Abstract: A battery module is described. The battery module includes the battery module includes a plurality of repeating frames; a plurality of battery cells positioned between the plurality of repeating frames, the battery cells having a flexible heat conducting covering, an edge of the heat conducting covering folded over an outside edge of the repeating frame; and a heat sink contacting the edge of the heat conducting covering folded over the edge of the repeating frame. A method of cooling a battery module is also described.

Abstract: The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

Abstract: The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.

Abstract: A composite article for dissipating thermal energy from a secondary battery cell includes a first graphite layer, a second graphite layer spaced away from and arranged parallel to the first graphite layer, and a metal layer sandwiched between and disposed in contact with each of the first graphite layer and the second graphite layer. The composite article has a thermal conductivity of greater than or equal to about 1,200 W/mK and an electrical conductivity of greater than or equal to about 10,000 S/cm. A secondary battery module includes the composite article and a secondary battery cell having a length and an average measurable temperature along the length during operation of the secondary battery module. The composite article is disposed adjacent and in contact with the secondary battery cell to thereby dissipate thermal energy from the secondary battery cell during operation of the secondary battery module.

Abstract: A device and method for operating automotive battery system relays and related switches. By creating a dual bipolar magnetic field adjacent the contactor portion of a switching mechanism in the relay, the magnetic field used to promote arc extinguishing is shifted, which in turn reduces the Lorentz force that forms as a byproduct of the field. Such a configuration has the potential for simultaneously maintaining arc-extinguishing capability and improving short-circuit withstanding capability while reducing the tendency of the Lorentz forces to interfere with the operation of a solenoid or other switch-activating mechanisms. Such devices and methods may be used in conjunction with hybrid-powered and electric-powered vehicles.

Abstract: A device and method for operating automotive battery system relays and related switches. By aligning a magnetic field with a direction of current flow in a contact plate disposed between magnets that are producing the field, a generated Lorentz force can be used to promote arc extinguishing during a relay opening sequence, while simultaneously reducing the tendency of the Lorentz forces to interfere with the operation of a solenoid or other switch-activating mechanisms. By using a rotary-based mechanism to establish contact between a contact plate and current-carrying terminals, the likelihood of inadvertent opening of the relay is reduced. Such devices and methods may be used in conjunction with hybrid-powered and electric-powered vehicles.

Abstract: A method of accomplishing precipitation hardening of a selected portion of an aluminum panel is disclosed herein. The method includes identifying at least one area of the aluminum panel that experiences thermal stress above a threshold value during a bake cycle, thereby identifying the selected portion. Prior to the bake cycle, the method further includes locally heating the selected portion at a predetermined temperature for a predetermined time sufficient to increase a local yield strength of the selected portion such that the increased local yield strength ranges from 150 MPa to 300 MPa.

Abstract: The substitution of aluminum alloy roof panels for the low carbon steel roof panels most commonly used in motor vehicles is an attractive option for vehicle mass reduction. Often, however, the remainder of the vehicle body structure continues to be fabricated of steel. The combination of the aluminum alloy roof attached to the steel body may create compressive stresses in the aluminum roof when the body is subjected to elevated temperatures such as those required to cure or bake the paint applied to the body. These stresses may lead to unacceptable appearance features in the visible segment of the roof. By modifying the roof stamping to introduce a tabbed flange for attachment to the body and/or modifying the generally-vertical wall joining the flange to the roof interior, the stresses may be minimized and relocated to segments of the roof not normally visible.

Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.

Abstract: A battery module comprising a plurality of battery cells arranged in a stacked configuration, each of the battery cells including a first terminal disposed on a first end of the battery cell and a second terminal disposed on a second end of the battery cell, wherein the first terminal of at least one of the battery cells is in direct electrical communication with the second terminal of another non-adjacent one of the battery cells.

Abstract: A composite article for dissipating thermal energy from a secondary battery cell includes a first graphite layer, a second graphite layer spaced away from and arranged parallel to the first graphite layer, and a metal layer sandwiched between and disposed in contact with each of the first graphite layer and the second graphite layer. The composite article has a thermal conductivity of greater than or equal to about 1,200 W/mK and an electrical conductivity of greater than or equal to about 10,000 S/cm. A secondary battery module includes the composite article and a secondary battery cell having a length and an average measurable temperature along the length during operation of the secondary battery module. The composite article is disposed adjacent and in contact with the secondary battery cell to thereby dissipate thermal energy from the secondary battery cell during operation of the secondary battery module.

Abstract: A door assembly for a vehicle includes an outer panel. A support panel is operatively connected to the outer panel and configured such that the support panel provides bending resistance to the outer panel when the outer panel is deflected toward the support panel during a first deflection distance of the outer panel. A cable is operatively connected in the door assembly between a first end and a second end of the outer panel such that the cable provides additional bending resistance to the outer panel when the outer panel is deflected toward the support panel during a second deflection distance of the outer panel, greater than the first deflection distance.

Abstract: The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.

Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.

Abstract: One embodiment includes a lightweight automotive vehicle door construction including an inner panel partially formed from a lightweight metal casting. The casting provides a toe pan, hinge pillar and beltline. A lightweight stamping connected with the casting provides a remainder of the inner skin. The stamping provides an opposite pillar and latch mount. A header connected to the casting along a first end and with the beltline at a second end provides a window frame. A side intrusion beam extends between the hinge pillar and the opposite pillar. An outer panel is connected with the inner panel.

Abstract: The invention provides a liquid crystal device. The liquid crystal device includes a first transparent substrate and a second transparent substrate, wherein the first transparent substrate and the second transparent substrate are parallel to each other. Spacers are formed between the first transparent substrate and the second transparent substrate, to define a cavity; and a cholesteric liquid crystal is disposed into the cavity. Particularly, the liquid crystal device is coupled to a supply voltage, and three states of the liquid crystal device are selectively switched by adjusting the voltage, wherein the three states includes a first transparent state, a scattering state and a second transparent state.

Abstract: A method of accomplishing precipitation hardening of a selected portion of an aluminum panel is disclosed herein. The method includes identifying at least one area of the aluminum panel that experiences thermal stress above a threshold value during a bake cycle, thereby identifying the selected portion. Prior to the bake cycle, the method further includes locally heating the selected portion at a predetermined temperature for a predetermined time sufficient to increase a local yield strength of the selected portion such that the increased local yield strength ranges from 150 MPa to 300 MPa.

Abstract: The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.

Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.