Abstract: A 3D memory array in which epitaxial source/drain regions which are horizontally merged and vertically unmerged are used as source lines and bit lines and methods of forming the same are disclosed. In an embodiment, a memory array includes a first channel region over a semiconductor substrate; a first epitaxial region electrically coupled to the first channel region; a second epitaxial region directly over the first epitaxial region in a direction perpendicular to a major surface of the semiconductor substrate; a dielectric material between the first epitaxial region and the second epitaxial region, the second epitaxial region being isolated from the first epitaxial region by the dielectric material; a gate dielectric surrounding the first channel region; and a gate electrode surrounding the gate dielectric.

Abstract: Manufacturing of a shoe is enhanced by creating 3-D models of shoe parts. For example, a laser beam may be projected onto a shoe-part surface, such that a projected laser line appears on the shoe part. An image of the projected laser line may be analyzed to determine coordinate information, which may be converted into geometric coordinate values usable to create a 3-D model of the shoe part. Once a 3-D model is known and is converted to a coordinate system recognized by shoe-manufacturing tools, certain manufacturing steps may be automated.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: A memory cell includes a transistor over a semiconductor substrate. The transistor includes a ferroelectric layer arranged along a sidewall of a word line. The ferroelectric layer includes a species with valence of 5, valence of 7, or a combination thereof. An oxide semiconductor layer is electrically coupled to a source line and a bit line. The ferroelectric layer is disposed between the oxide semiconductor layer and the word line.

Abstract: Electrostatic discharge (ESD) structures are provided. An ESD structure includes a semiconductor substrate, a first epitaxy region with a first type of conductivity over the semiconductor substrate, a second epitaxy region with a second type of conductivity over the semiconductor substrate, and a plurality of semiconductor layers. The semiconductor layers are stacked over the semiconductor substrate and between the first and second epitaxy regions. A first conductive feature is formed over the first epitaxy region and outside an oxide diffusion region. A second conductive feature is formed over the second epitaxy region and outside the oxide diffusion region. A third conductive feature is formed over the first epitaxy region and within the oxide diffusion region. A fourth conductive feature is formed over the second epitaxy region and within the oxide diffusion region. The oxide diffusion region is disposed between the first and second conductive features.

Abstract: A memory cell includes a read word line extending in a first direction, a write transistor, and a read transistor coupled to the write transistor. The read transistor includes a ferroelectric layer, a drain terminal of the read transistor directly connected to the read word line, and a source terminal of the read transistor coupled to a first node. The write transistor is configured to adjust a polarization state of the read transistor, the polarization state corresponding to a stored data value of the memory cell.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first metal layer over a substrate, forming a dielectric layer over the first metal layer. The method includes forming a trench in the dielectric layer, and performing a surface treatment process on a sidewall surface of the trench to form a hydrophobic layer. The hydrophobic layer is formed on a sidewall surface of the dielectric layer. The method further includes depositing a metal material in the trench and over the hydrophobic layer to form a via structure.

Abstract: The present disclosure provides a semiconductor device and a method for forming a semiconductor device. The semiconductor device includes a substrate, and a first gate dielectric stack over the substrate, wherein the first gate dielectric stack includes a first ferroelectric layer, and a first dielectric layer coupled to the first ferroelectric layer, wherein the first ferroelectric layer includes a first portion made of a ferroelectric material in orthorhombic phase, a second portion made of the ferroelectric material in monoclinic phase, and a third portion made of the ferroelectric material in tetragonal phase, wherein a total volume of the second portion is greater than a total volume of the first portion, and the total volume of the first portion is greater than a total volume of the third portion.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A support frame includes first and second mounting members, and an adjusting member. The second mounting member defines a groove. One groove wall of the groove defines a plurality of positioning holes. The adjusting member includes a base body, a sliding member, and an elastic member. The base body is disposed on the first mounting member, and at least a part of the base body is accommodated in the groove. The sliding member is slidably disposed on the base body and includes a clamping body. The elastic member is disposed on the sliding member, and the elastic member can drive the sliding member to engage the clamping body with one of the plurality of positioning holes. When the support frame is in a cabinet, an interior installation size of the cabinet is adjustable for any particular relative position between the first and second mounting members.

Abstract: A loop antenna which has a signal input/output wire, a first conductor, an upper conductor, an upper conductor, a second conductor, a first lower conductor, and a second lower conductor sequentially connected. The loop antenna further has a first grounding via, and a lower end of the first grounding via is connected to a first grounding layer, and an upper end of the first grounding via is disposed between and connecting the first lower conductor and the second lower conductor, wherein a first end of the second lower conductor is connected to the upper end of the first grounding via, and a second end of the second lower conductor is connected to the first conductor. A second grounding layer and the combination of the signal input/output wire, the first lower conductor, and the second lower conductor are disposed on the same layer disconnectedly.

Abstract: A loop antenna which has a signal input/output wire, a first conductor, an upper conductor, an upper conductor, a second conductor, a first lower conductor, and a second lower conductor sequentially connected. The loop antenna further has a first grounding via, and a lower end of the first grounding via is connected to a first grounding layer, and an upper end of the first grounding via is disposed between and connecting the first lower conductor and the second lower conductor, wherein a first end of the second lower conductor is connected to the upper end of the first grounding via, and a second end of the second lower conductor is connected to the first conductor. A second grounding layer and the combination of the signal input/output wire, the first lower conductor, and the second lower conductor are disposed on the same layer disconnectedly.

Abstract: A support frame includes first and second mounting members, and an adjusting member. The second mounting member defines a groove. One groove wall of the groove defines a plurality of positioning holes. The adjusting member includes a base body, a sliding member, and an elastic member. The base body is disposed on the first mounting member, and at least a part of the base body is accommodated in the groove. The sliding member is slidably disposed on the base body and includes a clamping body. The elastic member is disposed on the sliding member, and the elastic member can drive the sliding member to engage the clamping body with one of the plurality of positioning holes. When the support frame is in a cabinet, an interior installation size of the cabinet is adjustable for any particular relative position between the first and second mounting members.

Abstract: A transportation apparatus includes a delivering device, an elevating unit and a loading device. The delivering device is horizontally movable. The elevating unit is disposed under and mounted to the delivering device, and is vertically extendable and contractible relative to the delivering device. The loading device is adapted for loading and unloading an object, and includes a moving unit and a fork unit. The moving unit includes a moving base horizontally movable along a lower first axis parallel to a first direction relative to the elevating unit. The fork unit includes two fork prongs being horizontally spaced apart from each other along a second direction which is transverse to the first direction.

Abstract: A support stand includes a fixing base, a support leg penetrating through the fixing base, a housing assembly accommodating the fixing base, a first gear rotationally sleeved on the support leg and resisting against the fixing base, and a second gear rotationally mounted between the housing assembly and the fixing base. The first gear is meshed with the second gear. The second gear is provided with an operating portion for rotating the second gear and driving the first gear to rotate, so as to make the first gear move on the support leg and drive the fixing base to move on the support leg.

Abstract: A structure of reduced profile to render crushproof a cabinet with the structure can be installed in an opening of the cabinet. The structure includes a first frame and a reinforcing portion. Two ends of the reinforcing portion are both connected to the first frame, so that the reinforcing portion is received in the first frame. The crush-proofing structure is movably connected to the opening of the cabinet.

Abstract: A mechanical parking garage includes a plurality of pallets, a parking system including a rail track unit and a plurality of tower units, and a transporting system. Each tower unit is mounted on and slidable along the rail track unit, and has a plurality of first parking spaces, each of which is disposed for storing one of the pallets. The transporting system includes a rail mechanism mounted above the parking system, and a transporting mechanism mounted to the rail mechanism and being horizontally movable. Any adjacent two of the tower units are movable relative to each other between approximate state and a distal state. At the distal state, the adjacent two of the tower units define a transporting aisle therebetween.

Abstract: An adjustable hinge assembly includes a first hinge leaf, a second hinge leaf hinge-coupled to the first hinge leaf, and a hinge pin. The first hinge leaf defines a first knuckle hole corresponding to the hinge pin, and the second hinge leaf defines a second knuckle hole corresponding to the hinge pin. The first hinge leaf is hinge-coupled to the second hinge leaf by the hinge pin, the first knuckle hole, and the second knuckle hole. The hinge pin is movable within the first knuckle hole to adjust a position of the first hinge leaf relative to the second hinge leaf.

Abstract: A transportation apparatus includes a delivering device, an elevating unit and a loading device. The delivering device is horizontally movable. The elevating unit is disposed under and mounted to the delivering device, and is vertically extendable and contractible relative to the delivering device. The loading device is adapted for loading and unloading an object, and includes a moving unit and a fork unit. The moving unit includes a moving base horizontally movable along a lower first axis parallel to a first direction relative to the elevating unit. The fork unit includes two fork prongs being horizontally spaced apart from each other along a second direction which is transverse to the first direction.

Abstract: An elevating device includes an upper connecting seat, a lower connecting seat, at least one scissors unit, and a hoist. The lower connecting seat is vertically movable relative to the upper connecting seat between an upper position and a lower position. The at least one scissors unit interconnects the upper connecting seat and the lower connecting seat. The hoist is operable to release a rope to thereby move the lower connecting seat to the lower position and convert the at least one scissors unit to the expanded state, and is further operable to retract the rope to thereby move the lower connecting seat to the upper position and convert the at least one scissors unit to the contracted state.