Abstract: A method for fabricating semiconductor device includes the steps of: forming fin-shaped structures on a substrate; using isopropyl alcohol (IPA) to perform a rinse process; performing a baking process; and forming a gate oxide layer on the fin-shaped structures. Preferably, a duration of the rinse process is between 15 seconds to 60 seconds, a temperature of the baking process is between 50° C. to 100° C., and a duration of the baking process is between 5 seconds to 120 seconds.

Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Abstract: A centrifugal fan includes a frame and an impeller. The impeller is disposed within the frame. The impeller includes a hub, a first blade group and a second blade group. The hub includes a center part, an inclined part and a connection part. The first blade group is connected with the connection part of the hub. The second blade group is disposed on the inclined part of the hub. There is a first distance between the second blade group and the first blade group. There is a second distance between the second blade group and the center part of the hub.

Abstract: A method of removing a fin structure includes providing a substrate. A fin structure extends from the substrate. A mask layer is disposed on a top surface of the fin structure. An organic dielectric layer covers the substrate, the fin structure and the mask layer. A first etching process is performed to entirely remove the mask layer by taking the organic dielectric layer as a mask. Then a second etching process is performed to remove the fin structure. The first etching process is preferably an anisotropic etching process, and the second etching process is an isotropic etching process.

Abstract: A computing device is provided. The computing device includes a first and second housing. The first housing includes a first and second set of electrical connection ports. The first set of electrical connection ports is positioned at a first location and in a first orientation. The second set of electrical connection ports is positioned at a second location and in a second orientation, which is different from the first set of electrical connection ports. The second housing is fixed within the computing device. The first housing is slidable, with respect to the second housing, within the computing device to enable access to the second set of electrical connection ports.

Abstract: A fin structure for a semiconductor device, such as a FinFET structure, has first and second semiconductor layers and an air gap between the layers. The second semiconductor layer includes a recessed portion, the air gap is located in the recessed portion, and the recessed portion has an upwardly-opening acute angle in the range from about 10° to about 55°. The air gap may prevent current leakage. A FinFET device may be manufactured by first recessing and then epitaxially re-growing a source/drain fin, with the regrowth starting over a tubular air gap.

Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Abstract: A method of removing a fin structure includes providing a substrate. A fin structure extends from the substrate. A mask layer is disposed on a top surface of the fin structure. An organic dielectric layer covers the substrate, the fin structure and the mask layer. A first etching process is performed to entirely remove the mask layer by taking the organic dielectric layer as a mask. Then a second etching process is performed to remove the fin structure. The first etching process is preferably an anisotropic etching process, and the second etching process is an isotropic etching process.

Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Abstract: A fin structure for a semiconductor device, such as a FinFET structure, has first and second semiconductor layers and an air gap between the layers. The second semiconductor layer includes a recessed portion, the air gap is located in the recessed portion, and the recessed portion has an upwardly-opening acute angle in the range from about 10° to about 55°. The air gap may prevent current leakage. A FinFET device may be manufactured by first recessing and then epitaxially re-growing a source/drain fin, with the regrowth starting over a tubular air gap.

Abstract: A centrifugal fan includes a frame and an impeller. The impeller is disposed within the frame. The impeller includes a hub, a first blade group and a second blade group. The hub includes a center part, an inclined part and a connection part. The first blade group is connected with the connection part of the hub. The second blade group is disposed on the inclined part of the hub. There is a first distance between the second blade group and the first blade group. There is a second distance between the second blade group and the center part of the hub.

Abstract: A two-channel magnetic resonance tomography system is provided with a regulation circuit for an amplification system in order to be able to take into account different load situations of the MRI system in a flexible and efficient manner. It is thus possible to improve the MRI measurements greatly if the MRI system is set to the respective load situation beforehand by an idle state measurement. The adaptation may optionally also be carried out during the MRI measurement. Therefore, a multiplicity of completely different load situations may be taken into account in an optimized manner by the regulation circuit.

Abstract: A fin structure for a semiconductor device, such as a FinFET structure, has first and second semiconductor layers and an air gap between the layers. The air gap may prevent current leakage. A FinFET device may be manufactured by first recessing and then epitaxially re-growing a source/drain fin, with the regrowth starting over a tubular air gap.

Abstract: A smart electrochemical processing apparatus includes a reaction container, an electrode unit and a surface feature scanner. The reaction container has an electrolytic tank. The electrode unit has a first electrode fixed to the electrolytic tank and a second electrode rotatably positioned at the electrolytic tank. The surface feature scanner is positioned at the electrolytic tank. Before being put in the electrolytic tank for processing, a workpiece positioned at the second electrode is scanned with the surface feature scanner while being rotated by the second electrode. After surface feature data of the workpiece have been collected, various process parameters can be adjusted to thereby achieve satisfactory surface treatment of the workpiece.

Abstract: A cell separation and culture device having a porous substrate; and a patterned carbon powder layer having a plurality of hollow regions, formed on an upper surface of the porous substrate by a forming manner; wherein the thickness of the patterned carbon powder layer is 0.04-0.08 mm. The cell separation and culture device is able to separate, detect or culture cells with various size and shape. The cell separation and culture device of present invention also simplifies the process of cell separation, detection and culture; therefore, it is accomplished within a very short time.

Abstract: An air compression system includes an air compression device and a cooling structure. The air compression device includes a liquid-cooled motor and a compressor. The cooling includes a radiator, a cooler, a first liquid conveying tube, a second liquid conveying tube, a third liquid conveying tube, a fourth liquid conveying tube and a cooling liquid. The radiator interconnects the compressor for cooling a lubricating liquid in the compressor; the first liquid conveying tube interconnects the radiator and the cooler; the second liquid conveying tube interconnects the radiator and the cooler; the third liquid conveying tube interconnects the liquid-cooled motor and the cooler; the fourth liquid conveying tube interconnects the liquid-cooled motor and the cooler; and the cooling liquid is filled into the cooler, so as to reduce the space occupied by the cooling structure.

Abstract: Various techniques are provided to efficiently implement user designs in programmable logic devices (PLDs). In one example, a computer-implemented method includes determining clock resources in a design identifying operations to be performed by a PLD, determining available clock resources of the PLD, determining a flow network model corresponding to the design and the PLD, and determining a clock resource placement based on the flow network model. The flow network model may include a plurality of levels of vertices disposed between source and sink vertices, where vertices are coupled to each other using edges with unit capacity.

Abstract: A wireless charging device mounting on a mounting hole of furniture, comprises a protection box receiving a wireless charging module, a bolt circle located on the protection box, a fixing plate, an electrical wire. A protruded surface protrudes from a periphery of the protection box, the protruded surface of the protection box is attached with a top surface of the furniture, the fixing plate is connected with the coil bolt through threads. When the wireless charging device is mounted on the furniture, the protection box is mounted in the mounting hole, a dimension of the mounting hole is slightly less than a dimension of the protruded surface, then the fixing plate is rotated to adjust a height of the fixing plate, such that the top surface of the furniture is located between the fixing plate and the protruded surface.

Abstract: Various techniques are provided to efficiently implement user designs in programmable logic devices (PLDs). In one example, a computer-implemented method includes determining clock resources in a design identifying operations to be performed by a PLD, determining available clock resources of the PLD, determining a flow network model corresponding to the design and the PLD, and determining a clock resource placement based on the flow network model. The flow network model may include a plurality of levels of vertices disposed between source and sink vertices, where vertices are coupled to each other using edges with unit capacity.

Abstract: A signal receiving module, adapted to receiving a signal light, includes an optical sheet, at least one light-emitting device, and at least one sensing device. The optical sheet includes a first surface, a second surface, and at least one hole, wherein the second surface is opposite to the first surface, and the at least one light-emitting device is disposed in the at least one hole respectively. The light-emitting device includes a light-emitting unit and a first lens. The first lens is disposed on the light-emitting unit. The optical sheet is located above the sensing device, and the sensing device is distant from the hole, wherein the first lens of the light-emitting device refracts the signal light, and the sensing device receives the refracted signal light. A display apparatus is also provided.