Patents by Inventor Chih-Fang Wang

Chih-Fang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Arcuate display device
    Patent number: 12008935
    Abstract: An arcuate display device includes a plurality of display units each having has a plurality of pixels, a virtual axis, and a plurality of driving devices. Each pixel includes first, second, and third light-emitting elements respectively disposed at first, second, and third positions. The driving devices corresponding to the display units having the same minimum distance from the virtual axis have the same circuit layout design. The first, second, and third positions are sequentially arranged in a direction away from the virtual axis. Optical properties of the first light-emitting elements and the third light-emitting elements in at least a part of the pixels disposed at a first side of the virtual axis are respectively substantially the same as optical properties of the third light-emitting elements and the first light-emitting elements in at least a part of the pixels disposed at a second side of the virtual axis.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: June 11, 2024
    Assignee: AUO Corporation
    Inventors: Kai-Yi Lu, Hung-Chi Wang, Chen-Yu Lin, Ya-Fang Chen, Chih-Hsiang Yang
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11887967
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220028836
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei WU, Chien-Yuan TSENG, Meng-Jen WANG, Chen-Tsung CHANG, Chih-Fang WANG, Cheng-Han LI, Chien-Hao CHEN, An-Chi TSAO, Per-Ju CHAO
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11139274
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: October 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200251449
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 6, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao