Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate and forming a dehydrated film over the photoresist layer. The photoresist layer is selectively exposed to actinic radiation to form an exposed portion and an unexposed portion of the photoresist layer. The photoresist layer is developed to remove the unexposed portion of the photoresist layer and a first portion of the dehydrated film over the unexposed portion of the photoresist layer. In an embodiment, the method includes etching the substrate by using the exposed portion of the photoresist layer as a mask.

Abstract: A semiconductor structure includes a substrate, an isolation layer, a dielectric layer, an insulation layer, a conductor and a capping layer. The substrate has a concave portion. The isolation layer is located on a top surface of the substrate. The dielectric layer is located on the isolation layer. The insulation layer is located on a surface of the concave portion and extends to a sidewall of the isolation layer. The conductor is located on the insulation layer in the concave portion. The conductor has a first top surface and a second top surface, and the first top surface is closer to the dielectric layer than the second top surface. The capping layer is located in the concave portion and covers the conductor.

Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: An electronic apparatus includes a display module and a plurality of metallic elements. The metallic elements at least partially surround at least three sides of the display module to form a metallic frame. The metallic frame is configured to receive a fifth generation (5G) mobile signal, in which adjacent two of the metallic elements have a gap therebetween.

Abstract: An antenna device includes a housing and a printed antenna. The housing includes a front glass shell, a rear glass shell, and a metal bracket. The metal bracket is between the front glass shell and the rear glass shell, and the metal bracket is connected to outer peripheries of the front glass shell and the rear glass shell to form an accommodation space together. The metal bracket includes a first frame portion, a second frame portion, and an opening, and the opening is defined between the first and second frame portions. The printed antenna is arranged in the housing and between the first and second frame portions, and the opening exposes at least a portion of the printed antenna.

Abstract: An electronic device includes a first body, a second body, a hinge, and at least one flexible board. The first body includes a first casing, a panel, and at least one antenna structure. The panel and the at least one antenna structure are disposed in the first casing. The second body includes a second casing, a keyboard, and a radio frequency module. The keyboard and the radio frequency module are disposed in the second casing. The hinge is used to connect the first body and the second body, and the hinge includes a space. The at least one flexible board is coupled to the at least one antenna structure of the first body and the radio frequency module of the second body through the space of the hinge.

Abstract: An antenna device includes a housing and a printed antenna. The housing includes a front glass shell, a rear glass shell, and a metal bracket. The metal bracket is between the front glass shell and the rear glass shell, and the metal bracket is connected to outer peripheries of the front glass shell and the rear glass shell to form an accommodation space together. The metal bracket includes a first frame portion, a second frame portion, and an opening, and the opening is defined between the first and second frame portions. The printed antenna is arranged in the housing and between the first and second frame portions, and the opening exposes at least a portion of the printed antenna.

Abstract: An antenna module includes a grounding plane, a first high-frequency radiator, a second high-frequency radiator, and a low-frequency grounding component. The first high-frequency radiator includes a first feeding portion, a first grounding portion, and a first radiating portion. The first grounding portion is coupled to the grounding plane. The second high-frequency radiator includes a second feeding portion, a second grounding portion, and a second radiating portion. The second grounding portion is coupled to the grounding plane. The low-frequency grounding component located between the first and second high-frequency radiators. The low-frequency grounding component includes a third grounding portion which is coupled to the grounding plane, a first coupling portion, and a second coupling portion. The low-frequency grounding component extends from the third grounding portion and extends in a first direction and a second direction of a first axis respectively to form the first and second coupling portions.

Abstract: An electronic apparatus includes a display module and a plurality of metallic elements. The metallic elements at least partially surround at least three sides of the display module to form a metallic frame. The metallic frame is configured to receive a fifth generation (5G) mobile signal, in which adjacent two of the metallic elements have a gap therebetween.

Abstract: An antenna module includes a grounding plane, a first high-frequency radiator, a second high-frequency radiator, and a low-frequency grounding component. The first high-frequency radiator includes a first feeding portion, a first grounding portion, and a first radiating portion. The first grounding portion is coupled to the grounding plane. The second high-frequency radiator includes a second feeding portion, a second grounding portion, and a second radiating portion. The second grounding portion is coupled to the grounding plane. The low-frequency grounding component located between the first and second high-frequency radiators. The low-frequency grounding component includes a third grounding portion which is coupled to the grounding plane, a first coupling portion, and a second coupling portion. The low-frequency grounding component extends from the third grounding portion and extends in a first direction and a second direction of a first axis respectively to form the first and second coupling portions.

Abstract: A portable electronic device comprises a main body and an antenna. The main body comprises a first casing, a second casing and a hinge. The antenna comprises a first metal layer, a second metal layer and a balun transformer. The first metal layer formed at the first casing has a first bending side edge. The second metal layer formed at the second casing has a second bending side edge. A tapered slot is formed between the second bending side edge and the first bending side edge, and comprises a necking end and a flaring end. The balun transformer disposed in the first casing, the second casing or the hinge has one signal input terminal and two signal output terminals, receives a feed signal and a ground signal via the signal input terminal to generate two balanced signals, and respectively outputs the balanced signals via the signal output terminals.

Abstract: A multi-feed antenna comprises a first antenna component, a second antenna component, a metal board and an isolation assembly. The first antenna component comprises a first signal feed-in terminal and a first free end, with the first signal feed-in terminal configured for receiving a first feed-in signal. The second antenna component comprises a second signal feed-in terminal and a second free end, with the second signal feed-in terminal configured for receiving a second feed-in signal. The metal board comprises a first section, a second section and a third section between the first and second sections. The first section and the first free end define a first gap therebetween, and the second section and the second free end define a second gap therebetween. The isolation assembly is electrically connected with the third section, comprises a ground terminal, and is configured for isolating the first and second feed-in signals.

Abstract: A multi-feed antenna comprises a first antenna component, a second antenna component, a metal board and an isolation assembly. The first antenna component comprises a first signal feed-in terminal and a first free end, with the first signal feed-in terminal configured for receiving a first feed-in signal. The second antenna component comprises a second signal feed-in terminal and a second free end, with the second signal feed-in terminal configured for receiving a second feed-in signal. The metal board comprises a first section, a second section and a third section between the first and second sections. The first section and the first free end define a first gap therebetween, and the second section and the second free end define a second gap therebetween. The isolation assembly is electrically connected with the third section, comprises a ground terminal, and is configured for isolating the first and second feed-in signals.

Abstract: A portable electronic device comprises a main body and an antenna. The main body comprises a first casing, a second casing and a hinge, with the hinge connecting the first casing and the second casing so as to allow the first casing to be flipped relatively to the second casing. The antenna comprises a radiation structure and an excitation circuit. The radiation structure comprises a first metal layer and a second metal layer, with the first metal layer disposed at the first casing, the second metal layer disposed at the second casing, and a slot formed between the first metal layer and the second metal layer. The excitation circuit is disposed in the first casing, and comprising an electromagnetic wave emitting portion configured to emit an electromagnetic wave towards the slot.

Abstract: A portable electronic device comprises a main body and an antenna. The main body comprises a first casing, a second casing and a hinge, with the hinge connecting the first casing and the second casing so as to allow the first casing to be flipped relatively to the second casing. The antenna comprises a radiation structure and an excitation circuit. The radiation structure comprises a first metal layer and a second metal layer, with the first metal layer disposed at the first casing, the second metal layer disposed at the second casing, and a slot formed between the first metal layer and the second metal layer. The excitation circuit is disposed in the first casing, and comprising an electromagnetic wave emitting portion configured to emit an electromagnetic wave towards the slot.

Abstract: A signal input circuit applied to an antenna comprises a balun transformer and a regulation circuit. The balun transformer has one first signal input terminal and two first signal output terminals. The balun transformer receives a feed signal and a ground signal via the first signal input terminal, generates two balanced signals based on the feed signal and the ground signal, and respectively outputs the two balanced signals via the two first signal output terminals. The regulation circuit is configured to adjust the two balanced signals into adjusted signals and has two second signal input terminals and two second signal output terminals, with the two second signal input terminals respectively connected with the two first signal output terminals of the balun transformer, and the two second signal output terminals configured to respectively output the two adjusted signals to an emitting portion of the antenna.

Abstract: A portable electronic device comprises a main body and an antenna. The main body comprises a first casing, a second casing and a hinge. The antenna comprises a first metal layer, a second metal layer and a balun transformer. The first metal layer formed at the first casing has a first bending side edge. The second metal layer formed at the second casing has a second bending side edge. A tapered slot is formed between the second bending side edge and the first bending side edge, and comprises a necking end and a flaring end. The balun transformer disposed in the first casing, the second casing or the hinge has one signal input terminal and two signal output terminals, receives a feed signal and a ground signal via the signal input terminal to generate two balanced signals, and respectively outputs the balanced signals via the signal output terminals.

Abstract: A circuit board includes a dielectric layer, a conductive layer disposed on a surface of the dielectric layer, and an electromagnetic bandgap (EBG) structure disposed in the dielectric layer. The electromagnetic bandgap structure includes a via and a signal suppression board. Two opposite ends of the via are respectively connected to the electrically conductive layer and the signal suppression board respectively. The signal suppression board has at least one hollow pattern.