Patents by Inventor Chih-Chun Chung

Chih-Chun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11578417
    Abstract: A nano-twinned crystal film and a method thereof are disclosed. The method of fabricating a nano-twinned crystal film includes utilizing an electrolyte solution including copper salt, acid, and a water or alcohol-soluble organic additive, and performing electrodeposition, under conditions of a current density of 20˜100 mA/cm2, a voltage of 0.2˜1.0V, and a cathode-anode distance of 10˜300 mm, to form the nano-twinned crystal film on a surface at the cathode. The nano-twinned crystal film formed by the method includes a plurality of nano-twinned copper grains and a region of random crystal phases between some of adjacent nano-twinned copper grains, wherein at least some of the nano-twinned copper grains have a pillar cap configuration with a wide top and a narrow bottom.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: February 14, 2023
    Assignee: DOCTECH LIMITED
    Inventors: Wei-Ting Wang, Shien-Ping Feng, Yu-Ting Huang, Sheng-Jye Cherng, Chih-Chun Chung
  • Publication number: 20210198799
    Abstract: A nano-twinned crystal film and a method thereof are disclosed. The method of fabricating a nano-twinned crystal film includes utilizing an electrolyte solution including copper salt, acid, and a water or alcohol-soluble organic additive, and performing electrodeposition, under conditions of a current density of 20˜100 mA/cm2, a voltage of 0.2˜1.0V, and a cathode-anode distance of 10˜300 mm, to form the nano-twinned crystal film on a surface at the cathode. The nano-twinned crystal film formed by the method includes a plurality of nano-twinned copper grains and a region of random crystal phases between some of adjacent nano-twinned copper grains, wherein at least some of the nano-twinned copper grains have a pillar cap configuration with a wide top and a narrow bottom.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 1, 2021
    Applicant: Doctech limited
    Inventors: Wei-Ting WANG, Shien-Ping FENG, Yu-Ting HUANG, Sheng-Jye CHERNG, Chih-Chun CHUNG
  • Patent number: 7441890
    Abstract: A frame assembly for eyeglasses includes a frame including two rims and two extensions that extend from two ends of the frame. Each extension has two slots. Two connection members each have a board and two lugs that extend from one side of the board. Each lug has a hole defined therethrough. The two lugs of each connection member are inserted into the two slots corresponding thereto. Two temples each have a first slit defined longitudinally in one end thereof so as to define two flexible parts. Each part has a protrusion extending from an outside thereof and the two flexible parts of each temple are located between the two lugs of each connection member and the two protrusions are engaged with the two holes of the two lugs of each connection member.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: October 28, 2008
    Assignee: Hua Yang Manufacturer (ShenZhen)
    Inventor: Chih-Chun Chung
  • Publication number: 20070291221
    Abstract: A frame assembly for eyeglasses includes a frame including two rims and two extensions that extend from two ends of the frame. Each extension has two slots. Two connection members each have a board and two lugs that extend from one side of the board. Each lug has a hole defined therethrough. The two lugs of each connection member are inserted into the two slots corresponding thereto. Two temples each have a first slit defined longitudinally in one end thereof so as to define two flexible parts. Each part has a protrusion extending from an outside thereof and the two flexible parts of each temple are located between the two lugs of each connection member and the two protrusions are engaged with the two holes of the two lugs of each connection member.
    Type: Application
    Filed: December 11, 2006
    Publication date: December 20, 2007
    Inventor: Chih-Chun Chung