Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a source region and a drain region in a substrate and laterally spaced. A gate stack is over the substrate and between the source region and the drain region. The drain region includes two or more first doped regions having a first doping type in the substrate. The drain region further includes one or more second doped regions in the substrate. The first doped regions have a greater concentration of first doping type dopants than the second doped regions, and each of the second doped regions is disposed laterally between two neighboring first doped regions.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a source region and a drain region in a substrate and laterally spaced. A gate stack is over the substrate and between the source region and the drain region. The drain region includes two or more first doped regions having a first doping type in the substrate. The drain region further includes one or more second doped regions in the substrate. The first doped regions have a greater concentration of first doping type dopants than the second doped regions, and each of the second doped regions is disposed laterally between two neighboring first doped regions.

Abstract: A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.

Abstract: A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.

Abstract: A card connector for electrically coupling a PC card to an electrical device is provided. The card connector comprises a header section having a plurality of terminal pins disposed within the header section. A first and second elongated arm section are integrally coupled with the header section. Each one of the arms extend from a first end to a second end thereby forming a slot which is adapted to receive the PC card and guide the PC card into electrical contact with the terminal pins. A guide housing is securely disposed over said first arm. A push-rod is slidably mounted within the guide housing and adapted to move from a first position to a second position. A post is disposed within the guide housing. A swing arm is pivotally mounted on the push-rod and is adapted to engage and disengage with the post as the push-rod moves from the first position to the second position. A first spring is in communication with said swing arm.

Abstract: An improved cassette loading/unloading device for use with magnetic tape machines is disclosed. It contains a connection member, which includes a first stopper portion extending from a drive plate toward a sliding plate; a second stopper portion mounted on a rear side of the first stopper portion; a connection sheet extending from the sliding plate into a space between the first and second stopper portions; a connection pin penetrating through the first, and second stopper portions and the connection sheet along the path of insertion of the cassette into the magnetic tape unit for relative sliding with the connection sheet; and a buffer spring provided on the connection pin between the second stopper portion and the connection sheet for buffering an impact force when the drive plate pushes the sliding plate.

Abstract: A magnetic tape loading mechanism for a magnetic recording and/or reproducing apparatus is disclosed. The loading mechanism includes a reversible driving motor which can be actuated by signals sent from a positional detector to drive a gear train in order to perform a switching operation of work modes. The gear train includes five actuating gears which are operatively connected to the corresponding members, such as a pair of mounting blocks each having an inclination post and a guide roller provided thereon, a moving post, a tension post and a pinch roller, so that these members can be moved to a predetermined position according to the various time sequences and work modes, to enable the magnetic tape to be led out of a tape cassette located in the apparatus and to be wound around a magnetic head having a magnetic drum, thereby allowing to record or reproduce signals from the magnetic tape.