Patents by Inventor Chih-Feng CHAO

Chih-Feng CHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186414
    Abstract: The present disclosure relates to a semiconductor device includes a substrate and first and second spacers on the substrate. The semiconductor device includes a gate stack between the first and second spacers. The gate stack includes a gate dielectric layer having a first portion formed on the substrate and a second portion formed on the first and second spacers. The first portion includes a crystalline material and the second portion comprises an amorphous material. The gate stack further includes a gate electrode on the first and second portions of the gate dielectric layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: June 6, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Ming LIN, Sai-Hooi YEONG, Ziwei FANG, Bo-Feng YOUNG, Chi On CHUI, Chih-Yu CHANG, Huang-Lin CHAO
  • Publication number: 20240169615
    Abstract: An electronic device and a non-transitory computer-readable storage medium are provided. The electronic device includes a storage module and a processing module. The storage module is configured to store at least one program instruction. The processing module is coupled to the storage module, and is configured to load the at least one program instruction to perform the following steps: parsing a plurality of cells in an analysis area in a data sheet to identify each of the cells as a formula cell or a non-formula cell; classifying the formula cells so that the formula cells having similar formula expressions fall into the same formula group; analyzing a formula structure of the formula expressions of each formula group to output at least one recommended chart option.
    Type: Application
    Filed: April 3, 2023
    Publication date: May 23, 2024
    Applicant: POTIX CORPORATION
    Inventors: Chih-Heng Chen, Jen-Feng Chao, Wenning Hsu, Ming-Shia Yeh
  • Patent number: 9479855
    Abstract: A headphone ear cup includes a composite cushion and a cover wrapping around the composite cushion. The composite cushion has an annular body and an air-permeable portion arranged at the outer periphery of the annular body. The air-permeable portion is made of a porous material having a porosity higher than that of the annular body. Because the annular body made of the material having relatively high density can maintain the sound output performance of the earphones, and the air-permeable portion made of the porous material having relatively low density can provide better heat dissipation effect, the headphone ear cup has excellent air-permeable property and improved acoustic field effect.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: October 25, 2016
    Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Chung-Yi Huang, Chih-Feng Chao, Yu-Jen Cho
  • Patent number: 9438980
    Abstract: A headphone ear cup for mounting on a surface of a speaker unit of a headphone includes an annular cushion having a sound hole at a center thereof, and a composite cover having a ventilative layer and an air-tight layer. The composite cover wraps around the annular cushion and defines an inner-side portion, an outer-side portion and an ear-abutting portion. The ventilative and air-tight layers are respectively formed by the outer-side portion and a composite of the inner-side and ear-abutting portions or by a composite of the outer-side and ear-abutting portions and the inner-side portion. Therefore, the ventilative layer and the annular cushion form a good heat dissipation path to have excellent air-permeable property, and air-tight layer provides an improved acoustic field effect.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: September 6, 2016
    Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Chung-Yi Huang, Chih-Feng Chao, Yu-Jen Cho
  • Publication number: 20160150306
    Abstract: A headphone ear cup includes a composite cushion and a cover wrapping around the composite cushion. The composite cushion has an annular body and an air-permeable portion arranged at the outer periphery of the annular body. The air-permeable portion is made of a porous material having a porosity higher than that of the annular body. Because the annular body made of the material having relatively high density can maintain the sound output performance of the earphones, and the air-permeable portion made of the porous material having relatively low density can provide better heat dissipation effect, the headphone ear cup has excellent air-permeable property and improved acoustic field effect.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 26, 2016
    Inventors: Chung-Yi HUANG, Chih-Feng CHAO, Yu-Jen CHO
  • Publication number: 20160150307
    Abstract: A headphone ear cup for mounting on a surface of a speaker unit of a headphone includes an annular cushion having a sound hole at a center thereof, and a composite cover having a ventilative layer and an air-tight layer. The composite cover wraps around the annular cushion and defines an inner-side portion, an outer-side portion and an ear-abutting portion. The ventilative and air-tight layers are respectively formed by the outer-side portion and a composite of the inner-side and ear-abutting portions or by a composite of the outer-side and ear-abutting portions and the inner-side portion. Therefore, the ventilative layer and the annular cushion form a good heat dissipation path to have excellent air-permeable property, and air-tight layer provides an improved acoustic field effect.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 26, 2016
    Inventors: Chung-Yi HUANG, Chih-Feng CHAO, Yu-Jen CHO
  • Publication number: 20120065478
    Abstract: The present invention discloses an interactive biosensing device and a method thereof. The interactive biosensing device is arranged on a living body and comprises a physiological detection module detecting physiological signals of the living body; a physical sensation module triggering at least one physical device according to control instructions; a first wireless transmission module receiving control instructions or sends out physiological signals; a storage module storing physiological signals and control instructions; a video module capturing images of the living body; a control module processing physiological signals and control instructions and controlling operations of the video module; and a display unit presenting the images captured by the video module.
    Type: Application
    Filed: January 11, 2011
    Publication date: March 15, 2012
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: BOR-SHYH LIN, CHIN-TENG LIN, CHIH-FENG CHAO, SHAO-HANG HUNG, I-JAN WANG
  • Publication number: 20090259138
    Abstract: The present invention discloses an automatic bio-signal supervising system for medical care. The automatic bio-signal supervising system utilizes a head-mounted bio-signal acquisition device, wore upon the user's head, to acquire the bio-signals, convert them into the digital bio-signals, and transmit the digital bio-signals to a signal analysis processor to perform analysis process. And the automatic bio-signal supervising system delivers a corresponding control signal to the environment control equipment based on the result of analysis, and control the environment condition to achieve the remote supervising and medical care purpose. Furthermore, the signal analysis processor in the present invention further provides a real-time warning signal or a health index, which supervise the personal biological information to avoid the unpredictable situation.
    Type: Application
    Filed: April 15, 2009
    Publication date: October 15, 2009
    Inventors: Chin-Teng LIN, Jen-Feng CHUNG, Li-Wei KO, I-Ling TSAI, Che-Jui CHANG, Chih-Feng CHAO