status of the pulley. The operating device is connected with the transmission member for driving the pulley assembly to move the weight pieces. The control device is electrically connected with the electronic switches and the pulley sensor for calculating, displaying, and recording data of the user's exercise performance.Type: ApplicationFiled: February 19, 2010Publication date: September 23, 2010Applicant: JOONG CHENN INDUSTRY CO., LTD.Inventor: Chih Chao Wang